Monday, March 4, 2019

Elenion debuts Silicon Photonic BGA Packaged Coherent Optical Sub-Assembly

Elenion Technologies, a start-up developing silicon photonics-based System-on-Chip solutions, announced its next-generation Coherent Silicon Transmitter and Receiver CSTAR optical BGA platform for transmission of up to 600G on a single wavelength, as well as new small form factors for compact pluggable modules such as OIF 400G ZR QSFP-DD.

The CSTAR-200 is a DSP agnostic, coherent optical engine that enables pluggables such as CFP2-DCO and on-board applications, from data center interconnect to long haul in 100/200G coherent optical communication links.


“We are excited to be partnering with Elenion on our award winning CFP2-DCO. Elenion’s CSTAR platform allows us to offer differentiated coherent solutions to our customers,” said Siraj ElAhmadi, President & General Manager, Menara Networks.

The CSTAR platform comprises a multi-chip-module (MCM) and integrates Elenion’s advanced Silicon Photonics and RFICs. Integrated into a non-hermetic BGA package, CSTAR offers the next generation coherent optical engine for todays and future 100 to 600Gb/s Network applications.

“From the beginning at Elenion, we’ve built our silicon photonic chips in a production CMOS fab, which enables us to build complex optical devices. Having leveraged on-chip complexity to eliminate all of the isolators, lenses, and other free space optics from our package, Elenion is taking these chips and having them assembled in a production electronics-attach environment, reusing the infrastructure investment from the ASIC industry. We believe that this is a milestone for the silicon photonics industry, and represents an inflection point with regard to the cost of packaging for silicon photonics and integrated photonic components in general,” said Michael Hochberg, CTO, Elenion.