Teknovus Raises $9 Million for Broadband Chips

Teknovus, a start-up based in Petaluma, California, raised $9 million in Series B funding for its broadband-access chipsets. Teknovus is currently shipping in volume its fourth-generation EPON chipset designed for triple-play deployments.


The funding round was led by Samsung America Ventures and Mitsubishi Corporation, with participation from SUIT Growth Fund and current investors Partech International, U.S. Venture Partners (USVP), and Portview Communications. Teknovus will use this new funding to expand global operations and move to the next level of technology required for EPONhttp://www.teknovus.com