Intel partners with AMD on Embedded Multi-Die Interconnect Bridge for GPUs

Intel announced a partnership with AMD to tie together its high-performance processors with discrete graphics processors using the Intel Embedded Multi-Die Interconnect Bridge (EMIB) technology along with a new power-sharing framework.
The goal is to reduce the usual silicon footprint to less than half that of standard discrete components on a motherboard.

The first implementation matches the new 8th Gen Intel Core Core H-series processor, second generation High Bandwidth Memory (HBM2) and a custom-to-Intel third-party discrete graphics chip from AMD’s Radeon Technologies Group – all in a single processor package.

“Our collaboration with Intel expands the installed base for AMD Radeon GPUs and brings to market a differentiated solution for high-performance graphics,” said Scott Herkelman, vice president and general manager, AMD Radeon Technologies Group. “Together we are offering gamers and content creators the opportunity to have a thinner-and-lighter PC capable of delivering discrete performance-tier graphics experiences in AAA games and content creation applications. This new semi-custom GPU puts the performance and capabilities of Radeon graphics into the hands of an expanded set of enthusiasts who want the best visual experience possible.”