Broadcom Introduces 65nm 3G HSPA Chipset

Broadcom introduced a new single-chip HSPA baseband processor and a radio frequency (RF) transceiver solution for 3G smartphones. The new device is the first to provide extremely high-speed cellular connectivity with advanced, built-in graphics capabilities, for HSUPA (high speed upstream packet access) applications. The RF transceiver solution complements the advanced HSUPA processor to provide support for all global frequency combinations covering the latest 3G-enabled devices. It is implemented using 65 nanometer CMOS.


The Broadcom BCM21553 baseband processor supports 3GPP releases 6 and 7, which provide up to 5.8 Mbps of upstream connectivity, 7.2 Mbps of downstream connectivity and support next generation CS (circuit switches) over HSPA services.
http://www.broadcom.com