The big players are now making significant bets on co-packaged optics (CPO) as a driver a for the highest performance interconnects in AI clusters. Hamid Arabzadeh, CEO from Ranovus, gives us the update from #OFC24:
- The significant investment in co-packaged optics by major industry players like TSMC, Nvidia, Broadcom, AMD/Xilinx, SilTerra, and Mediatek, and how this technology is being utilized in AI and Edge AI applications where traditional modules don't fit.
- The development of a new generation of co-packaged optics that includes the laser inside the module, allowing for breakthroughs in power consumption and beachfront density where copper could not provide.
- The design and manufacturing process of these optics, integrating multiple components inside a single die, using the silicon photonics substrate as a packaging platform, and achieving substantially lower power consumption than other technologies.
Keep up to speed with CPO, as it is poised to have a major impact of AI system design.
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