Samsung Electronics Cohas completed development of a CMOS image sensor with 5 megapixel (2,608 x 1,952 pixels) QSXGA resolution. The device performs at the same level as its charge-coupled device (CCD) counterpart, yet it operates on less power and is more price competitive. Samsung said that by using 0.13-micron process technology it increased the fill factor (the image sensor's measurement of light sensitivity) by over 50%. Samsung has also completed development of a 3.2M-pixel CIS for camera phones. Samsung plans to begin mass-production of the 5M-pixel CIS in Q4 2005 and the 3.2M-pixel CIS with an embedded image signal processor (ISP) by the first half of 2006. http://www.samsung.com