TDK Ventures, Inc. has invested in Silicon Box, a start-up based in Singapore that is focused on semiconductor chiplet packaging design and fabrication.
Silicon Box was co-founded Dr. Sehat Sutardja and Weili Dai, who previously founded Marvell, along with Dr. Byung Joon (BJ) Han, who was formerly CEO of STATS ChipPAC (acquired by JCET in 2015).
Silicon Box says its innovative, large format semiconductor package design and fabrication method enables up to 8x more chiplet devices per production unit, with 90+% yield – compared to industry alternatives, which top out around 60%.
TDK Ventures’ President Nicolas Sauvage commented, “TDK Ventures is excited to partner with the world-class team at Silicon Box. Their standout chiplet design is making waves in the industry, and they dalready have a proven concept in a 750,000 square foot facility to support production. We are ommitted to supporting their success for a positive impact on the world.”
Silicon Box CEO Dr. BJ Han also discussed the partnership saying, “Teaming with TDK Ventures is ideal for us, and we are looking forward to continuing what has already been an incredible collaboration. We have significant synergies with many of their business units, and in addition to their investment, we are excited to engage with their extensive network, subject matter experts, and industrial base. Bring on the TDK Goodness!”
Singapore’s Silicon Box targets chiplet fab and packaging
Silicon Box, a start-up based in Singapore, unveiled plans for a $2 billion advanced semiconductor foundry and packaging facility.
The venture, which as founded by Sehat Sutardja, his wife Weili Dai, and BJ Han, says it has developed a chiplet interconnect technology in sub 5 micron for design flexibility, power efficiency, and low manufacturing cost.
The 73,000 sqm facility in the district of Tampines will employ up to 1,200 people when fully developed.
“Silicon Box is well poised to solve the unique challenge for chiplets, which are essential to power emergent technologies. Our team of experts with over 30 years of multi-sectoral experience, critical ecosystem of partners and proprietary interconnection technology will shorten the design cycle of chiplets, lower new device costs, reduce power consumption and enable faster-time-to-market for industry partners involved in areas such as artificial intelligence (AI), data centres, electronic vehicles (EVs), mobile, and wearables, while protecting their intellectual property (IP),” states Dr. Han Byung Joon, CEO of Silicon Box.
https://www.siliconboxinc.com
