Intel and Corning Develop Extreme Ultraviolet Lithography

Intel and Corning are partnering to develop ultra low thermal expansion (ULE) glass photomask substrates required for Extreme Ultraviolet (EUV) lithography. Current lithography tools use a 193nm wavelength of light to create transistors as small as 50nm. EUV lithography will use a 13.5nm wavelength of light. The joint development program is expected to enable chip production using EUV technology starting in 2009.
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