SiGe Semiconductor announced a product roadmap to build chip-scale RF front-end modules for multi-mode, dual-band Wi-Fi systems, and cellular handsets compliant to the GSM, CDMA, CDMA2000, GPRS and EDGE standards. Using its silicon germanium technology, the Ottawa-based company plans to build the world's smallest GSM RF front-end, and the industry's highest performance module for dual-band, multi-mode 802.11a/b/g WLAN systems. The roadmap also includes chip-scale solutions for 802.11b/g WLAN systems, quad-band CDMA handsets, and dual-mode GSM/WCDMA and GSM/CDMA2000 handsets. The front-end modules will integrate all of the RF circuitry required between the transceiver and the antenna, including the power amplifiers, power detectors, filters, switches, matching and bias components. http://www.sige.com