ColorChip introduced chip-on-board technology for active electrical cables, enabling high density 1.6T OSFP-XD with significant improvements in both performance and cost.
This innovation addresses the challenges of density, reach, power consumption and higher bandwidth required for the new OSFP-XD form factor and can also be leveraged to produce best-in-class solutions for 800G AEC applications.
ColorChip said that by removing the lossy and bulky package of the Re-timer, DSP or Re-driver, it achieves a longer reach, better cost, better thermal management and higher density for active copper cable solutions. Collaborating with Maxlinear, this is the first time in the industry that an active cable has been developed with a bare die.
"Partnering with ColorChip, we are bringing our companies' advanced technologies and capabilities together to provide our joint customers with industry leading solutions for AEC applications", said Drew Guckenberger, Vice President of High-Speed Interconnect BU at MaxLinear.
"MaxLinear's Keystone 5nm KGD bare die solutions for AEC applications enable the high density, long reach and best-in-class power consumption required to meet our customers' key requirements for 800G and 1.6T AEC applications," said Xin Wu, EVP at ColorChip.
