Digital Realty announced the availability of liquid-to-chip cooling technology, enabling businesses to deploy high-density configurations within a shared environment, in close proximity to the cloud, as well as network and AI service providers.
Key highlights of Digital Realty's advanced high-density deployment support include:
- The ability to leverage a wide range of mechanical solutions, such as rear door heat exchangers (RDHx) and DLC, enabling the efficient management of power densities ranging from 30 to 150 kilowatts per rack, and beyond.
- The combination of RDHx with DLC effectively doubles the power densities that can be supported.
- Deployment options are available in more than half of Digital Realty's data centers worldwide, with plans to expand support to additional sites and to leverage existing infrastructure to meet emerging AI requirements.
"We're proud to align with our customers in evolving their infrastructure to support this cutting-edge liquid-to-chip technology, enabling them to land and expand their deployments efficiently and redefine what's possible in the digital age. With this cutting-edge liquid-to-chip cooling technology, we're not just setting a new standard for high-density deployment support, we're revolutionizing the digital infrastructure landscape," said Chris Sharp, Chief Technology Officer, Digital Realty.
The new offering from Digital Realty, which builds upon the company's standardized high-density colocation offering, introduces direct liquid cooling (DLC), bringing liquid directly to customers' infrastructure, allowing for greater relevance and versatility in meeting emerging AI demand. This approach enables
