Sequans Pushes its LTE Silicon into 40 nm CMOS

Sequans Communications introduced three new FDD and TDD LTE baseband chips, a companion RF chip, and two new LTE platforms, supporting all global FDD and TDD LTE networks and implemented in 40 nm CMOS process technology. The devices also include embedded SDRAM.


The 40nm design pushes new boundaries for low power consumption and very small form factor.


Sequans is announcing two platforms: Andromeda, which is customized for the design of handsets and tablets; and Mont Blanc, which is customized for the design of mobile hotspots, USB dongles and CPE modems.


“Our LTE technology has been tested and proven in collaboration with nearly all of the world's leading system vendors in numerous networks on five continents,�? said Georges Karam, Sequans CEO. "Our new LTE platforms are uniquely comprehensive, supporting all global TDD and FDD networks from 700 MHz to above 3.5 GHz, and designed to meet the needs of device manufacturers for all types of devices in the most efficient way possible.�?


Sampling will begin in December. Sequans is based in Paris. http://www.sequans.com