Broadcom announced commercial shipments of its StrataXGS Tomahawk 3 Ethernet switch silicon boasting 12.8 Terabits/sec in a single device -- double that of any other switching chip currently in the market.
Tomahawk 3 paves the way for high-density, standards-based 400GbE, 200GbE, and 100GbE switching and routing for hyperscale cloud networks. The latest gen silicon is expected to be adopted by leading network equipment OEMs as well as by hyperscale cloud companies.
Third party companies cited in the product announcement included Microsoft, Alibaba, Arista Networks, Baidu, Juniper Networks, LinkedIn, Tencent, Accton, Celestica, Delta Networks, Quanta, Applied Optoelectronics, Foxconn Interconnect Technologies, Intel Silicon Photonics, and Luxtera.
The new chip, which arrives 14 months after Broadcom introduced its 6.4Tbps product generation, offers 40% lower power consumption per 100GbE switch port and up to 75% lower cost per 100GbE switch port.
Key features of the StrataXGS Tomahawk 3 Series:
- Supports 32 x 400GbE, 64 x 200GbE, or 128 x 100GbE line-rate switching and routing on a single chip
- Delivers 40% reduction in power per 100Gbps, and up to 75% lower cost per 100Gbps, versus alternatives
- New, state-of-the-art, integrated 12.8Tbps shared-buffer architecture offers 3X to 5X higher incast absorption and provides the highest performance and lowest end-to-end latency for RoCEv2 based workloads
- Broadview Gen 3 integrated network instrumentation feature set and software suite provides full visibility to network operators into packet flow behavior, traffic management state, and switch internal performance
- Supports all packet processing and traffic management requirements for next-gen hyperscale network use cases: >2X IP route forwarding scale, 2X ECMP scale, Dynamic Load Balancing and Group Multipathing, In-Band Network Telemetry, Elephant Flow detection and re-prioritization
- Robust connectivity using 256 instances of the best performing and longest-reach 50G PAM-4 integrated SerDes core, enabling long-reach (LR) East-West optical links and Direct-Attached-Copper (DAC) in-rack cabling in the data center, fully compliant to new IEEE standards for 50/100/200/400GbE
- Implemented on proven, high-volume 16nm process technology node, ensuring fastest time to CY2018 production network deployment for hyperscale customers
“The Tomahawk franchise is the flagship for cutting-edge, single-chip performance and integration among Broadcom’s multi-vectored Ethernet switch silicon portfolio, tailored to the unique and rigorous demands of hyperscale data center operators,” said Ram Velaga, senior vice president and general manager, Switch Products at Broadcom. “I am proud of our world-class engineering team for innovating and delivering the 12.8Tbps Tomahawk 3 chip in a record 14 months after we released Tomahawk 2. We’ve applied great focus and diligence working with our hyperscale customers to ensure this product is the ideal fit for their upcoming high-radix 100/400GbE deployments and aggressive Terabit-per-dollar and Terabit-per-Watt targets. Broadcom is proving yet again that customers can rely on us to lead the industry on switch silicon performance and execution at every generation.”
