Maxim Integrated Products, its subsidiary Dallas Semiconductor, and RAD Data Communications announced a partnership to produce the TDM over Packet (ToP) chips. Specifically, RAD will develop a circuit emulation "core" based on its key technologies, to be incorporated by Dallas Semiconductor, alongside its own integrated T1/E1/J1 transceiver technologies, into the ToP chips.
The companies said the ToP solution will be the only TDM-over-Ethernet/IP/MPLS (ToP) family of devices to provide circuit emulation over PSN capability and the Dallas Semiconductor framer and line interface unit (LIU) in the same device.
The chip will feature a robust clock-recovery engine onboard and will provide full IETF PWE3 TDMoIP, SAToP, and CESoPSN draft compliance. The ToP devices are expected to have low power consumption, offer a substantial cost reduction over the processor-based solutions, and be available in several pin-compatible, compact packages.
The RAD technologies to be incorporated into the chips are:
- TDMoIP (TDM over IP) Pseudowire
- Circuit Emulation Service over Packet Switched Networks
- Structured Agnostic TDM over Packet
The Dallas Semiconductor technologies integrated into the chips are:
- Full-Featured, Integrated T1/E1/J1 Transceivers
- Long-Haul/Short-Haul, Low-Power LIUs with On-Board Software-Selectable Termination
