Heterogeneous Integration opens new capabilities for technologies, use cases, and market participants. Integrating devices developed separately and often on different substrates (as, for example, III-V semiconductors and Silicon Photonics) into a single composite device enables miniaturization, simplifies interconnection, saves materials, and reduces energy consumption.
Dan Pitt, President of Palo Alto Innovation Advisors, previews a panel discussion on Sunday, March 24, 16:00 - 18:30, featuring:
Alex Chikhaoui, X-Celeprint, Ireland
Ivan Huang, Avicena Tech, United States
Michael Lebby, Lightwave Logic, United States
Sylvie Menezo, Scintil, France
Edward Preisler, Tower Semiconductor, United States
Jing Zhang, IMEC AND Ghent University, Belgium
Mian Zhang, Hyperlight, United States
Have a tech update that you want to brief us on? Contact info@nextgeninfra.io!
