Molex released a report on thermal management challenges and innovations as data centers face increasing demands for high-speed data throughput. The report highlights the need to address growing power density and heat dissipation in critical servers and interconnect systems. By exploring new thermal management approaches for I/O modules, Molex aims to provide solutions that support the transition from 112 Gbps to 224 Gbps connectivity while enhancing overall system efficiency.
Doug Busch, VP & GM of Molex’s Enabling Solutions Group, emphasized the importance of integrating new cooling technologies to optimize airflow and thermal management within next-generation data centers. As the demand for faster data processing and storage escalates, the heat generated by high-performance servers also rises. Molex is pioneering innovations in both copper and optical platforms, along with power management products, to improve system cooling capabilities and energy efficiency. This includes the application of optical connectivity and modules combined with advanced cooling solutions.
The report explores the latest air and liquid cooling techniques, such as direct-to-chip liquid cooling and immersion cooling. Molex's integrated floating pedestal liquid cooling solution addresses the challenges of cooling pluggable I/O modules by allowing a single cold plate to adapt to different configurations. Additionally, Molex's Drop Down Heat Sink (DDHS) technology offers a reliable method to enhance heat transfer without compromising component integrity. By collaborating with industry leaders in the Open Compute Project, Molex is at the forefront of developing next-generation cooling technologies to meet evolving data center needs.
Highlights:
- Thermal Management Approaches: Innovations include drop-down heat sink solutions for I/O modules.
- Demand for Faster Data Processing: Rise in heat generation from high-performance servers.
- Liquid Cooling Solutions: Integration of direct-to-chip and immersion cooling within existing form factors.
- Integrated Floating Pedestal: Each pedestal moves independently, optimizing heat transfer efficiency.
- Drop Down Heat Sink (DDHS): Eliminates metal-to-metal contact, improving installation and durability.
- Industry Collaboration: Participation in the Open Compute Project to advance cooling technologies.
