Check out OFC Conference and Exposition 2024 videos here: https://ngi.fyi/ofc24yt
OIF has been studying the co-packaging of ASICs with optical and electrical transceivers within its Co-Packaging Framework Project.
The External Laser Small Form-Factor Pluggable (ELSFP) IA will define a future proofed external laser source form factor to support co-packaged optical modules. Nathan Tracy walks us through the #OFC24 demo.
Want to be involved our video series? Contact info@nextgeninfra.io
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