Thintronics, a start-up based in Berkeley, California, raised $23 million in Series A funding for its development of electronic materials for high-performance insulators for emerging AI datacenter, networking, and RF/millimeter-wave (mmW) applications.
The funding was led by Maverick Capital and Translink Capital. Series A funding will support commercialization of a novel insulator platform.
The company was founded on the idea that conventional assumptions guiding insulator material development limited the capacity of the industry to innovate. Thintronics says its suite of high-performance materials display electrical and mechanical characteristics that far outpace the state of the art.
Thintronics’ CEO Stefan Pastine emphasizes that "the interconnect insulator is foundational to modern electronics; however, it has yet to be optimized to operate near the theoretical limit of insulation. Additionally, the supply chain is fragmented across multiple electronic architectures. It is our vision to optimize the insulator and unify it across the fabric."
To satisfy this growing demand Thintronics is entering the insulator market with technologies targeting chipsets, switches, and datacenter integrators for 224G links and beyond. For CTO Tristan El Bouayadi, "The combination of superior electrical and thermo-mechanical performance allows our customers to unlock new design possibilities and new applications in Networking, AI acceleration, RF mmW communication, and Radar. Additionally, by synthesizing ultra-thin dielectric layers, Thintronics enables form factor design optimization for Consumer and Infrastructure devices and products."
