One of the hottest topics at OFC22 was 800G (2x400G), enabled by 112Gbps electrical lanes, explains Steve Rumsby, Demo Architect, Spirent.
A multivendor interoperability demo was hosted by the Ethernet Alliance.
https://youtu.be/feZi4ipf4jQ
Showing posts with label #OFC22. Show all posts
Showing posts with label #OFC22. Show all posts
Sunday, March 27, 2022
Sunday, March 20, 2022
What's hot at OFC22? 2022 Ethernet Roadmap
Users fully expect Ethernet to work -- just to work -- even as it increases in speeds and as it enters new application areas, says Orshi Abraham, Marketing Chair, Ethernet Alliance. Multivendor interoperability is key to continued success.
The 2022 Ethernet Roadmap was released at OFC22.
Thursday, March 17, 2022
What's hot at OFC22? SENKO on dense fiber connectors for CPO
Co-packaged optics (CPO) was one of the hottest topics at OFC, as evidenced by the many visitors at SENKO's booth who stopped by to discuss the latest requirements for high-density fiber interconnects, says Emmanuel Kolczynski, Application Engineering Manager, SENKO.
At OFC, SENKO showcased its SN-MT connector for CPO applications. Here is an overview.
Wednesday, March 16, 2022
What's hot at OFC22? Flexi Circuit Fiber Shuffle
Tom Mitcheltree, Manager, Application Engineering, US Conec, provides an overview of a new white paper with Optec describing a next gen, flexi circuit fiber shuffle for high-density switches.
Tuesday, March 15, 2022
What's hot at OFC22? Ayar Labs on Optical I/O
There is a lot of discussion about optical I/O and the challenge of getting photonics integrated much closer to compute units, says Mark Wade, co-founder and CTO, Ayar Labs.
Last year, Ayar Labs demonstrated its end-to-end, DWDM micro-ring solution for optical I/O. This year, it's clear that big parts of the industry are heading in this direction.
Some highlights for the ecosystem include GlobalFoundries newly announced photonics platform, a partnership with Lumentum to build CW-DWM MSA compliant laser modules, an MSA-compliant laser module built with MACOM, and new projects with HPE focused on optical I/O designs.
Lumentum and Ayar Labs target external light sources for CPO
Lumentum and Ayar Labs announced a strategic collaboration agreement to deliver CW-WDM MSA compliant external laser sources in high volume. “Co-packaged optics to replace traditional copper interconnects is a massive new market opportunity broadly recognized by the industry and one that Lumentum is well-positioned to address with our proven laser technologies and manufacturing scale,” said Walter Jankovic, Senior Vice President and General Manager...
What's hot at OFC22? Broadcom on Co-packaged optics
The demonstrations and discussions at OFC22 reveal a significant interest in co-packaging, says Rebecca Schaevitz, Product Line Manager & Principal Engineer, Broadcom.
We're seeing the first results and now the debate is shifting from whether" co-packaging will to happen" to "when co-packaging will happen."
Monday, March 14, 2022
What's hot at OFC22? Nokia on IPoDWDM
The arrival of 400ZR and 400ZR+ optics will enable new network architectures, says Heidi Adams, Head of IP/Optical Marketing, Nokia, and the idea of IP-over-DWDM has popped up on the radar again.
The hyperscalers, in particular, see a pathway for using these new optics to drive greater efficiencies in their networks.
At OFC, Nokia introduced a Coherent Routing solution for service providers that is enabled by 400ZR, 400ZR+, and, in the future, 800GZR. Here is an overview.
Nokia shows its next-gen packet optical transport network (P-OTN)
Nokia announced a series of upgrades for its next-generation packet optical transport network (P-OTN) solutions needed by CSPs offering wholesale services.Upgrades to Nokia’s 1830 PSS-x solutions include a doubling of switching capacity up to a market-leading 48 Tbps, new wavelength division multiplexing (WDM) uplinks based on Nokia’s fifth-generation Photonic Service Engines (PSE-V) and expanding the range of wholesale service options with...
What's hot at OFC22? GlobalFoundries on Co-packaged optics
The proof-point for co-packaged optics are here, says Anthony Yu, VP of Computing and Wired Infrastructure, GlobalFoundries.
Yu discusses GlobalFoundries' newly unveiled next generation silicon photonics platform and active design wins with major customers, including collaborations with Broadcom, Cisco Systems, Marvell, NVIDIA, Ayar Labs, Lightmatter, PsiQuantum, Ranovus and Xanadu.
The Consortium for Onboard Optics (COBO) has been instrumental in letting people know the importance of actually placing the photonics chip in proximity of the ASIC. We're also seeing the proof point of putting chipsets of a switch or GPUs.
Lumentum and Ayar Labs target external light sources for CPO
Lumentum and Ayar Labs announced a strategic collaboration agreement to deliver CW-WDM MSA compliant external laser sources in high volume. “Co-packaged optics to replace traditional copper interconnects is a massive new market opportunity broadly recognized by the industry and one that Lumentum is well-positioned to address with our proven laser technologies and manufacturing scale,” said Walter Jankovic, Senior Vice President and General Manager...
GlobalFoundries unveils next gen silicon photonics platform
GlobalFoundries unveiled its next generation silicon photonics platform and active design wins with major customers, including collaborations with Broadcom, Cisco Systems, Marvell, NVIDIA, Ayar Labs, Lightmatter, PsiQuantum, Ranovus and Xanadu. The platform enables a high level of integration onto a photonics integrated circuit (PIC). It also supports innovative packaging solutions, such as the passive attachment for larger fiber arrays, support...
What's hot at OFC22? Lightriver on IPoDWDM
Hot trends at OFC22 include IPoDWDM, 400ZR, disaggregated networking, pluggable, next gen optical line systems, etc., says Travis Ewert, Chief Operating Officer, LightRiver Software.
What's not hot are all of the silos of disaggregated technology. LightRiver steps in with tools for bringing it all together.
Lightriver supplies multi-vendor, Factory Built Networks and netFLEX vendor neutral, Optical Domain Control Software solutions.
What's hot at OFC22? Sabic on new resins for optical interconnects
Optical interconnects are hot at OFC, says Shawn Lee, Senior Manager, New Business Development, Sabic.
Key challenges with optical interconnects are efficiency and scalability. Sabic has introduced a new resin that addresses these challenges thanks to its thermal properties and high refractive index. The resin is suitable for micro molding for optical interconnect components.
What's hot at OFC22? AOI's David Chen on CPO and NPO
Two of the hot items at OFC22 were faster pluggable transceivers (800G and even 1.6T in the future) and Co-Packaged Optics (CPO), says David Chen, AVP, Strategic Marketing & Standard Office for Transceivers, AOI.
There was a lot of activity at the OIF booth regarding CPO, external laser source modules -- all related to COBO's current working groups. This video includes a diagram showing the evolution of COBO and NPO technologies.
Sunday, March 13, 2022
What's hot at OFC22? Ranovus on Co-Packaged Optics
Co-Packaged Optics are a center point of discussions at #OFC22, says Hamid Arabzadeh, President and CEO of Ranovus.
At the event, Ranovus launched its first generation of co-packaged optics, which monolithically integrates an optical engine into a single die, including drivers, TIAs, photodetectors, modulators, and the laser. Ranovus partnered with AMD-Xiliinx to be able to co-package its chip with the Xilinx Versal compute accelerator.
GlobalFoundries unveils next gen silicon photonics platform
GlobalFoundries unveiled its next generation silicon photonics platform and active design wins with major customers, including collaborations with Broadcom, Cisco Systems, Marvell, NVIDIA, Ayar Labs, Lightmatter, PsiQuantum, Ranovus and Xanadu. The platform enables a high level of integration onto a photonics integrated circuit (PIC). It also supports innovative packaging solutions, such as the passive attachment for larger fiber arrays, support...
Ranovus and Xilinx to demo Co-Packaged Optics integration
At this week's OFC event in San Diego, Ranovus will demonstrated its Co-Packaged Optics (CPO) 2.0 integration featuing a Xilinx Versal ACAP its own Ranovus Odin 800Gbps optical engine. The integration eliminates the need for the retimer, resulting in 75% smaller footprint and 40% cost and power consumption savings in the Optical Interconnect.RANOVUS’ Odin is a low latency, high density, and protocol agnostic optical engine that delivers...
What's hot at OFC22? Dan Pitt on Network Disaggregation
Network disaggregation is happening at a rapid pace, but it is having some unintended consequences, says Dan Pitt, President, Palo Alto Innovation Advisors.
One such consequence is that as you disaggregate the hardware, you also disaggregate the software, and means you need CI/CD if there is to be interoperability.
Here’s a look at some disaggregation demos, speaker sessions, and key technology trends at #OFC22.
What's hot at OFC22? Hirose on Multimode Waveguide Interconnects
The Consortium for Onboard Optics (COBO) recently formed a working group to address Multi-mode Waveguide Interconnect System (MWIS) as an alternative to copper traces in printed circuit boards. In this video, Joshua Kihong Kim, Principal Engineer, Photonic Signal Integrity, Hirose, discusses the latest developments.
COBO focuses on Multimode Waveguide Interconnects
The Consortium for On-Board Optics (COBO) has established a new Multi-Mode Waveguide Interconnect System (MWIS) Working Group to focus specifically on the replacement of copper traces with multi-mode waveguides and adding an extra thin interface for Electrical/Optical and Optical/Electrical conversion within close proximity to the electrical component.
"I am very pleased to have kicked off the new Multimode Waveguide Interconnect System (MWIS) Working Group. Although embedded optical waveguides in printed circuit boards have been researched for decades, now is the time for the industry to work together to address the imminent bandwidth and power issues associated with copper interfaces," said Joshua Kihong Kim, Principal Engineer at Hirose Electric and COBO MWIS Working Group Chair. "In the development of on-board optical systems, this is one of the missing pieces of the puzzle, and COBO is stepping up to develop specifications to enable an industry eco-system."
"The growing diversity of optical applications within the Data Center, including machine learning and resource disaggregation, are driving an increased need to enhance high-speed board level interconnect systems with optical waveguide technology. COBO members recognize it is critical for companies to collaborate and provide guidance and specifications for design advancement," said Brad Booth, President at COBO and Principal Engineer, Azure Hardware Architecture at Microsoft. "We welcome interested parties to contact us if they would like understand more about our new MWIS Working Group."
http://onboardoptics.org/
What's hot at OFC22? 3M on Expanded Beam Optics
With all the discussion surrounding silicon photonics and co-packaged optics, and considering the possibility of moving lasers from the faceplate to nearer the switch, it's clear the industry will look for a new generation of reliable connector, says Duane Preiss, Portfolios Marketing Director, 3M. Expanded beam optical is delivering a solution.
Webinar archive: Expanded beam optics
How do you ensure the reliability of a fiber connection to a switch at very high line rates or once co-packaged optics (CPO) solutions come to market? Dust is always a concern, especially at 400G and above, when even a small contamination can lead to magnified disruptions. Reliable optical interconnects are key! The latest OSFP 4.0 spec introduces support for Expanded Beam Optical (EBO) technology, opening up new possibilities.This webinar explores...
3M intros Expanded Beam Ferrule and Connector System
Earlier this month, 3M introduced an Expanded Beam Optical Connector System for single mode and multimode interconnects in next-gen data centers. “We’ve reimagined fiber optic connectors,” said Nick Stacey, Ph.D., global laboratory manager at 3M. “Our ferrule and connector technology is designed to reduce cleaning requirements, to provide design flexibility and to enable the performance necessary for next-generation optical deployment.” The 3M...
Earlier this month, 3M introduced an Expanded Beam Optical Connector System for single mode and multimode interconnects in next-gen data centers. “We’ve reimagined fiber optic connectors,” said Nick Stacey, Ph.D., global laboratory manager at 3M. “Our ferrule and connector technology is designed to reduce cleaning requirements, to provide design flexibility and to enable the performance necessary for next-generation optical deployment.” The 3M...
OFC22 attracted 8,000 participants
OFC, which was held 06-10 March in San Diego, California attracted a 8,000 participants and 430 exhibiting companies.
Thursday, March 10, 2022
What's hot at OFC22? Integrated photonics/electronics
Think embedded optics, co-packaged optics (CPO), on-board optics -- building block technologies for the next generation of integrated photonics and electronics, says Brad Booth, President of the Consortium for On-board Optics (COBO) and Principal Network Architect at Microsoft.
New connectivity solutions.
What's hot at OFC22? Coherent Optical Engines
Think of the enormous optical capacity enabled by coherent optical engines, says Tim Doiron, Senior Director, Solution Marketing, Infinera.
What's hot at OFC22? Co-packaged optics and 400ZR
Co-packaged optics and 400ZR, says Josef Berger, Associate Vice President, Optical and Copper Connectivity Group, Marvell.
It's all about the cloud.
Wednesday, March 9, 2022
MaxLinear, MACOM and II-VI eye 800G modules
MaxLinear, MACOM and II-VI, demonstrated 100G/lane multi-mode links targeted for 800G optical modules. These links incorporate the MaxLinear Keystone 5nm 800G DSP, MACOM 100G/lane TIAs and VCSEL drivers and II-VI latest 850nm VCSELs and photodetectors.
MaxLinear's Keystone family of 5nm PAM4 DSPs includes 400G and 800G variants with and without integrated laser drivers. This demonstration uses the 800G DSP, in conjunction with the MACOM four-channel VCSEL drivers (MALD-39435) and four-channel TIAs (MATA-39434), along with II-VI VCSELs and photodiodes.
"We are excited to demonstrate the use of our Keystone 800G DSP for multi-mode links," said Drew Guckenberger, Vice President of Optical Interconnect at MaxLinear. "The market demand for 100G/lane multi-mode solutions is projected to exceed one million units by 2024, and we're demonstrating the ability to provide solutions now for customers in this market."
"The combined MACOM and MaxLinear IC solutions for 8x100G multi-mode links can provide the ability for customers to achieve 800G QSFP-DD and OSFP optical modules at a total power consumption under 11 Watts," said Marek Tlalka, Senior Director of Product Marketing at MACOM. "This is a significant reduction over single-mode solutions for these power-sensitive data center applications."
"Today, we are demonstrating the high-performance capability of our latest short-reach optical components and how we exceed the challenging performance requirements of next-generation 100G/lane short-reach optical links," said Vipul Bhatt, Vice President of Marketing, Datacom Vertical, at II-VI. "Demonstrating interoperability with products by MaxLinear and MACOM shows our commitment to serve the market at all levels of the value chain."
