Showing posts with label GlobalFoundries. Show all posts
Showing posts with label GlobalFoundries. Show all posts

Tuesday, November 8, 2022

GlobalFoundries posts record Q3 revenue of $2.1B, up 22% yoy

GlobalFoundries reported record revenue of $2.1 billion for Q3 2022, up 22% year-over-year. There was record adjusted EBITDA of $793 million.

“In the third quarter, the GF team continued to execute on its commitments to customers and shareholders despite ongoing macroeconomic and geopolitical challenges,” said CEO Dr. Thomas Caulfield. "300mm-equivalent wafer shipments of 637 thousand was a record for GF, an increase of 5% year-over-year. Our revenue grew 22% year-over-year, and we delivered record gross, operating, and net profits, making significant progress towards our long-term financial model. We remain on track to deliver a strong year of growth and profitability.”

GF recenly qualified a proprietary automotive eNVM product for one of the largest automotive MCU suppliers in the industry. The qualification allows GF to ship this product from both the Dresden and Singapore facilities, establishing a high-volume, secure supply chain for the automotive industry. 

U.S. Senator Patrick Leahy and GF announced the award of $30 million in federal funding to advance the development and production of next-generation gallium nitride (GaN) on silicon semiconductors at GF's facility in Essex Junction, VT. 



Saturday, September 17, 2022

ECOC22: Building a vibrant photonic ecosystem

Earlier this year, GlobalFoundries unveiled a silicon photonics platform. In this video, Vikas Gupta, Senior Director of Product Management and Marketing, provides a perspective on what it takes to build a vibrant photonic ecosystem.

Learn more about the Consortium for Onboard Optics and why your company should join:

https://www.onboardoptics.org

https://youtu.be/0cSEGbohgpU

Monday, August 8, 2022

GlobalFoundries signs Qualcomm for FinFET fab in New York

by James E. Carroll

GlobalFoundries and Qualcomm Technologies announced a semiconductor manufacturing deal that extends through 2028.

Specifically, the manufacturing agreement extends QGT's U.S. based collaboration with GF in FinFET for 5G transceivers, Wi-Fi, Automotive and IoT connectivity.

The companies said their partnership secures wafer supply and commitments to support U.S.-based manufacturing through capacity expansion at GF's most advanced semiconductor manufacturing facility, in Malta, New York.

"With accelerating demand for 5G, Automotive and IoT applications, a robust supply chain is critical for ensuring innovation in these areas remains uninterrupted," said Dr. Roawen Chen, Senior Vice President and Chief Supply Chain and Operations Officer, Qualcomm Technologies, Inc. "Our continued collaboration with GF helps us to expand the next generation of wireless innovation as we move toward a world where everyone and everything can be intelligently connected."

"GF's global manufacturing footprint enables us to partner with our customers to meet their capacity needs, where they need it," said Dr. Thomas Caulfield, president and CEO of GF. "Our collaboration with Qualcomm Technologies delivers differentiation and innovation in mobile and IoT spanning three continents, and this long-term agreement extension provides Qualcomm Technologies with additional U.S. based manufacturing for a more resilient supply chain."

GF has been manufacturing Qualcomm Technologies' feature rich, high-performance chips for many years, reaching across its global footprint. In 2021, Qualcomm Global Trading Pte. Ltd (QGT), a subsidiary of Qualcomm Technologies, was one of GF's first customers to secure their supply with a long-term agreement covering multiple geographies and technologies. That agreement secured 22FDX capacity at GF's Dresden facility and will now include capacity at GF's recently announced facility in Crolles, France, making QGT an anchor customer in GF's leading European proprietary technology. QGT has also secured capacity in GF's market leading 8SW radio-frequency silicon-on-insulator (RFSOI) technologies for Sub 6GHz 5G front-end module (FEM) which will be primarily manufactured in GF's Singapore facilities, where site expansion plans are well underway with full ramp expected in early 2023.

https://www.investors.gf.com

ST and GlobalFoundries target 300mm fab in France

STMicroelectronics and GlobalFoundries agreed to create a new, jointly-operated 300mm semiconductor manufacturing facility adjacent to ST’s existing 300mm facility in Crolles, France. This facility is targeted to ramp at full capacity by 2026, with up to 620,000 300mm wafer per year production at full build-out (~42% ST and ~58% GF).The new facility will support several technologies, in particular FD-SOI-based technologies, and will cover multiple...

Motorola Solutions signs GlobalFoundries to secure radio chip supply

Motorola Solutions, which supplies two-way radios for public safety, critical infrastructure and enterprise organizations, signed a long-term agreement with GlobalFoundries to supply chip solutions.The companies point out that several critical chips the company designs for its public safety, professional and commercial radios are manufactured by GF in Vermont. GF's SiGe process technology enables the highly reliable, long-range, secure and clear...


Monday, July 11, 2022

ST and GlobalFoundries target 300mm fab in France

STMicroelectronics and GlobalFoundries agreed to create a new, jointly-operated 300mm semiconductor manufacturing facility adjacent to ST’s existing 300mm facility in Crolles, France. This facility is targeted to ramp at full capacity by 2026, with up to 620,000 300mm wafer per year production at full build-out (~42% ST and ~58% GF).

The new facility will support several technologies, in particular FD-SOI-based technologies, and will cover multiple variants. This includes GF’s FDX technology and ST’s comprehensive technology roadmap down to 18nm, which are expected to remain in high demand for Automotive, IoT, and Mobile applications for the next few decades.

FD-SOI technology has origins in the Grenoble (France) area. It has been part of ST technology and product roadmap in its Crolles facility since the early beginnings, and it was later enabled with differentiation and commercialized for manufacturing at GF’s Dresden facility. FD-SOI offers substantial benefits for designers and customers, including ultra-low power consumption as well as easier integration of additional features such as RF connectivity, mmWave and security.

ST and GF will receive significant financial support from the State of France for the new facility. This facility will strongly contribute to the objectives of the European Chips Act, including the goal of Europe reaching 20% of worldwide semiconductor production by 2030. 

“This new manufacturing facility will support our $20 billion+ revenue ambition. Working with GF will allow us to go faster, lower the risk thresholds, and reinforce the European FD-SOI ecosystem. We will have more capacity to support our European and global customers as they transition to digitalization and decarbonization” said Jean-Marc Chery, President and CEO of STMicroelectronics. “ST is transforming its manufacturing base. We already have a unique position in our 300mm wafer fab in Crolles, France which will be further strengthened by today’s announcement. We continue to invest into our new 300mm wafer fab in Agrate (near Milan, Italy), ramping up in H1 2023 with an expected full saturation by end 2025, as well as in our vertically integrated silicon carbide and gallium nitride manufacturing.”

https://www.investors.gf.com


What's hot at OFC22? GlobalFoundries on Co-packaged optics

The proof-point for co-packaged optics are here, says Anthony Yu, VP of Computing and Wired Infrastructure, GlobalFoundries. Yu discusses GlobalFoundries' newly unveiled next generation silicon photonics platform and active design wins with major customers, including collaborations with Broadcom, Cisco Systems, Marvell, NVIDIA, Ayar Labs, Lightmatter, PsiQuantum, Ranovus and Xanadu.The Consortium for Onboard Optics (COBO) has been instrumental...


Thursday, May 19, 2022

Motorola Solutions signs GlobalFoundries to secure radio chip supply

Motorola Solutions, which supplies two-way radios for public safety, critical infrastructure and enterprise organizations, signed a long-term agreement with GlobalFoundries to supply chip solutions.

The companies point out that several critical chips the company designs for its public safety, professional and commercial radios are manufactured by GF in Vermont. GF's SiGe process technology enables the highly reliable, long-range, secure and clear communications vital to police, fire and other first responders.   

“Millions of first responders, utilities, infrastructure providers and businesses rely on Motorola Solutions radios for everyday and emergency communications, and it is essential that we maintain supply of these critical components,” said Scott Mottonen, senior vice president of products, Motorola Solutions. “Our long-term relationship with GF provides important capabilities, reliable U.S.-based manufacturing and added assurance that we will continue to meet the safety and security needs of our customers across the globe.” 

 "Through long-term agreements, we provide assured supply of highly reliable and vital chips used in millions of mission-critical products worldwide. A great example of this is our collaboration with Motorola Solutions on their two-way radios, which are relied upon by first responders everywhere,” said Dr. Bami Bastani, senior vice president and general manager, mobile and wireless infrastructure strategic business unit at GF. “We are gratified to serve the industry with feature-rich solutions but also the innovations in RF technology that deliver low noise and high power and efficiency to allow for clear and long-range communications in highly demanding situations.” 

https://gf.com

GlobalFoundries announces research and collaboration program

GlobalFoundries is launching a new program that extends the development horizon of innovative, differentiated semiconductor technology and broadens the company's portfolio of feature-rich and enablement solutions. 

GF Labs will focus on advancing new technology and long-term roadmap differentiation that will enable GF customers to develop innovative products and accelerate their time-to-market. The program is offer an open framework of internal and external research and development initiatives that deliver a differentiated pipeline of market-driven process technology solutions for future data-centric, connected, intelligent and secure applications. GF Labs will harvest capabilities from a broad research platform including the Interuniversity Microelectronics Centre (IMEC) in Belgium, Fraunhofer in Germany, Defense Advanced Research Projects Agency (DARPA) in the U.S., and the Institute for Microelectronics in Singapore, along with a broad network of university partnerships.

"Fostering semiconductor innovation is critical to delivering a differentiated technology portfolio that will continue to fuel emerging markets," said Gregg Bartlett, senior vice president of Technology, Engineering and Quality, GF. "Our focus is on making sure we're always developing the latest technologies that provide meaningful differentiation for our customers, not just in the near-term, but far into the next decade. The launch of GF Labs accelerates our pursuit of the innovation it takes to develop and deliver powerful technological advances for our customers."


Monday, March 14, 2022

What's hot at OFC22? GlobalFoundries on Co-packaged optics

The proof-point for co-packaged optics are here, says Anthony Yu, VP of Computing and Wired Infrastructure, GlobalFoundries. 

Yu discusses GlobalFoundries' newly unveiled next generation silicon photonics platform and active design wins with major customers, including collaborations with Broadcom, Cisco Systems, Marvell, NVIDIA, Ayar Labs, Lightmatter, PsiQuantum, Ranovus and Xanadu.

The Consortium for Onboard Optics (COBO) has been instrumental in letting people know the importance of actually placing the photonics chip in proximity of the ASIC. We're also seeing the proof point of putting chipsets of a switch or GPUs.

Lumentum and Ayar Labs target external light sources for CPO

Lumentum and Ayar Labs announced a strategic collaboration agreement to deliver CW-WDM MSA compliant external laser sources in high volume. “Co-packaged optics to replace traditional copper interconnects is a massive new market opportunity broadly recognized by the industry and one that Lumentum is well-positioned to address with our proven laser technologies and manufacturing scale,” said Walter Jankovic, Senior Vice President and General Manager...

GlobalFoundries unveils next gen silicon photonics platform

GlobalFoundries unveiled its next generation silicon photonics platform and active design wins with major customers, including collaborations with Broadcom, Cisco Systems, Marvell, NVIDIA, Ayar Labs, Lightmatter, PsiQuantum, Ranovus and Xanadu. The platform enables a high level of integration onto a photonics integrated circuit (PIC). It also supports innovative packaging solutions, such as the passive attachment for larger fiber arrays, support...


Monday, November 1, 2021

GlobalFoundries closes Initial Public Offering

GlobalFoundries announced the closing of its initial public offering of 55,000,000 ordinary shares, 30,250,000 of which were offered by GF and 24,750,000 of which were offered by GF's existing shareholder, Mubadala Investment Company PJSC, at an initial public offering price of $47.00 per share. 

The shares are listed on the Nasdaq Global Select Market and trade under the ticker symbol "GFS."

Morgan Stanley, BofA Securities, J.P. Morgan, Citigroup and Credit Suisse acted as active book-running managers for the offering. Deutsche Bank Securities, HSBC and Jefferies acted as additional book-running managers for the offering. Baird, Cowen, Needham & Company, Raymond James, Wedbush Securities, Drexel Hamilton, Siebert Williams Shank and IMI – Intesa Sanpaolo acted as co-managers for the offering.




Tuesday, October 19, 2021

GlobalFoundries announces IPO

GlobalFoundries (GF) announced of its initial public offering of 55,000,000 ordinary shares, 33,000,000 of which are being offered by GF and 22,000,000 of which are being offered by GF’s existing shareholder, Mubadala Investment Company PJSC, pursuant to a registration statement on Form F-1 filed with the U.S. Securities and Exchange Commission (“SEC”). 

The initial public offering price is currently expected to be between $42.00 and $47.00 per share. In connection with the offering, Mubadala expects to grant the underwriters a 30-day option to purchase up to an additional 8,250,000 ordinary shares at the public offering price, less underwriting discounts and commissions. GF has applied to list its ordinary shares on the Nasdaq Global Select Market under the ticker symbol “GFS.”

GlobalFoundries announces 45nm Silicon Photonics platform

GlobalFoundries announced a  new Silicon Photonics 45nm platform for combining RF CMOS and optical components on the same chip.The monolithic platform includes an innovative new feature, the first micro ring resonator (MRR) optical component in 300 mm wafer technology.GF said the new platform has passed critical technology milestones and is on track for full technology qualification by Q1 2022. The company also confirms that it is engaged with...

GlobalFoundries and Qualcomm team on 5G RF front-end

GlobalFoundries (GF) and Qualcomm Global Trading PTE., are extending their RF collaboration on 5G multi-Gigabit speed RF front-end products for 5G-enabled products.“GlobalFoundries continues to lead in RF with feature-rich technology solutions for 5G,” said Dr. Bami Bastani, senior vice president and general manager, mobile and wireless infrastructure strategic business unit at GF. “Our strong collaboration with Qualcomm Technologies includes sub-6...

GlobalFoundries plans new $1 billion fab expansion in New York

GlobalFoundries (GF) announced its expansion plans for its most advanced manufacturing facility in upstate New York.GF will invest $1 billion to immediately add an additional 150,000 wafers per year within its existing Fab 8 to help address the global chip shortage. Following that, GF plans to construct a new fab that will create more than 1,000 new high-tech jobs. GF recently announced new fab in Singapore and $1 billion planned investment...

GLOBALFOUNDRIES and GlobalWafers increase 300mm wafer supply

GlobalFoundries announces 45nm Silicon Photonics platform

GlobalFoundries announced a  new Silicon Photonics 45nm platform for combining RF CMOS and optical components on the same chip.The monolithic platform includes an innovative new feature, the first micro ring resonator (MRR) optical component in 300 mm wafer technology.GF said the new platform has passed critical technology milestones and is on track for full technology qualification by Q1 2022. The company also confirms that it is engaged with...

GlobalFoundries and Qualcomm team on 5G RF front-end

GlobalFoundries (GF) and Qualcomm Global Trading PTE., are extending their RF collaboration on 5G multi-Gigabit speed RF front-end products for 5G-enabled products.“GlobalFoundries continues to lead in RF with feature-rich technology solutions for 5G,” said Dr. Bami Bastani, senior vice president and general manager, mobile and wireless infrastructure strategic business unit at GF. “Our strong collaboration with Qualcomm Technologies includes sub-6...

GlobalFoundries plans new $1 billion fab expansion in New York

GlobalFoundries (GF) announced its expansion plans for its most advanced manufacturing facility in upstate New York.GF will invest $1 billion to immediately add an additional 150,000 wafers per year within its existing Fab 8 to help address the global chip shortage. Following that, GF plans to construct a new fab that will create more than 1,000 new high-tech jobs. GF recently announced new fab in Singapore and $1 billion planned investment...

Wednesday, September 15, 2021

GlobalFoundries announces 45nm Silicon Photonics platform

GlobalFoundries announced a  new Silicon Photonics 45nm platform for combining RF CMOS and optical components on the same chip.

The monolithic platform includes an innovative new feature, the first micro ring resonator (MRR) optical component in 300 mm wafer technology.

GF said the new platform has passed critical technology milestones and is on track for full technology qualification by Q1 2022. The company also confirms that it is engaged with leading customers and partners on this new platform.


https://gf.com/blog/gf-innovation-moving-data-light-speed

Ayar Labs demos terabit link for Co-Packaged Optics and chip-to-chip

Ayar Labs demonstrated the industry’s first Terabit per second Wavelength Division Multiplexing (WDM) optical link with its TeraPHY optical I/O chiplet and SuperNova multi-wavelength optical source. The demonstration shows a fully functional TeraPHY chiplet with 8 optical ports running error free without Forward Error Correction (FEC) for a total bandwidth of 1.024 Tbps and at less than 5 pJ/bit energy efficiency. “This is yet another industry...

GlobalFoundries adapts silicon photonics for quantum computing

GlobalFoundries is now manufacturing the silicon photonic and electronic chips that form the foundation of PsiQuantum's Q1 quantum computer.

PsiQuantum, a start-up based in Palo Alto, California, aims to be the first to deliver a commercially viable quantum computer with one million qubits.

PsiQuantum and GF have now demonstrated the ability to manufacture core quantum components, such as single-photon sources and single-photon detectors, with precision and in volume, using the standard manufacturing processes of GF’s semiconductor fab. The companies have also installed proprietary production and manufacturing equipment in two of GF’s 300mm fabs to produce thousands of Q1 silicon photonic chips at its facility in upstate New York, and state-of-the-art electronic control chips at its Fab 1 facility in Dresden, Germany.

PsiQuantum’s Q1 system represents breakthroughs in silicon photonics, which the company believes is the only way to scale to 1 million-plus qubits and beyond and to deliver an error-corrected, fault-tolerant, general-purpose quantum computer.

“In the past year, we have experienced a decade of technological change. Now, due to the digital transformation and the explosion of data we are faced with problems that require quantum computing to further accelerate the Renaissance of Compute,” said Amir Faintuch, senior vice president and general manager of Compute and Wired Infrastructure at GF. “PsiQuantum and GF’s partnership is a powerful combination of PsiQuantum’s photonic quantum computing expertise and GF’s silicon photonics manufacturing capability that will transform industries and technology applications across climate, energy, healthcare, materials science, and government.”

“This is a major achievement for both the quantum and semiconductor industries, demonstrating that it’s possible to build the critical components of a quantum computer on a silicon chip, using the standard manufacturing processes of a world-leading semiconductor fab,” said Pete Shadbolt, chief strategy officer and co-founder of PsiQuantum. “When we first envisioned PsiQuantum, we knew that scaling the system would be the existential question. Together with GLOBALFOUNDRIES, we have validated the manufacturing path for silicon photonics and are confident that by the middle of this decade, PsiQuantum will have completely stood up all the manufacturing lines and processes necessary to begin assembling a final machine.”

Wednesday, July 21, 2021

GlobalFoundries plans new $1 billion fab expansion in New York

GlobalFoundries (GF) announced its expansion plans for its most advanced manufacturing facility in upstate New York.

GF will invest $1 billion to immediately add an additional 150,000 wafers per year within its existing Fab 8 to help address the global chip shortage. Following that, GF plans to construct a new fab that will create more than 1,000 new high-tech jobs. 

GF recently announced new fab in Singapore and $1 billion planned investment to expand in Germany.

"Our expansion and job creation in Malta requires a new economic model, based on the bold public-private partnerships being championed in Washington by visionary leaders Senator Schumer and Secretary Raimondo, as well as close collaboration with our customers," said GF CEO Tom Caulfield. "Our industry is expected to grow more in the next decade than it did in the past 50 years and GF is stepping up to do its part as we work together to address the growing demand for technology innovation for the betterment of humanity. We are honored to be joined by government and automotive leaders, national security experts, and our valued customers to continue the critical discussions needed to create a reliable supply of American-made chips to support the U.S. economy and national security."


"I've led the fight to establish historic federal incentives for semiconductor manufacturing and R&D to strengthen the domestic semiconductor supply chain that is critical to our national security and global competitiveness, including addressing the chip shortage impacting industries across the economy, all in hopes of bringing us to announcements like this today," said Sen. Schumer. "As Majority Leader, I worked hard with companies like GlobalFoundries to craft and pass the bipartisan U.S. Competition and Innovation Act, providing $52 billion to expand the domestic semiconductor industry and supercharge the GlobalFoundries expansion of Fab 8 and building a new fab in Malta. Today's announcement is a win-win-win: a win for jobs in the Capital Region, a win for GlobalFoundries, and a win for U.S. government, automakers, and other critical industries that desperately need chips."


 

Sunday, June 13, 2021

GLOBALFOUNDRIES and GlobalWafers increase 300mm wafer supply

GLOBALFOUNDRIES announced an $800 million agreement with GlobalWafers to add 300mm silicon-on-insulator (SOI) wafer manufacturing and expand existing 200mm SOI wafer production at GWC’s MEMC facility in O’Fallon, Missouri. The 300mm pilot line is on track to be completed in Q4 this year.

In particular, the 300mm wafers made at GWC’s MEMC site in Missouri will be used at GF’s most advanced manufacturing facility, Fab 8 in Malta, New York, and the 200mm wafers made at the Missouri site will be used at GF’s Fab 9 in Essex Junction, Vermont. 



GLOBALFOUNDRIES said these wafers will be used across a range of applications including 5G smartphones, wireless connectivity, automotive radar, and aerospace.


Wednesday, May 5, 2021

GlobalFoundries adapts silicon photonics for quantum computing

GlobalFoundries is now manufacturing the silicon photonic and electronic chips that form the foundation of PsiQuantum's Q1 quantum computer.

PsiQuantum, a start-up based in Palo Alto, California, aims to be the first to deliver a commercially viable quantum computer with one million qubits.

PsiQuantum and GF have now demonstrated the ability to manufacture core quantum components, such as single-photon sources and single-photon detectors, with precision and in volume, using the standard manufacturing processes of GF’s semiconductor fab. The companies have also installed proprietary production and manufacturing equipment in two of GF’s 300mm fabs to produce thousands of Q1 silicon photonic chips at its facility in upstate New York, and state-of-the-art electronic control chips at its Fab 1 facility in Dresden, Germany.

PsiQuantum’s Q1 system represents breakthroughs in silicon photonics, which the company believes is the only way to scale to 1 million-plus qubits and beyond and to deliver an error-corrected, fault-tolerant, general-purpose quantum computer.

“In the past year, we have experienced a decade of technological change. Now, due to the digital transformation and the explosion of data we are faced with problems that require quantum computing to further accelerate the Renaissance of Compute,” said Amir Faintuch, senior vice president and general manager of Compute and Wired Infrastructure at GF. “PsiQuantum and GF’s partnership is a powerful combination of PsiQuantum’s photonic quantum computing expertise and GF’s silicon photonics manufacturing capability that will transform industries and technology applications across climate, energy, healthcare, materials science, and government.”

“This is a major achievement for both the quantum and semiconductor industries, demonstrating that it’s possible to build the critical components of a quantum computer on a silicon chip, using the standard manufacturing processes of a world-leading semiconductor fab,” said Pete Shadbolt, chief strategy officer and co-founder of PsiQuantum. “When we first envisioned PsiQuantum, we knew that scaling the system would be the existential question. Together with GLOBALFOUNDRIES, we have validated the manufacturing path for silicon photonics and are confident that by the middle of this decade, PsiQuantum will have completely stood up all the manufacturing lines and processes necessary to begin assembling a final machine.”

Wednesday, December 2, 2020

Ayar Labs hits key milestone for chip-to-chip optical connectivity

 Ayar Labs demonstrated its patented monolithic electronic/photonic solution on Globalfoundries' next-gen photonics solution based on its 45nm platform. 

The companies said this industry-first demonstration is a key milestone in providing chip-to-chip optical connectivity at scale. The two companies began working together in 2015 with a commitment to collaborate and commercialize differentiated silicon photonics solutions for greenfield applications that would require extreme bandwidth density (high data throughput in a small physical package) at low latency and high energy efficiency.

“Ayar Labs has been perfecting our micro-ring based monolithic electronic/photonic solution for nearly a decade. But the true commercial potential is realized when coupled with a 300mm semiconductor fabrication process that delivers the performance, reliability, and cost advantages that we and our customers require,” says Charles Wuischpard, CEO, Ayar Labs. “This is yet another industry-first result that solidifies our leadership for this market opportunity.”

“Ayar Labs is an important partner of GLOBALFOUNDRIES,” says Anthony Yu, Vice President of Silicon Photonics at GF. “As collaborators, we’ve incorporated their requirements for PDK and process optimizations while providing early access to our next-generation process. Together, we will unlock a larger market opportunity and realize chip-to-chip optical I/O solutions that will enable higher bandwidth and faster connection for high performance compute applications.”

Over the last 18 months, Ayar Labs has been working with select semiconductor manufacturers, systems builders, and end users on co-design partnerships. The company is now announcing an expanded sampling program of its next-generation chiplet developed on GF’s latest silicon photonics manufacturing process that will be available to a broader group by request at ayarlabs.com/starterkit/

Dr. Mark Wade, President and CTO of Ayar Labs, will be sharing details of this industry first demonstration at ECOC 2020 as part of his presentation on ‘Silicon photonic chiplets for chip-to-chip communications’ on Tuesday, December 8, from 16:20 – 16:40 (CET). A video of the demonstration will also be made available at this time.

http://www.ayarlabs.com

Lockheed Martin Ventures invests in Ayar Labs

Lockheed Martin Ventures has made a strategic investment in Ayar Labs, a start-up that is developing  monolithic in-package optical I/O (MIPO) solution for applications that require high bandwidth, low latency and power efficient short reach interconnects. Financial terms were not disclosed.

Ayar Labs publicly demonstrated its monolithic electronic photonic TeraPHY chiplet at the Supercomputing 2019 conference and is now working with select semiconductor manufacturers, OEM systems builders, and end users on sampling and co-design partnerships in 2020. The company is based in Santa Clara, California.

“We are excited to welcome Lockheed Martin Ventures as a strategic investor,” said Charles Wuischpard, CEO of Ayar Labs. “Working with key system integrators like Lockheed Martin, who really understand the value of our solution and how to design it into future complex systems, is incredibly important. In that sense, we view this relationship as more than funding alone, but as an important long-term working relationship as well.”

Ayar Labs selected for Intel’s DARPA PIPES Project

Ayar Labs has been selected as Intel’s optical I/O solution partner for their recently awarded DARPA PIPES (Photonics in Package for Extreme Scalability) project.

The PIPES project aims to develop integrated optical I/O solutions co-packaged with next generation FPGA/CPU/GPU and accelerators in Multi-Chip Packages (MCP) to provide extreme data rates (input/output) at ultra-low power over much longer distances than supported by current technology. In the first phase of the project, the Ayar Labs TeraPHY chiplet will be co-packaged with an Intel FPGA using the AIB (Advanced Interconnect Bus) interface and Intel’s EMIB silicon-bridge packaging. “We’re seeing an explosion of Datacenter workloads that have an insatiable demand for bandwidth and the need to connect devices at rack-scale distances,” said Vince Hu, VP of Strategy and Innovation for Intel’s FPGA products. “The best way to do that is with optical interconnect and by using an Ayar Labs chiplet(s), we can achieve very high bandwidth at low latency and low power consumption.”

“Bringing optical connectivity all the way into the CPU/SOC package has long been one of the ‘Holy Grail’ projects in High Performance and Hyperscale Computing, as it unleashes the performance of ever more powerful computing and network processors and removes a major bottleneck and set of constraints in systems architecture and design,” said Charles Wuischpard, CEO of Ayar Labs, “Moreover, the energy consumed in moving data through a system is now very significant and growing, and the best way to manage that is to move the data optically from end to end. We are pleased to be selected by Intel as the optical solution for their DARPA PIPES project and look forward to a multi-year collaboration.”

The TeraPHY chiplet is manufactured on GLOBALFOUNDRIES' 45nm platform, which enabled Ayar Labs to build a monolithic, single-die solution that integrates both electrical and optical photonic circuits and devices on a single chip.

“We have worked in close collaboration with Ayar Labs to deliver a new class of integrated electronic, photonics solutions,” said Anthony Yu, vice president of Computing and Wired Infrastructure at GF. “Going forward, we’re excited to work with the pioneers at Ayar Labs to continue disrupting the market by combining our next generation 45nm platform, targeted to future CMOS-based photonics solutions, with their differentiated technology that will push the limits of chip communication bandwidth for high-performance computing, cloud and AI applications.”