COBO/OIF Board Member Jeff Hutchins discusses the industry's Co-Packaged Optics (CPO) collaboration with regards to the OIF's recently launched 3.2T Co-packaged Optics Module Project.
OIF begins 3.2T Co-Packaged Module Project for data center switching
OIF started a 3.2T Co-Packaged Module project for intra data center switching applications. The 3.2T Co-Packaged Optical Module Implementation Agreement (IA) is the first project initiated under the umbrella of the Co-Packaged Framework Project announced in November 2020. The IA will define a 3.2T co-packaged optical module that targets Ethernet switching applications utilizing 100G electrical lanes. It will include the following interoperability specifications:
- Optical interface options supporting 400GBASE-FR4 and 400GBASE-DR4 with backwards compatible to 200G interfaces
- CEI-112G-XSR high speed electrical interfaces
- Electrical, mechanical, and management interfaces
“This 3.2T Co-Packaging project builds on OIF’s 20+ year successful track record to anticipate and address the industry’s needs,” said Jeff Hutchins, Ranovus and OIF Physical and Link Layer Working Group, Co-Packaging Vice Chair. “With its broad membership from across the eco-system, OIF is well positioned to create unified host, module and control specifications.”
“The industry has clearly articulated the need for a standardized co-packaged solution to address data center power constraints, and further, to enable new network architectures and applications,” said Mark Filer, Microsoft Principal Hardware Engineer and OIF Board Member. “The 3.2T Co-Packaged Optical Module project is a concrete step toward that goal, and OIF is uniquely qualified to rapidly execute on the implementation agreement in order to meet the market needs.”
