#ECOC23: Orange tests quantum over optical with Adtran

Adtran and Orange are collaborating on a lab trial of quantum key distribution (QKD) technology over an optical network.  

The trial featured Adtran’s FSP 3000 with OpenFabric technology for efficient encryption key distribution and optimized link performance. Leveraging a coherent 400Gbit/s DP-16QAM channel, the platform transported a QKD-secured data stream across two trusted nodes and three links, spanning 184km of standard, single-mode dark fiber. 

Both the Layer 1 encryption and hybrid key exchange used in the trial are enabled by Adva Network Security’s ConnectGuard solution.

The companies said one of the trial’s key achievements was overcoming data loss and distance constraints while transporting significant volumes of quantum-secure data alongside the quantum channel. The trial introduced a hybrid key exchange, blending classical asymmetric methods with QKD, creating a robust dual layer of security. While classical key exchange ensures immediate data protection in line with current cryptographic standards and governmental approval, QKD offers future-proof security, resilient against future computational advancements. 

“As we navigate the opportunities and challenges that quantum computing presents, it’s clear we’re at the beginning of a new era in network security. Our successful lab trial with Adtran highlights the magnitude of industry collaboration required to harness the full potential of quantum technology and secure our digital future,” said Gilles Bourdon, VP of wireline networks and infrastructure at Orange. “The synergy between Adtran’s FSP 3000 open optical transport technology, Adva Network Security’s ConnectGuard encryption, Toshiba’s latest QKD systems, and our expertise in network integration sets a formidable benchmark for quantum-resistant communications across Europe.”

“By utilizing a QKD trusted-node configuration provided by our technical partner Toshiba Europe/Japan, we’re showcasing some of the practical applicability of this technology in today’s networks. At Adtran, we’ve always been at the forefront of quantum security advancements, consistently applying the latest developments in QKD and post-quantum cryptography. This trial further underscores our dedication to pushing boundaries in this field,” commented Christoph Glingener, CTO of Adtran. “We’ve also always been committed to championing interoperability, promoting and contributing to open standards, such as the ETSI interface for QKD key delivery. Our latest collaboration with Orange emphasizes that an open, cooperative approach in the design and implementation of QKD solutions is indispensable to propel this vital technology at the speed we all require. Together, we’re setting the stage for a future where our data remains secure, irrespective of the challenges coming over the horizon.”

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#ECOC23: Source Photonics intros 800Gbps SR transceivers and active cables

Source Photonics announced the availability of 800Gbps short reach multimode (MMF) transceivers and active cables for AI cluster connectivity. The devices are powered by the latest 5nm DSP technology and Linear Direct Drive implementation.

The 800G OSFP and 400G QSFP112 optical transceivers, active optical cables and active copper cables are fine engineered to exceed both the standard 800GbE and InfiniBand NDR performance requirements. 

The new offerings enable the datacenter connectivity speeds scaling to 800Gbps faster, using conventional cost-effective VCSEL technology while accelerating time-to-market deployment of plug-and-play pluggable optics.

“Source Photonics’ global engineering and manufacturing footprints have been helping our current customers massively deploy robust 400G network infrastructures worldwide with our market leading single mode transceiver products empowered by in-house EML lasers. Our continuous efforts working with industry partners to reduce the Cost-per-Gigabit and Power-per-Gigabit will lead AI/ML cluster connectivity more affordable and less power cost in operation”, said John Wang, CEO of Source Photonics, “The introduction of 800G short reach optics and cables covers well the 1m to 100m connectivity needs, and will significantly improve our customers’ time-to-market AI/ML clusters deployment.”

 www.sourcephotonics.com

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#ECOC23:ColorChip demoes 800G DSP and Linear Drive

ColorChip is demonstration 800G based on DSP, including additional 800G Single-Mode (SM) and Multi-Mode (MM) product lines, as well as its internally developed SystemOnGlass technology.

ColorChip is also showcasing its collaborative effort with leading silicon suppliers to release 800G LPO based transceivers consuming 4W (MM) and 7W (SM).

In addition, ColorChip Group said it is in advanced stages of developing an interposer platform solution that enables standardized Co-Packaged Optics (CPO) solutions. The interposer utilizes its SystemOnGlass technology, thus lowering power consumption and minimizing optical loss.

ColorChip has established a new Sales Organization in North America, led by CEO Yigal Ezra and VP Bryan Hall, along with Sr. Director of PLM Sharon Wang, Ph.D.

https://www.color-chip.com 

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#ECOC23: AEPONYX shows Waveguide Isolator for PIC integration

 AEPONYX is showcasing its isolator waveguide (IWG) technology that guarantees precise alignment without the need for complex and costly lens alignments.

AEPONYX is also displaying its Silicon Nitride (SiN) based telecom and datacom product lines alongside its Tunable Optical Filtering/Switching (TOF/S) platform and Resource Optical Configuration System.

“AEPONYX is excited to return to ECOC and present the advances we have made in our hybrid integration platform. These advances now allow AEPONYX to release a new disruptive technology: the isolator waveguide (IWG). Bulky optical isolators are now a thing of the past!" explained Philippe Babin, the Chief Executive Officer of AEPONYX.

AEPONYX is based in Montreal, Quebec, Canada.

https://www.aeponyx.com

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Intel to spin out Programmable Solutions Group under Sandra Rivera

Intel will separate its Programmable Solutions Group (PSG) operations into a standalone business effective 01-January-2024. The independent business will be headed by Sandra Rivera, who currently heads Intel’s Data Center and AI Group (DCAI. Shannon Poulin has been named chief operating officer (COO) of PSG.

Intel said it will consider inviting minority investors in the independent PSG business while contemplating an eventual IPO for the new firm.

The two companies will remain strategically aligned, including continuing PSG’s relationship with Intel Foundry Services (IFS), as they work together to address key areas of the FPGA market. Building on PSG’s highly successful Supply Resilience program pilot, the relationship with IFS will also uniquely enable PSG to give customers greater predictability of supply aligned to their needs, ensuring a more resilient supply chain.

“Our intention to establish PSG as a standalone business and pursue an IPO is another example of how we are consistently unlocking more value for our stakeholders. This will give PSG the independence it needs to keep growing share in the FPGA market, differentiating itself with capacity and supply resilience from IFS, and allowing Intel product teams to focus on our core business and long-term strategy,” said Intel CEO Pat Gelsinger. “Sandra has proven herself by reinvigorating DCAI, placing it on a path for success. I am confident she will bring PSG that same dedication, energy and customer commitment.”

“This is an incredibly exciting day for me and the PSG team. Reestablishing PSG as a standalone business will enable us to unleash our full potential as we drive for leadership in this demanding and essential part of the semiconductor industry,” said Rivera. “Our strategic relationship with Intel will continue to be an advantage as it gives us maximum flexibility in how we address fast-growing markets like automotive and data center and communications.”

• In 2016, Intel acquired Altera, a specialist in FPGAs, for $16.7 billion.

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Broadcom debuts 200G/lane PAM-4 DSP PHY

Broadcom announced shipping of its 5nm 200G/lane optical PAM-4 DSP PHY featuring 200G/lane serial optical interfaces, which enable 800G and 1.6T pluggable optical transceiver modules.

The new Sian BCM85822 is optimized for the 1.6T OSFP-XD transceiver module design and would effectively enable 51.2T switching capacity in a 1RU rack to improve bandwidth density in hyperscale data centers. Further, the adoption of 200G/lane optical interfaces lays the foundation for the eventual deployment of 1.6T and 3.2T solutions with 200G/lane electrical interfaces, which are needed for cloud providers to support next generation switches and scale AI workloads.

Highlights

• Monolithic 5nm 800G (8:4) PAM-4 DSP with integrated laser driver
• Delivers best-in-class module performance in BER and power consumption
• Proven interoperability with Broadcom’s 200G EML
• Compliant to all IEEE and OIF standards, capable of supporting MR links on the chip to module electrical interface
• Supports optical modules from 800G to 1.6T
• Supports IEEE compliant (128,120) Hamming Inner Code

“This latest generation of DSP operating at 200G/lane extends Broadcom’s leadership in high-bandwidth PHY and enables the lowest power optical modules in the industry,” said Vijay Janapaty, vice president and general manager of the Physical Layer Products Division at Broadcom. “This, in turn, lays the foundation for next generation switching platforms for AI/ML clusters and networks.”

https://www.broadcom.com/blog/200g-lane-optical-solutions-drive-next-generation-networks

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#ECOC23: DustPhotonics unveils 800G Silicon Photonics chip

DustPhotonics introduced a single-chip 800G PIC (Photonic Integrated Circuit) for DR8 and DR8+ applications, providing 8 optical channels independently modulated at 100Gb/s for an aggregate bandwidth of 800Gb/s. 

The chip is designed into a compact 7.5mm x 7mm package, enabling it to be used in industry standard QSFP and OSFP style form factors.  The PIC includes on-chip lasers, incorporating DustPhotonics' patented L3C (low-loss laser coupling) technology, whereby off-the-shelf lasers from a variety of different manufacturers can be integrated with the PIC.

The device is suitable for reaches up to 2km in applications including hyperscale data centers and AI and Machine-Learning clusters.

At ECOC,, DustPhotonics is demonstrating this device in multiple configurations including a traditional 800GBASE-DR8 application, an immersion cooling application, and a reduced reach application. The immersion cooling demo showcases how this chip is suited to be immersed in a liquid coolant, since there is no free-space interface between the laser and PIC or at the fiber attach interface at the optical output of the chip.

For the reduced reach application, DustPhotonics is demonstrating a second, cost optimized version of the product suitable for transceivers or AOCs (Active Optical Cables) up to 100m, or for LPO (linear-drive pluggable optic) applications.

"We are seeing a lot of customer traction for this 800G application, and we are excited to showcase the broad range of applications that we support," said Ronnen Lovinger, CEO of DustPhotonics. "We are well-positioned for the next phase of the company which is to scale into high-volume manufacturing."

The device is sampling to customers today and is expected to be in production by the first quarter of 2024. 

www.dustphotonics.com

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#ECOC23: Avicena demos microLED transceiver in 16nm finFET CMOS

At this week's ECOC in Glasgow, Avicena is demonstrating its LightBundle multi-Tbps chip-to-chip interconnect technology.

Currently, high-bandwidth memory (HBM) modules must be co-packaged with GPUs because the GPU-memory electrical interconnect is limited to just a few millimeters in length. Conventional optical interconnects based on VCSELs or Silicon Photonics (SiPh) promise to extend the interconnect reach. However, they are challenged by the power, bandwidth density, latency, and cost requirements. 

Avicena says its microLED-based LightBundle interconnects provide much lower power and latency, much higher bandwidth density, and can achieve very low costs.

The LightBundle interconnect architecture is based on arrays of GaN microLEDs that leverage the microLED display ecosystem and can be integrated directly onto high performance CMOS ICs. Each microLED array is connected via a multi-core fiber cable to a matching array of CMOS-compatible PDs.

“As generative AI continues to evolve, the role of high bandwidth-density, low-power and low latency interconnects between xPUs and HBM modules cannot be overstated”, says Chris Pfistner, VP Sales & Marketing of Avicena. “Avicena’s innovative LightBundle interconnects have the potential to fundamentally change the way processors connect to each other and to memory because their inherent parallelism is well-matched to the internal wide and slow bus architecture within ICs. With a roadmap to multi-terabit per second capacity and sub-pJ/bit efficiency these interconnects are poised to enable the next era of AI innovation, paving the way for even more capable models and a wide range of AI applications that will shape the future.”

“We have previously demonstrated microLEDs transmitting at > 10Gbps per lane and a test ASIC in a 130nm CMOS process running 32 lanes at less than 1pJ/bit,” says Bardia Pezeshki, founder and CEO of Avicena. “Now we are bringing up our first ASIC in a 16nm finFET process with over 300 lanes and an aggregate bandwidth of over 1Tbps bi-directional at 4Gbps per lane. The ASIC measures less than 12mm2 and contains the circuitry for the optical Tx and Rx arrays, as well as a high-speed parallel electrical interface and various DFT/DFM functions like BERT, loopbacks, and Open Eye Monitoring (OEM). All key ASIC functionality has been verified and we are currently working on yield improvements for manufacturing scalability.”

Avicena plans to advance its LightBundle platform to enable interconnects with high-bandwidth density of multi-Tbps per mm2 in advanced CMOS process nodes. The low power, high density, and low latency of LightBundle is well matched to chiplet interfaces like UCIe, OpenHBI, and BoW, and can also be used to enhance system architectures that are limited by the reach of existing compute interconnects like PCIe/CXL, and HBM/DDR/GDDR memory links.

https://avicena.tech

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#ECOC23: Lumentum intros InP-Based 130+ GBaud Smart TROSA, 800G ZR

At this week's ECOC in Glasgow, Lumentum is showcasing its latest solutions, including:

• 800G ZR+ and 0dBm 400G ZR+ Transceivers: Lumentum 800G ZR+ and 0dBm 400G ZR+ compact transceivers, which are crucial components for connecting data centers, enable IP over DWDM by directly plugging into switches and routers. These transceivers, available in QSFP-DD and OSFP form factors and utilizing Lumentum's new 130+ GBaud Smart TROSA, offer high output power and extended reach for metro and regional networks. Sampling of the transceivers will begin in December 2023, with official release expected in calendar year 2024.
  
  
  
• InP-based 130+ GBaud Smart Transmitter Receiver Optical Sub-Assembly (TROSA): This advanced optical component enables data rates of up to 800Gbps on a single wavelength, allowing for a seamless transition to faster network architectures that can support increasing data traffic from emerging AI and ML applications. Lumentum will showcase this innovative technology within the Lumentum 800G ZR+ demo at their stand. This product is available for sampling now, complementing the nano-iTLA, CDM and ICR optical components that are already available and are currently being operated by multiple customers at up to 150 Gbaud.
• M11 Series, Uncooled 980 nm Pump Modules: These modules are compact, have low power consumption, comply with Telcordia GR-468-CORE standards, and offer wavelength selection for optimal spectrum control with high power output. They are well-suited for small form factor and pluggable Erbium-Doped Fiber Amplifiers (EDFA), high bitrate and high channel-count EDFAs, and CATV distribution. The M11 series pump modules are now available for purchase.
• CPO/ELS Technology: Lumentum's ultra-high power, 1310 nm distributed-feedback laser (DFB) will be demonstrated at over 400 mW optical power ex-fiber at 25°C. These new ultra-high power 13xx lasers will enable higher bandwidth for AI and ML applications by using co-packaged optics and external laser source solutions, as well as silicon photonics transceivers for the next generation of data centers.
• OIF 400ZR+ Interoperability and CMIS demonstrations: At the OIF booth, Lumentum is participating in OIF's 400ZR Interoperability demonstration through the integration of its 400ZR+ QSFP-DD and OSFP transceivers. These transceivers enable high-speed data transmission over long distances. The demonstration aims to show how optical module manufacturers are reducing power consumption and complexity in data center interconnects, while promoting interoperability. 


"As the technology landscape evolves at a breakneck pace and the relentless need for data-intensive applications persists, we’ve designed our products to support the increased level of efficiency and performance that’s essential in this new era," emphasized Wupen Yuen, President, Cloud and Networking at Lumentum. “At ECOC, we’re showcasing cutting-edge innovations that draw upon our decades of photonic expertise, with solutions that empower our customers to stay at the forefront of this dynamic environment."

In addition to the solutions on display, Brian Smith, Lumentum Senior Principal Engineer, will deliver a Market Focus presentation on October 4 from 13:20 – 13:35 entitled “The 6th Generation of Fiber Optic Communications: Carrier and Spatial Division Multiplexing (CSDM).” Smith will provide his insights on the next era of optical networking, which Lumentum introduced at its LITE 2023 Investor Event in March of this year. 

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#ECOC23: Semtech and Broadcom demo 200G/lane optical transceiver

Semtech is showcasing a 200G/lane optical transceiver featuring its latest FiberEdge 200G PAM4 PMDs and Broadcom’s latest generation 5nm 112GBd PAM4 DSP, EML and PD devices. These next generation of optical modules capable of bandwidths up to 1.6TB will drive the adoption of 51.2TB next generation switching platforms.

“The demonstration of a 200G/lane ready-to-adopt optical module validates the 200G/lane technology, of which Semtech has been an early enabler, confirming Semtech’s strong commitment to advanced technology and innovation,” said Nicola Bramante, senior product line manager for Semtech’s Signal Integrity Products Group. “The collaboration with Broadcom as active contributor to the 200G/lane ecosystem on both the DSP and the optics side has been instrumental to this important milestone towards the implementation of 1.6T and beyond, and ultimately towards the deployment of next generation 51.2T and a102.4T switches.”

“Broadcom is pleased to collaborate with Semtech on the development of the next generation of optical modules based on 200G/lane optics that use Broadcom's DSP along with Semtech's laser driver and TIA," said Khushrow Machhi, Senior Director, Marketing for Broadcom's Physical Layer Products Division. 

www.semtech.com/optical

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#ECOC23: Semtech demos 100G/Lane Linear Pluggable

Semtech is demonstrating 100G/lane linear pluggable optical links featuring its latest FiberEdge 100G PAM4 PMDs.

The demo includes:

• 800G SR8 LPO (Linear Pluggable Optics) module, featuring Semtech’s FiberEdge GN1848 quad VCSEL driver and GN1816 quad TIA, interoperating with latest switch ASIC technology, in Semtech’s booth #517
• 800G SR8 LPO (Linear Pluggable Optics) module, featuring Semtech’s FiberEdge GN1848 quad VCSEL driver and GN1816 quad TIA, interoperating with latest switch ASIC technology and other LPO modules from multi-vendor ecosystem, in OIF’s booth #304
• 800G SR8 DSP-based module, featuring Semtech’s FiberEdge GN1848 quad VCSEL driver and GN1816 quad TIA, interoperating with latest switch ASIC technology, in Semtech’s booth #517
• Results from 800G 2xDR4 LPO module, tested offline with latest switch ASIC technology

“Semtech’s FiberEdge PMD portfolio includes high linearity devices that enable the linear compensation needed from the PMDs in a DSP-less datacenter environment,” said Nicola Bramante, senior product line manager for Semtech’s Signal Integrity Products Group. “The Linear Drive architecture demands close handshaking between PMDs and switch ASIC to ensure the success of LPO. This demonstration proves such interoperability for both multi-mode and single-mode datacenter applications.”

www.semtech.com/optical

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#ECOC23: Semtech and Coherent demo 200G per Lane driver with 200G laser

Semtech is showcasing its latest FiberEdge 200G PAM4 MZM driver driving a 200G DFB-MZ laser from Coherent Corp.

The joint demonstration at ECOC 2023 will include a differentially driven DFB-MZ InP laser from Coherent and Semtech’s PAM4 driver, demonstrating a clear path toward 1.6T and 3.2T optical transceiver deployments in data centers.

“We are very excited to continue our collaboration with Coherent as advanced lasers and optics get developed in the 200G per lane space,” said Nicola Bramante, senior product line manager for Semtech’s Signal Integrity Products Group. 

“This demonstration confirms once again the interoperability of state-of-the-art 200G lasers with Semtech’s latest 200G per lane FiberEdge developments, ensuring superior linearity and signal integrity in 200G per lane Mach-Zehnder modulator-based applications, both in indium phosphide (InP) and silicon photonics. This enables rapid and scalable deployment of next-generation high-performing and reliable switches in data centers.”

“Coherent continues to demonstrate its leadership in 200G per lane laser technology, which is a fundamental building block of 1.6T transceivers with up to 10 km reach,” said Dr. Sanjai Parthasarathi, chief marketing officer at Coherent.

http://www.semtech.com/optical

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U.S. Dept of Commerce opens funding for smaller CHIPS projects

The U.S. Department of Commerce’s CHIPS Program Office (CPO) issued its second Notice of Funding Opportunity (NOFOs) targeted toward the semiconductor supply chain. 

This NOFO will support smaller projects, which CPO defines as being under $300 million in total capital costs. Eligible applicants include those intending to use CHIPS funding to support the construction, expansion, or modernization of semiconductor materials and manufacturing equipment production capacity.

Applications will be evaluated using five criteria, the most significant of which is the economic and national security criterion, which encompasses three priorities: supply chain resilience; advancing U.S. technology leadership; and supporting vibrant U.S. fab clusters. 

Projects will also be judged on commercial viability, financial strength, project technical feasibility and readiness, and workforce and community investments. 

https://www.nist.gov/chips/notice-funding-opportunity-small-scale-supplier-projects

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Vapor IO Launches Its “Monetize the AI Edge” Program

Vapor IO is kicking off a new"Monetize the AI Edge"initiative to help partners accelerate the availability of real-time AI by delivering bundled AI services via Vapor IO’s shared and neutral host infrastructure.

Tolaga Research has recently completed a report on the addressable market for edge AI across the 36 U.S. markets in which Vapor IO operates. Tolaga estimates that by 2028, the combined value of edge AI in those 36 markets will be approximately $180 billion.

Vapor IO has built a multi-vendor supply chain of pre-integrated, end-to-end AI services that can be bundled into other products or sold on their own.

“Forward-thinking channel partners have already recognized that real-time AI services are in high demand, and by signing up for Vapor's Monetize Edge AI channel program, they can accelerate their revenue goals,” said Cole Crawford, CEO and founder at Vapor IO. 

 The types of use cases include the following:

• Public Safety: Cameras connected to the Kinetic Grid via fiber optics and wireless technologies use real-time AI to detect unusual or dangerous behavior in real-time and notify the appropriate authorities.
• Video security: Cameras placed inside and outside of office buildings are monitored with real-time AI. The AI looks at the data on the Kinetic Grid to identify suspicious activity and automatically activate the proper response.
• Retail: Retailers are upgrading their technology with cameras and AI to use services like real-time inventory tracking, loss prevention, and customer behavior tracking.
• Manufacturing: Monitoring and quality control can be made more efficient and effective by using computer vision applications to detect anomalies and defects in real-time without human intervention.

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#ECOC23: 1.6 Tbps Pluggable QSFP-DD specification

 The Quad Small Form Factor Pluggable Double Density (QSFP-DD) Multi-Source Agreement (MSA) group released revision 7.0 of its hardware specification . The release updates the existing QSFP-DD MSA spec and introduces the QSFP-DD1600 module variant , extending QSFP-DD leadership to 1.6 Tbps with broad support from component manufacturers .

Highlights:

• The new specification maintains the form factor’s eight electrical lanes with each lane operating at the new higher 200 Gbps rate to provide an aggregate module bandwidth capacity of 1.6 Tbps. 
• The 1.6 Tbps host port maintains backwards compatibility with the entire family of QSFP and QSFP-DD modules and cables. 
• The new release includes enhancements to further improve the power handling capability of QSFP and QSFP-DD form factor’s small faceplate profile and the QSFP-DD’s riding heatsink feature. The combination of these features enables system designers to more efficiently cool the majority of modules as well as support even higher power modules that may be required in next-generation high-density Ethernet switch platforms, supporting all module variants such as coherent 1600ZR modules.
• The new QSFP-DD1600 specification maintains the current port density and fully utilizes the faceplate to efficiently use the rack-space that is expected from next-generation capacity switches.
• The QSFP-DD/QSFP-DD800/QSFP-DD1600 memory map are based on “Common Management Interface Specification (CMIS).

“Network operators are continuing to push the QSFP-DD form factor to meet the expectations of next generation system while maintaining backward compatibility,” says Scott Sommers, MSA co-chair. “This is a critical step for the operational strategy of next generation deployments.”

“The design flexibility that the QSFP-DD form factor enables with its riding heatsink and small faceplate profile maximizes the available air flow and provides engineers the flexibility to meet the challenges for the next-generation of system design,” says Mark Nowell, MSA co-chair. “QSFP-DD continues to be the cornerstone of high-performance, high-density pluggable optics for the foreseeable future.”

A new whitepaper focusing on the thermal enhancements, including the resulting reduction of system power of QSFP-DD1600 is available on the QSFP-DD MSA website: www.qsfp-dd.com

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#ECOC23: Optomind and MaxLinear partner on PAM4 112Gbps OSFP 800 Gbps

At ECOC23 in Glasgow, Optomind and MaxLinear are demonstrating 800Gbps OSFP active optical cables (AOC) and SR8 optical transceivers.

Optomind has developed PAM4 100Gbps/lane SR optical transceivers and AOCs using MaxLinear's 5nm Keystone PAM4 DSP.

Optomind says it selected MaxLinear's 5nm Keystone PAM4 DSP as the best-in-class solution for 800Gbps SR8 transceiver with high-performance and the lowest power consumption to meet the market demand. Both 800G-AOCs and 800G-SR8 transceivers are ready for customer sampling and shall be available in volume production by the end of Q4 this year.

Optomind's optical engine fully integrates optics and mechanics. And its patented prealigned OSA architecture enables a unique manufacturing process in a nimble and simple way without any alignment equipment.

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#ECOC23: Keysight demos terabit data center innovations

At ECOC 2023, Keysight is showcasing solutions that accelerate the transition of networks and data centers to 800G, 1.6T, or higher, including:

• Photonic IC testing –Verify photonic integrated circuits (PIC) designs on chip level for optical parameters insertion loss (IL), polarization dependent loss/gain (PDL / PDG), and optoelectronic S-parameters S21, S(l) .
• 224 Gbps optical test –Keysight N1032A/B optical reference receiver for testing 100-Gbaud class transmitters. When combined with the Keysight high-speed arbitrary waveform generator (AWG) or bit error ratio tester (BERT), next-generation 800G / 1.6T systems can be verified.
• Multichannel optical test – the new Keysight FlexOTO optical test automation software reduces test and validation time by maximizing test efficiency without compromising measurement integrity for high channel count Tx validation, characterization, and manufacturing testing.
• 200 Gbaud optics research – a 1.6 Tbps optical transmission using the Keysight M8199B AWG connected to an ultra-high bandwidth coherent-driver modulator with a Keysight N4391B optical modulation analyzer (OMA) performing the signal reception and demodulation.
• 1.6 TAUI design validation – the Keysight 224G Reference Receiver measures jitter decomposition and high-precision phase-locked loop (PLL) operations on a live 224G transmitter design. The solution supports C2M TP1a electrical validation measurements of IEEE 802.3dj and OIF-CEI 224G standards.
• 224 Gbit/s electrical test – he Keysight M8050A high-performance bit error ratio tester (BERT), which validates and characterizes digital receivers operating at speeds up to 224 Gbps. Also learn how to analyze error performance and measure jitter tolerance in real-time by employing the Keysight M8043A error analyzer, which features powerful equalization and de-embedding functions up to 64 Gbaud when using the Keysight M8067A ISI channel board.

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NTT launches OREX services for telecom operators based on Open RAN

As part of its commitment to becoming an Open RAN service provider for international telecom operators, NTT DOCOMO announced a new lineup of OREX RAN, OREX SMO, and OREX Services.

OREX is DOCOMO's Open RAN service brand, allowing the combination of various vendor products to provide base stations that are highly cost-effective. OREX integrates the strengths of its 13 OREX PARTNERS3 to offer an extensive range of virtualized radio base networks (vRANs) and radio units (RUs) compatible with the range of different frequencies in use in various countries. With the addition of seven new RU vendors,4 OREX is poised to meet the demands of an even larger customer base.

On September 22, DOCOMO initiated the deployment and operation of OREX RAN and OREX SMO in its domestic 5G network, incorporating base station software from Fujitsu Limited, cloud platform from Wind River, hardware accelerator from NVIDIA, and COTS server with Intel processors. Building on the operational experience they have accumulated within DOCOMO's network, these companies plan to enhance OREX Open RAN services and expand their product combinations, striving to offer improved cost-effectiveness and reliability.

Going forward, DOCOMO will continue to support global telecom operators in their adoption of Open RAN with its new OREX offerings, strengthening its cooperation with global partners to make Open RAN a reality. 

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Saint Helena activates branch to Equiano subsea cable

Saint Helena, the British overseas territory in the South Atlantic, activated a 1,140km cable branch into Google’s Equiano cable.

The island, which has a population of 4,400, was previously dependent on satellite connectivity. Kenttik reveals that latency between St. Helena and London dropped from 657ms to 131ms with activation of the fiber spur.

 The Equiano subsea cable, which is named for Olaudah Equiano, a Nigerian-born writer and abolitionist, connects Lisbon, Portugal and Cape Town, South Africa with branching units along the west coast of Africa.

https://www.kentik.com/analysis/saint-helena-activates-long-awaited-subsea-connection/

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Eutelsat completes merger with OneWeb

Eutelsat Communications  completed its all-share merger with OneWeb, creating a global provider of space communications with a a powerful GEO fleet and a new ow latency, LEO constellation. The deal was first announced in July 2022.

The new Eutelsat Group remains headquartered in Paris. OneWeb will be a subsidiary operating commercially as Eutelsat OneWeb with its centre of operations remaining in London. The company remains listed on the Euronext Paris Stock Exchange and has applied for standard listing on the London Stock Exchange.

With OneWeb’s network already active and set to be globally operational by end of 2023, the combined GEO-LEO service will open up new markets and applications for customers, including Fixed Connectivity (Backhaul, Corporate networks), Government Services and Mobile Connectivity (Maritime and Inflight). Broadcast and video services will remain integral to Eutelsat Group’s business and continue to deliver unparalleled and innovative services for customers, including new IP native video services, at the convergence of broadband and broadcast.

Dominique D'Hinnin, Chairman of the Board of Directors, said: “This is an historic moment for the satellite industry. We are bringing together two businesses that are at the forefront of delivering integrated, seamless and reliable connectivity to customers worldwide. We will be moving fast to accelerate the growth of the combined business. With the support of strategic shareholders of both entities, we are confident of maximising financial performance and operational excellence, while capitalising on the high-return investment of next generation satellites.”

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