NTT Tests "Super 3G" Chipset Achieving 200 Mbps Downlinks via MIMO

NTT DoCoMo announced a milestone of the way to "Super 3G" wireless, also known as Long Term Evolution (LTE) in the 3rd Generation Partnership Project (3GPP) -- the company has developed and successfully tested a trial large-scale-integration (LSI) chip incorporating advanced power-saving signal-processing technologies that enable the chip to work at a sufficiently low power consumption and to be made small enough to fit into forthcoming Super 3G handsets and beyond.



DoCoMo reports that its LSI achieved a transmission rate of 200Mbps with high precision over a high-speed wireless network, while power consumption did not exceed 0.1W thanks to its proprietary signal-processing technology.



The company said its LSI demodulates and separates MIMO (multiple-input multiple-output)-multiplexed OFDM (orthogonal frequency division multiplexing) signals transmitted in the 20MHz bandwidth from four antennas. Signal processing is based on MLD (maximum likelihood detection) technology that DoCoMo has originally developed for 4G wireless access. Redundant circuits have been eliminated in the experimental chip, which was made with 65 nanometer processing.



DoCoMo plans to continue to develop Super 3G and 4G technologies in combination with its LSI technology, as well as cooperate in the establishment of related international standards.

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