Sunday, March 24, 2024

Ayar Labs unveils CW-WDM MSA-compliant 16-wavelength light source

Ayar Labs is now unveiling the second generation of SuperNova, which powers the company’s TeraPHY optical I/O chiplet and enables 16 Tbps of bi-directional bandwidth. Compliant with the CW-WDM MSA specification, the 16-wavelength light source offers compact packaging, operates at wide temperature ranges, and can supply light for 256 data channels, making it capable of handling the significantly higher throughput required for the massive growth in AI applications.

Ayar Labs is working with several industry leaders to demonstrate the value optical solutions deliver for AI applications. Two examples Ayar Labs will be highlighting at OFC:

  • Corning Glass Waveguide Module: Ayar Labs and Corning Incorporated have teamed up to develop a next-generation AI advancement. They have created an optical leadership solution by coupling Ayar Labs' TeraPHY optical I/O chiplets with Corning’s glass waveguide module, bringing advanced optical capabilities to the AI ecosystem. Ericsson is partnering with Ayar Labs and Corning in this AI-driven solution as part of their technology exploration for future mobile systems. This joint innovation will be shown at Ayar Labs’ booth at OFC. Together, they will highlight how the technologies create future-ready, AI-enabled innovations.
  • Teramount TeraVERSE Detachable Connector: Teramount and Ayar Labs are showcasing a concept for the next-generation TeraVERSE detachable connector to meet the infrastructure demands of next-generation AI. The detachable fiber connectivity solution features wideband surface coupling, industry-leading bandwidth density, and detachability for reliable semiconductor-grade volume manufacturing of co-packaged optics and in-package optical I/O for AI. Wideband surface coupling offers high bandwidth density with negligible loss-related wavelength dependency, resulting in less lasers, power and fibers needed compared with grating coupler solutions.

“The explosive growth of AI models is breaking the back of existing infrastructure – traditional interconnect technology simply can’t scale to the cost and throughput multi-modal AI systems will require,” said Mark Wade, CEO & co-founder of Ayar Labs. 

“Our in-package optical I/O solution gives customers the performance and energy efficiency they need as they build out their next-generation AI infrastructure. We’re pleased to showcase this innovation alongside several ecosystem partners at OFC.”