Aricent has released its Network-Proven Telecom Signaling Platform on several high-density Signal System 7 (SS7) plug-in modules from Interphase. The collaboration to provide pre-integrated solutions creates an off-the-shelf signaling solution for Network and Telecommunications Original Equipment Manufacturers (OEMs).
Interphase's portfolio includes appliances, blades and modules in various form-factors for interworking, connectivity and packet processing, in addition to engineering design and contract manufacturing services. The SS7 product line -- based on signaling-optimized iSPAN hardware platforms and the Interphase iWARE Software Development Suite (SDS) -- is now powered by Aricent's software including high-level protocol stacks, application software and rapid application development tools. Interphase SS7 iSPAN modules support the standard telecom server form-factors, including PCI/PCI-X, PCI Express (PCIe), low-profile PCIe cards for rack-mount systems, and AdvancedMC (AMC) modules for AdvancedTCA (ATCA) and MicroTCA (µTCA) systems. These high-density solutions are available with 4 or 8 T1/E1/J1 ports and support up to 248 Low Speed Links or 8 High Speed Links.
Aricent's Signaling Software Platform offers an application programming interface (API) that can be quickly integrated with customer applications. It offers simultaneous support for SS7 and SIGTRAN over Windows, Linux and Solaris platforms. Aricent's Signaling platform incorporates SS7 and SIGTRAN protocol stacks, which have been deployed by nearly 150 customers globally. The solution has enabled a broad array of Telecom nodes such as SMS Router/Gateways, Signaling Gateways, Home Location Registers (HLR), Equipment Identity Registers (EIR) and a full complement of Value Added Service (VAS) applications -- such as Messaging, Missed Call Alert applications, Roaming solutions, Unstructured Supplementary Services, Location Based Services and Ring Back Tone (RBT) services.
http://www.aricent.com
http://www.interphase.com
Thursday, April 15, 2010
Aricent Signaling Software Platform to Power Interphase High-Density SS7 Cards
Thursday, April 15, 2010
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