ST and GlobalFoundries target 300mm fab in France

STMicroelectronics and GlobalFoundries agreed to create a new, jointly-operated 300mm semiconductor manufacturing facility adjacent to ST’s existing 300mm facility in Crolles, France. This facility is targeted to ramp at full capacity by 2026, with up to 620,000 300mm wafer per year production at full build-out (~42% ST and ~58% GF).

The new facility will support several technologies, in particular FD-SOI-based technologies, and will cover multiple variants. This includes GF’s FDX technology and ST’s comprehensive technology roadmap down to 18nm, which are expected to remain in high demand for Automotive, IoT, and Mobile applications for the next few decades.

FD-SOI technology has origins in the Grenoble (France) area. It has been part of ST technology and product roadmap in its Crolles facility since the early beginnings, and it was later enabled with differentiation and commercialized for manufacturing at GF’s Dresden facility. FD-SOI offers substantial benefits for designers and customers, including ultra-low power consumption as well as easier integration of additional features such as RF connectivity, mmWave and security.

ST and GF will receive significant financial support from the State of France for the new facility. This facility will strongly contribute to the objectives of the European Chips Act, including the goal of Europe reaching 20% of worldwide semiconductor production by 2030. 

“This new manufacturing facility will support our $20 billion+ revenue ambition. Working with GF will allow us to go faster, lower the risk thresholds, and reinforce the European FD-SOI ecosystem. We will have more capacity to support our European and global customers as they transition to digitalization and decarbonization” said Jean-Marc Chery, President and CEO of STMicroelectronics. “ST is transforming its manufacturing base. We already have a unique position in our 300mm wafer fab in Crolles, France which will be further strengthened by today’s announcement. We continue to invest into our new 300mm wafer fab in Agrate (near Milan, Italy), ramping up in H1 2023 with an expected full saturation by end 2025, as well as in our vertically integrated silicon carbide and gallium nitride manufacturing.”

https://www.investors.gf.com

What's hot at OFC22? GlobalFoundries on Co-packaged optics

Monday, March 14, 2022  #OFC22, COBO, GlobalFoundries, Silicon  

The proof-point for co-packaged optics are here, says Anthony Yu, VP of Computing and Wired Infrastructure, GlobalFoundries. Yu discusses GlobalFoundries' newly unveiled next generation silicon photonics platform and active design wins with major customers, including collaborations with Broadcom, Cisco Systems, Marvell, NVIDIA, Ayar Labs, Lightmatter, PsiQuantum, Ranovus and Xanadu.The Consortium for Onboard Optics (COBO) has been instrumental...

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Quantenna’s 4x4 802.11ac Paired with STMicroelectronics’ STB Solution

Quantenna Communications and STMicroelectronics announced a single board Wi-Fi enabled set-top box reference design platform that features Quantenna’s QSR1000 802.11ac Wi-Fi chipset and ST’s STiH206 Liege platform.

Using Quantenna’s 4x4 802.11ac Wi-Fi, the combined solution will deliver the world’s fastest and most reliable wireless streaming of bandwidth-intensive data, such as video content.

Some highlights:

• Fastest Wi-Fi with 1.7 Gbps total throughput
• Wave 2 802.11ac technology
• Lowest cost eBOM incorporating 16 bit DDR3
• Full featured ST HbbTV pre-integrated solution with the widest choice of CAS certification and middleware adaptations
• Supports Interactive Services, L2 Cache frees up resources for interactive applications 

http://www.quantenna.com/pressrelease-09_12_13.html

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ST-Ericsson Split Completed

Ericsson and STMicroelectronics completed the previously announced break-up of their joint venture, ST-Ericsson.

Effective August 2, 2013 Ericsson has taken on the design, development and sales of the LTE multimode thin modem solutions, including 2G, 3G and 4G interoperability. In total, approximately 1,800 employees and contractors have joined Ericsson.

ST has taken on the existing ST-Ericsson products, other than LTE multimode thin modems, and the GNSS (Global Navigation Satellite System) connectivity solution sold to a third party, and related business as well as certain assembly and test facilities. In total, approximately 1,000 employees have joined STMicroelectronics.

http://www.ericsson.com
http://www.st.com

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ST Exits Wireless Broadband to Focus on Sensors, Embedded Processing

STMicroelectronics unveiled a new corporate strategy under which it will exit the ST-Ericsson partnership and the wireless broadband market, choosing instead to focus on sensors and embedded processing.

“Our new strategy is centered on leadership in sense and power and automotive products, and in embedded-processing solutions. Our specific focus is on five product areas: MEMS and sensors, smart power, automotive products, microcontrollers, and application processors including digital consumer," stated Carlo Bozotti, President and CEO of ST.

The company will be organized in two product segments: Sense & Power and Automotive Products; and Embedded Processing Solutions.

Sense & Power includes MEMS and sensors, power discrete and advanced analog products;  as well as Automotive Products, including powertrain, safety, body and infotainment.

In Embedded Processing Solutions the company will focus on the core of the electronics systems rather than on wireless broadband access. The Embedded Processing Solutions segment includes microcontrollers, imaging products, digital consumer products, application processors and digital ASICs.

ST said it expects both product segments to be profitable and to generate cash. In particular, Embedded Processing Solutions will turn to profitability leveraging on a stronger product and technology focus, expanded customer base and manufacturing synergies between microcontrollers and digital products.

For its part, Ericsson said it is negotiating with ST concerning a suitable outcome of their ST-Ericsson joint venture. Ericsson believes that the modem technology, which it originally contributed to the Joint Venture, has a strategic value for the wireless industry, and that a successful market introduction of new LTE modems is needed in the market.

http://www.st.com
http://www.ericsson.com

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