Showing posts with label Broadcom. Show all posts
Showing posts with label Broadcom. Show all posts

Thursday, December 8, 2022

Broadcom reports Q4 revenue of$8.9 billion, infrastructure silicon remains strong

Broadcom reported Q4 revenue of $8.930 billion, up 21% from $7.407 billion for the same period a year earlier. Earnings per common share - diluted amounted to $7.83, compared with $4.45 a year earlier.

  •  Semiconductor solution sales amounted to $7.092 billlion compared with $5.634 billion a year earlier
  • Infrastructure software sales amounted to $1.838 billion compared with $1.773 billion a year earlier

"Broadcom's fiscal year 2022 revenue grew 21% year-over-year to a record $33.2 billion, as a result of strong demand from hyperscale, service providers, and enterprise," said Hock Tan, President and CEO of Broadcom Inc. "This growth was driven by our strong partnerships with customers and accelerated adoption of our next generation technologies. As we look into fiscal 2023, our increased R&D investments during the preceding years position us to extend our leadership in next generation products within the end markets we address."

"In fiscal 2022 we achieved record adjusted EBITDA margin of 63%, generating $16.3 billion in free cash flow or 49% of revenue, demonstrating our stable and focused business model," said Kirsten Spears, CFO of Broadcom Inc. "Consistent with our commitment to return cash to shareholders, we will resume our authorized share repurchase programs for the remaining $13 billion, and we are increasing our quarterly common stock dividend by 12 percent to $4.60 per share for fiscal year 2023. The target fiscal 2023 annual common stock dividend of $18.40 per share is a record, and the twelfth consecutive increase in annual dividends since we initiated dividends in fiscal 2011."

Cash from operations of $4,583 million for the fourth quarter, less capital expenditures of $122 million, resulted in $4,461 million of free cash flow, or 50 percent of revenue.

https://investors.broadcom.com/news-releases/news-release-details/broadcom-inc-announces-fourth-quarter-and-fiscal-year-2022

Sunday, September 18, 2022

ECOC22: Broadcom’s Silicon Photonics Chiplets in Package

What's Next at #ECOC22 for Broadcom? 

Broadcom's Silicon Photonics Chiplet in Package (SCIP). 

Rebecca Schaevitz, Product Line Manager & Principal Engineer at Broadcom, provides an introduction. 

Learn more about the Consortium for Onboard Optics and why your company should join:

https://www.onboardoptics.org

https://youtu.be/UWmcFN_y25w

Thursday, September 8, 2022

Intel and Broadcom host cross-vendor Wi-Fi 7 demo topping 5 Gbps

Intel and Broadcom hosted a cross-vendor Wi-Fi 7 demonstration that showed over-the-air speeds greater than 5 Gbps. The trial used an Intel Core processor-based laptop with a Wi-Fi 7 solution connected to a Broadcom Wi-Fi 7 access point.

Wi-Fi 7 leverages new features including wider 320 MHz channels in unlicensed 6GHz spectrum, higher order 4K QAM data modulation, simultaneous connections across multiple bands with multi-link operation and improved channel utilization efficiency with multi-resource unit puncturing.

“We are proud to highlight how next-generation Wi-Fi 7 can make new mobile PC experiences possible. Industry collaboration is essential to ensure we deliver on the promises of this new wireless technology. We would like to thank our colleagues at Broadcom for their great technical cooperation, which helped enable this unprecedented, first-of-its-kind demonstration of ultra-high speed and ultra-low latency Wi-Fi 7,” said Carlos Cordeiro, Intel Fellow and Wireless CTO, Client Computing Group, Intel.

Vijay Nagarajan, vice president, Wireless Connectivity Division, Broadcom, said, “Today’s milestone sends a clear message: the ecosystem is ready and Wi-Fi 7 is here to deliver extraordinary capacity and blazing fast speeds to extend gigabit broadband. The reliable, low latency communication provided by Wi-Fi 7 is a key element of Broadcom's vision for connecting everything as the Internet evolves to its next iteration replete with immersive experiences. Industry collaboration is key to making this unprecedented connectivity a reality and we were delighted to work with Intel to achieve another industry first.”

https://www.intel.com/content/www/us/en/products/docs/wireless/wi-fi-7.html


Tuesday, September 6, 2022

Broadcom's new Trident 4C offers 2.8 Tbps flow anomaly detection

Broadcom announced shipment of its Trident 4C Ethernet switch ASIC, a 12.8 terabits/second security switch capable of analyzing all traffic at line rate. 

Broadcom said its new switching ASIC is able to inspect 100 percent of the traffic, even at the extreme bandwidths found in network cores. Trident 4C integrates a purpose-built analytics engine capable of 170 billion operations per second with the ability to detect suspicious flow anomalies at line rate. This engine, enabled by default, has no impact on switch operation or performance.

  • “Sampling-based approaches to security are inherently flawed. We decided to eliminate the tradeoff between security and performance,” said Ram Velaga, senior vice president and general manager, Core Switching Group, Broadcom. “Trident 4C is a natural extension of our innovative portfolio. We started with Layer-2 switching, progressed to Layer-3 routing, and now are adding Layer 4-7 security as we climb the network OSI stack.”

Trident 4C highlights

  • Connection-aware monitoring of 500k+ active flows at 5.4 billion packets/second
  • 170 billion ALU operations per second for advanced connection fingerprinting
  • 4M state flow metrics counters set by a programmable arithmetic engine
  • 1M exact-match policy ACLs
  • Suitable for fixed-configuration and chassis-based designs
  • SONiC and SAI readiness for rapid integration into high-capacity networks

https://www.broadcom.com/company/news/product-releases/60491

Broadcom advances its co-packaged optics network switch

Broadcom will provide its new 25.6-Tbps Humboldt co-packaged optics (CPO) network switch to Tencent.Humboldt features Broadcom’s StrataXGS Tomahawk 4 switch chip directly coupled and co-packaged with four 3.2-Tbps Silicon Photonics Chiplets In Package (SCIP) optical engines. Tencent has defined the system architecture and worked closely with Broadcom to develop hardware and software for field deployment of the 25.6-Tbps CPO switch system. Ruijie...

Broadcom delivers 51.2 Tbps Tomahawk 5

Broadcom has begun customer shipments of its StrataXG Tomahawk 5 switch series, providing 51.2 Tbps of Ethernet switching capacity in a single, monolithic chip.“Delivering the world’s first 51.2 Tbps switch two years after we released Tomahawk 4, the industry’s first 25 Tbps switch, is a testament to the outstanding execution and innovation by the Broadcom team,” said Ram Velaga, senior vice president and general manager, Core Switching Group, Broadcom....

Broadcom ships 7nm Trident 4 programmable Ethernet switching silicon 

Broadcom is now shipping its StrataXGS Trident 4 BCM56880 switch silicon with capacity scaling from 2.0 to 12.8 terabits per second (Tb/s). The new silicon, which boasts the industry’s highest Ethernet switching performance, also brings compiler-programmable packet processing and telemetry capabilities as well as compatibility with earlier generation Trident chips. This enables enterprises to utilize merchant silicon-based systems throughout their...


Monday, August 22, 2022

Broadcom advances its co-packaged optics network switch

Broadcom will provide its new 25.6-Tbps Humboldt co-packaged optics (CPO) network switch to Tencent.

Humboldt features Broadcom’s StrataXGS Tomahawk 4 switch chip directly coupled and co-packaged with four 3.2-Tbps Silicon Photonics Chiplets In Package (SCIP) optical engines. 

Tencent has defined the system architecture and worked closely with Broadcom to develop hardware and software for field deployment of the 25.6-Tbps CPO switch system. Ruijie Networks Co., Ltd. will verify the design, manufacture and test the full CPO switch system, and then provide the finished product to Tencent. 

The companies plan to demonstrate the jointly developed 25.6-Tbps CPO switch system at the China International Optoelectronic Exposition (CIOE) in Shenzhen from September 7th to 9th.

Humboldt 25.6-Tbps CPO Switch Product Highlights:

  • 2RU system design with high efficiency air cooling to support 4x3.2-Tbps optical CPO interfaces routed to 16 MPO connectors and 32x400G electrical QSFP112 ports
  • CPO engine to front-panel routing supports both traditional fiber and flexible printed fiber (FPF) solutions
  • System design compatible to support multiple remote laser modules (RLM)
  • More than 50% optical interconnect power consumption savings compared to standard pluggable optics solutions
  • Production ready for data center deployment

Broadcom said CPO will become increasingly important for data center switches as copper interconnects approach a reach limit.  Likewise, traditional pluggable optical transceivers require high power to equalize signal impairments incurred on a signal as it traverses long traces and through multiple connector discontinuities in a standard switch system. 

The 25.6-Tbps Humboldt CPO switch leverages Broadcom's uncooled continuous wave (CW) laser at 1310 nm for silicon photonics, delivering significant power efficiency and cost gains.

Broadcom also notes that it has over 15 external partners currently working on its SCIP and CPO designs.

“We are pleased to announce our strategic partnership with Tencent as we enable the industry’s first 25.6-Tbps CPO system for hyperscale data center field deployment,” said Near Margalit, Vice President and General Manager, Optical Systems Division, Broadcom. “We expect to continue to innovate and extend our market leadership position with Tencent as we migrate to 51.2-Tbps switch CPOs and next generation 200G/lane PAM-4 applications.”

“Customer demands for higher bandwidth have pushed Tencent to perpetually scale our network,” said Sage Zou, Vice President of Tencent Cloud. “We are glad to partner with Broadcom on CPO based technology, which will bring not only higher bandwidth for applications such as AI/ML and HPC, but also it could address the power constraints from the acceleration of growth in new workloads.”

“Addressing the general trend towards chip-scale optical interconnects versus traditional copper-based implementation, CPO technology combines microelectronics and optoelectronics on silicon-based platforms, which can carry more information and transmit longer distances,” said Liu Zhongdong, President and CEO, Ruijie Networks. “CPO switching networks have the advantages of high bandwidth and low power consumption, and Ruijie is glad to participate in the innovation and implementation of this new technology with Tencent & Broadcom.”

https://www.broadcom.com/info/optics/cpo

Sunday, August 21, 2022

Broadcom delivers 51.2 Tbps Tomahawk 5

Broadcom has begun customer shipments of its StrataXG Tomahawk 5 switch series, providing 51.2 Tbps of Ethernet switching capacity in a single, monolithic chip.

“Delivering the world’s first 51.2 Tbps switch two years after we released Tomahawk 4, the industry’s first 25 Tbps switch, is a testament to the outstanding execution and innovation by the Broadcom team,” said Ram Velaga, senior vice president and general manager, Core Switching Group, Broadcom. “Since the introduction of Tomahawk 1 in 2014, Broadcom has consistently executed on doubling the bandwidth approximately every two years. With today’s introduction of the fifth generation Tomahawk family, we are proud to say that a single Tomahawk 5 replaces forty-eight Tomahawk 1 switches in the network, resulting in over 95 percent reduction in power requirements. We applaud our customers, partners, and engineers for making this possible.”

StrataXGS Tomahawk 5 highlights:

  • 64 ports of 800GbE switching and routing.
  • Virtualization of general compute and AI/ML workloads with single-pass VxLAN routing and bridging.
  • Unparalleled physical I/O options using 512 instances of 100G PAM4 SerDes.
  • High-precision PTP and SyncE time synchronization.
  • Six on-chip ARM processors for high-bandwidth, fully-programmable streaming telemetry, and sophisticated embedded applications such as on-chip statistics summarization.
  • Implemented as a monolithic 5nm die

StrataXGS Tomahawk 5 Series Key Features for AI/ML:

  • World’s highest radix of 200GbE ports: 256 ports supported on a single chip, enabling flat, low latency AI/ML clusters.
  • Advanced 51.2 Tbps shared-buffer architecture, providing the highest performance and lowest tail latency for RoCEv2 and other new RDMA protocols.
  • Advanced Broadcom Cognitive Routing, dynamic load balancing, and support for end-to-end congestion control capabilities specifically designed to handle the large, low entropy flows typical of AI/ML workloads.
  • Support for Clos and non-Clos topologies such as torus, Dragonfly, Dragonfly+, and Megafly.
  • Hardware-based link failover

Broadcom said it is targetting the Tomahawk 5 family at the massively shared infrastructure in large data centers, Tomahawk 5 provides AI/ML workload virtualization with features such as single-pass VxLAN routing and bridging. Critical to minimizing job completion time (JCT) for AI/ML workloads, Tomahawk 5 offers features such as Broadcom Cognitive Routing, advanced shared packet buffering, programmable inband telemetry, and hardware-based link failover.

Tomahawk 5’s Cognitive Routing improves network link utilization by automatically and dynamically selecting the most lightly loaded links in the system for every flow that transverses the switch. This is especially important for AI/ML workloads which often have a combination of short-lived mice flows and long-lived, high bandwidth elephant flows with low entropy. 

Tomahawk 5 includes real-time dynamic load balancing that tracks the utilization of all links, both at the switch and downstream in the network, to determine the optimal path for each flow. It also monitors the health of links in hardware and automatically steers traffic away from failed links. These features provide dramatically improved network utilization and reduced congestion, resulting in shortened JCT.

Tomahawk 5 also features extensive programmable inband telemetry on both live traffic and network probes. Real-time metadata can be inserted into traffic at line rate as it traverses the network to collect telemetry on queue size, packet latency, switch utilization, and a variety of other customer-selectable metrics. This metadata can be used for precise end-to-end network congestion control.

To enable the lowest power and lowest cost for physical connectivity, Tomahawk 5 enables a direct 100G PAM4 interface to direct attach copper (DAC), front panel pluggable optics, and co-packaged optics. The flexible, long reach Tomahawk 5 SerDes provides DAC connectivity to all devices within a rack, and even between racks, without the need for retimers or other active components. It can also interface directly to a broad ecosystem of standard front-panel pluggable optical modules.

Tomahawk 5 will be made available with co-packaged optics using Broadcom’s Silicon Photonics Chiplets in Package (SCIP) platform, providing more than 50 percent decrease in the power needed for optical connectivity. Since the same switch silicon provides all these options, customers can choose the optimal I/O for each part of their intra-cluster, inter-cluster, and inter-DC networks with no software porting required.

As part of its announcement, Broadcom showcased statements of support for the Tomahawk 5 from senior execs and network architects at Alibaba Cloud, AT&T, Baidu, Bytedance, Microsoft Azure, Tencent Cloud, Tenstorrent, Arista Networks, H3C, Juniper Networks, Nokia, Accton, Celestica, Delta, Inventec, Ruijie, Quanta Cloud, Wistron, and Ufispace.

https://www.broadcom.com/products/ethernet-connectivity/switching/strataxgs/bcm78900-series

Broadcom ships its 25.6 Tbps Tomahawk 4 

Broadcom has begun commercial shipments of its 25.6 Tbps StrataXGS Tomahawk 4 Ethernet switching silicon -- representing double the bandwidth of any other switch silicon currently on the market. The 25.6 Tbps capacity enables port densities of up to 64 × 400GbE, 128 × 200GbE, 256 × 100GbE, 256 × 40GbE, 256 × 25GbE, or 256 × 10GbE ports. Tomahawk 4, which is implemented in 7nm technology with 512 50G PAM4 SerDes, arrives less than two years after...

Broadcom delivers its 12.8 Tbps Tomahawk 3 switching silicon

Broadcom announced commercial shipments of its StrataXGS Tomahawk 3 Ethernet switch silicon boasting 12.8 Terabits/sec in a single device -- double that of any other switching chip currently in the market. Tomahawk 3 paves the way for high-density, standards-based 400GbE, 200GbE, and 100GbE switching and routing for hyperscale cloud networks. The latest gen silicon is expected to be adopted by leading network equipment OEMs as well as by hyperscale...


Broadcom's Tomahawk 2 Switch Packs 64 Ports of 100GE 

Broadcom announced its StrataXGS Tomahawk II Switching chip -- the highest performance Ethernet switch to date, packing up to 64 ports 100GE or 128 ports of 50GE with SDN-optimized packet switch engines operating at 6.4 Terabits per second. The StrataXGS Tomahawk II  Tomahawk II integrates 256 serdes running at over 25 Gbps, with large on-chip forwarding tables and packet buffer memory.  The chip supports Broadcom's next generation BroadView...



Monday, July 11, 2022

Broadcom announces executive re-shuffle

Thomas H. Krause, President of the Broadcom Software Group, will step down to pursue another role at a privately held enterprise software company. Hock E. Tan, Broadcom's President and CEO, will immediately assume Krause’s responsibilities, and the position of President of Broadcom Software Group will be eliminated.

In addition, the Broadcom announced that Charlie B. Kawwas, Ph.D., currently Chief Operating Officer of the Company, has been named President of the new Semiconductor Solutions Group, overseeing the company’s broad semiconductor portfolio. Dr. Kawwas remains responsible for the company’s global operations and sales for the Semiconductor and Brocade Storage Networking businesses. 

https://investors.broadcom.com/financial-information/broadcom-inc-sec-filings

Broadcom launches its $61 billion bid for VMware

 Broadcom unveiled plans to acquire all of the outstanding shares of VMware in a cash-and-stock transaction that values VMware at approximately $61 billion, based on the closing price of Broadcom common stock on May 25, 2022. In addition, Broadcom will assume $8 billion of VMware net debt. The deal has the support of VMware's Board of Directors, along with Michael Dell and Silver Lake, which own 40.2% and 10% of VMware shares outstanding,The...


Thursday, May 26, 2022

Broadcom launches its $61 billion bid for VMware

 Broadcom unveiled plans to acquire all of the outstanding shares of VMware in a cash-and-stock transaction that values VMware at approximately $61 billion, based on the closing price of Broadcom common stock on May 25, 2022. In addition, Broadcom will assume $8 billion of VMware net debt. The deal has the support of VMware's Board of Directors, along with Michael Dell and Silver Lake, which own 40.2% and 10% of VMware shares outstanding,

The deal would bring together Broadcom's extensive portfolio of networking silicon and software solutions with VMware's leading position in virtualization technology and services. 

Broadcom says the acquisition  will provide enterprise customers an expanded platform of critical infrastructure solutions to accelerate innovation and address the most complex information technology infrastructure needs.

Hock Tan, President and Chief Executive Officer of Broadcom, said, "Building upon our proven track record of successful M&A, this transaction combines our leading semiconductor and infrastructure software businesses with an iconic pioneer and innovator in enterprise software as we reimagine what we can deliver to customers as a leading infrastructure technology company. We look forward to VMware's talented team joining Broadcom, further cultivating a shared culture of innovation and driving even greater value for our combined stakeholders, including both sets of shareholders."

Raghu Raghuram, Chief Executive Officer of VMware, said, "VMware has been reshaping the IT landscape for the past 24 years, helping our customers become digital businesses. We stand for innovation and unwavering support of our customers and their most important business operations and now we are extending our commitment to exceptional service and innovation by becoming the new software platform for Broadcom. Combining our assets and talented team with Broadcom's existing enterprise software portfolio, all housed under the VMware brand, creates a remarkable enterprise software player. Collectively, we will deliver even more choice, value and innovation to customers, enabling them to thrive in this increasingly complex multi-cloud era."

Michael Dell, Chairman of the VMware Board, said, "Together with Broadcom, VMware will be even better positioned to deliver valuable, innovative solutions to even more of the world's largest enterprises. This is a landmark moment for VMware and provides our shareholders and employees with the opportunity to participate in meaningful upside."

A Broadcom investor presentation is online.


https://investors.broadcom.com/static-files/232c0cd2-02d9-4704-bb7b-5659cef67fae

VMware completes spin-Off from Dell Technologies

VMware completed its spin-off from Dell Technologies. The move provides VMware increased freedom to execute its multi-cloud strategy, a simplified capital structure and governance model, and additional operational and financial flexibility. VMware and Dell said they will continue to partner with each other and to continue support/services to mutual customers.“VMware’s mission is to deliver the trusted software foundation that accelerates our customers’...



Webinar replay: Solving the interconnect density bottleneck in 51.2T switch


Webinar replay - first presented on 04-May-2022

With the first generation of 51.2T switches running at 100 Gbps per lane on the horizon, the market will soon be considering the pros and cons of different board design choices for managing so many high capacity channels.  Will co-packaged optics (CPO) or near-packaged optics (NPO) scale to meet the bandwidth density challenge?

In this one-hour webinar, we hear from Dr. Rebecca K. Schaevitz, a Board Member of COBO and a Principal Engineer and Product Line Manager at Broadcom . 

We then hear from Tom Mitcheltree, Advanced Technology Manager at US Conec, a supplier of connector embodiment packages based on standardized and custom optical interconnect ferrules.  

This is the 10th in a series of webinars presented by COBO, the Consortium for On-board Optics, and sponsored by DuPont’s Silicon Valley Technology Center.

Monday, May 23, 2022

Broadcom delivers 50G automotive Ethernet switch

Broadcom  introduced its latest Scorpio Ethernet switch for building next-generation in-vehicle networks based on zonal architecture and capable of supporting large numbers of high-performance sensors and displays.

Broadcom's BCM8958X, which represents the company's 6th generation of automotive Ethernet switch and third generation in its Scorpio family, features 16 Ethernet ports of which up to six are 10 Gbps capable, as well as integrated 1000BASE-T1 and 100BASE-T1 PHYs, providing greater flexibility and switching capacity needed to support automotive zonal electronic control unit (ECU) and central compute ECU architectures. Additionally, this switch is equipped with an advanced rule-based packet filter engine that can adapt to different vehicle operation modes to enhance driving safety.

The company says that as automotive networking becomes more complex and software-defined, many OEMs are adopting a zonal in-vehicle network architecture to connect sensors, high-resolution cameras and displays. The zonal ECUs need to aggregate the data from these connected devices in real time and securely share them across central compute ECUs. The BCM8958X is optimized for use in both zonal ECUs and central compute ECUs that can switch and route large volumes of data for real time decision making. 



BCM8958X highlights:

• 6th generation automotive switch chip with 55 Gb/s switching capacity

• 16-port monolithic die switch

• Six 10G ports: XFI or PCIe x1 4.0 with SRIOV

• Integrated 100BASE-T1 and 1000BASE-T1 PHYs

• ARM subsystem with integrated TCM

• Hardware security and MACsec support

• AVB & TSN (802.1AS-2020, 802.1Qci, 802.1CB, 802.1Qbv)

• Software development kit including drivers, a gPTP protocol stack, and host APIs and providing portability from previous generation products

“Broadcom continues to lead with a comprehensive Ethernet solution for new automotive architectures,” said Vijay Janapaty, vice president and general manager of the Physical Layer

https://www.broadcom.com/company/news/product-releases/60241

Sunday, May 22, 2022

Reports: Broadcom in talks to acquire VMware

Multiple U.S. media sources, including the Wall Street Journal and The New York Times, reported that Broadcom is in advanced talks to acquire VMware. 

Neither company has commented on the reports, which cite anonymous sources. 




VMware completes spin-Off from Dell Technologies

VMware completed its spin-off from Dell Technologies. The move provides VMware increased freedom to execute its multi-cloud strategy, a simplified capital structure and governance model, and additional operational and financial flexibility. VMware and Dell said they will continue to partner with each other and to continue support/services to mutual customers.“VMware’s mission is to deliver the trusted software foundation that accelerates our customers’...


Trump blocks Broadcom's proposed takeover of Qualcomm

President Trump signed an executive order prohibiting Broadcom from acquiring Qualcomm or proceeding with any substantially equivalent merger, acquisition, or takeover of the firm whether effected directly or indirectly. The order cited "credible evidence" that Broadcom, along with its partners, subsidiaries, or affiliates, impairs the national security of the United States. Trump said he was taking this action upon review of a recommendation...


Tuesday, May 3, 2022

Experience-driven NetOps from the end-user perspective

https://youtu.be/jy1_EJtC0l8

End user metrics should be used for understanding network performance, says Jeremy Rossbach, Sr. Product Marketing Manager at Broadcom, speaking at ONUG Spring 2022. Broadcom's solution builds on its recent acquisition of AppNeta.

Broadcom to buy AppNeta for SaaS network performance monitoring

Broadcom agreed to acquire privately held AppNeta Inc., which provides a SaaS-based network performance monitoring solution. Financial terms were not disclosed.

AppNeta, which is headquartered in Boston, delivers visibility into the end user experience of any application, from any location. AppNeta's SaaS-based solution can quickly pinpoint issues that affect network and business-critical cloud application performance, regardless of where they occur.

"We are excited about the new Digital Experience Management (DEM) capabilities AppNeta will add to our DX NetOps network monitoring solutions.  Hybrid cloud deployments, work from home and prevalence of SaaS-based applications have made enterprises incredibly reliant on the Internet to deliver business-critical applications to employees and customers," said Serge Lucio, vice president and general manager, Enterprise Software Division, Broadcom. "Visibility and control for most performance management teams ends at corporate network boundaries. With AppNeta, DX NetOps solutions by Broadcom Software have visibility into Internet connections and can monitor and manage digital experiences for any user across any cloud, mobile, SaaS or remote work scenario."

https://investors.broadcom.com/news-releases/news-release-details/broadcom-acquires-appneta-bolster-network-performance-monitoring



Tuesday, March 15, 2022

What's hot at OFC22? Broadcom on Co-packaged optics

The demonstrations and discussions at OFC22 reveal a significant interest in co-packaging, says Rebecca Schaevitz, Product Line Manager & Principal Engineer, Broadcom. 

We're seeing the first results and now the debate is shifting from whether" co-packaging will to happen" to "when co-packaging will happen."



Wednesday, March 9, 2022

Broadcom shows 100G/lane optical PAM-4 DSP PHY

Broadcom demonstrated its 100G/lane optical PAM-4 DSP PHY with integrated transimpedance amplifier (TIA) and high-swing laser driver optimized for 400G DR4/FR4 module applications. 

The new DSP PHY, which leverages Broadcom’s 112G PAM-4 DSP platform, enables sub-7W 400G DR4/FR4 modules to drive the industry transition to energy-efficient 400G Ethernet.

Broadcom said that compared to industry benchmark results in the 9W range, this demonstration is a significant breakthrough in the module power reduction that delivers the lowest pJ/bit for DR4/FR4 modules available and drives the overall system power down to unprecedented levels for hyperscale data center and cloud providers.

“Broadcom continues to innovate and drive the next generation of PAM-4 DSP integration to satisfy the unrelenting quest for lower power with the introduction of the BCM87412 that will enable the industry leading 100G based modules,” said Vijay Janapaty, vice president and general manager of the Physical Layer Products Division at Broadcom.

Broadcom samples 100G/lane Optical PAM-4 DSP PHYs

Broadcom announced its 100G/lane optical PAM-4 DSP PHY families with integrated transimpedance amplifier (TIA) and laser driver, the Jesko BCM8741x and Gemera BCM8781x, optimized for 400G DR4/FR4 and 800G DR8/2xFR4 module applications, respectively. The new, highly integrated PHYs, which are built on Broadcom’s proven 112G PAM-4 DSP platforms, can be used to power 7W 400G DR4/FR4 and sub 14W 800G DR8/2xFR4 optical modules.Highlights400G and...


Tuesday, December 7, 2021

Broadcom to buy AppNeta for SaaS network performance monitoring

Broadcom agreed to acquire privately held AppNeta Inc., which provides a SaaS-based network performance monitoring solution. Financial terms were not disclosed.

AppNeta, which is headquartered in Boston, delivers visibility into the end user experience of any application, from any location. AppNeta's SaaS-based solution can quickly pinpoint issues that affect network and business-critical cloud application performance, regardless of where they occur.

"We are excited about the new Digital Experience Management (DEM) capabilities AppNeta will add to our DX NetOps network monitoring solutions.  Hybrid cloud deployments, work from home and prevalence of SaaS-based applications have made enterprises incredibly reliant on the Internet to deliver business-critical applications to employees and customers," said Serge Lucio, vice president and general manager, Enterprise Software Division, Broadcom. "Visibility and control for most performance management teams ends at corporate network boundaries. With AppNeta, DX NetOps solutions by Broadcom Software have visibility into Internet connections and can monitor and manage digital experiences for any user across any cloud, mobile, SaaS or remote work scenario."

https://investors.broadcom.com/news-releases/news-release-details/broadcom-acquires-appneta-bolster-network-performance-monitoring

Wednesday, November 10, 2021

Meta’s Minipack2 is powered by Broadcom's Tomahawk 4 silicon

Broadcom confirmed that Meta is now deploying the 25.6 Tbps StrataXGS Tomahawk 4 switch in its data center network fabric.

The Tomahawk4 is now shipping in high volume in Meta’s Minipack2 platform.

“Broadcom is pleased to support Meta and its ecosystem partners on the transition to a leading-edge 25.6Tbps networking fabric,” said Ram Velaga, senior vice president and general manager, Core Switching Group, Broadcom. “Our multi-year collaborative effort has resulted in the successful integration of multiple generations of the marketplace’s highest bandwidth Tomahawk switch chip into Meta’s industry- leading Wedge400 and Minipack2 networking platforms.”

The Tomahawk4 family has been shipping in volume for over one year. Members of the Tomahawk4 family, currently in production, include the Tomahawk4-50G, Tomahawk4-100G and Tomahawk4-12.8T.

The Broadcom Tomahawk3, the Tomahawk4’s predecessor, has been shipping in production since 2018. It has been deployed in Meta’s previous and current generation platforms. 

In addition to Tomahawk4, Minipack2 uses Broadcom’s 7nm Barchetta2, a 16×56-Gb/s full-duplex PHY, featuring demonstrated interoperability with Broadcom merchant switches and ASICs. This 400G/200G/100G retimer is designed with industry-leading 56-Gbps PAM4 Serdes architecture that supports greater than 30dB of insertion loss on both host and line interfaces. 

https://www.broadcom.com

Broadcom samples 100G/lane Optical PAM-4 DSP PHYs

Broadcom announced its 100G/lane optical PAM-4 DSP PHY families with integrated transimpedance amplifier (TIA) and laser driver, the Jesko BCM8741x and Gemera BCM8781x, optimized for 400G DR4/FR4 and 800G DR8/2xFR4 module applications, respectively. 

The new, highly integrated PHYs, which are built on Broadcom’s proven 112G PAM-4 DSP platforms, can be used to power 7W 400G DR4/FR4 and sub 14W 800G DR8/2xFR4 optical modules.

Highlights

  • 400G and 800G DSP PHYs with integrated TIA and high-swing laser driver deliver best-in-class module performance in BER and power consumption
  • Enables industry’s lowest power 400G and 800G pluggable optical modules
  • Compliant to all applicable IEEE and OIF standards, capable of supporting MR links on the chip to module interface
  • Powers Silicon Photonics (SiPh) as well as discrete EML/PD based modules
  • Drives higher density and bandwidth with hyperscale cloud networking data centers

“Ever increasing compute density and networking bandwidths demand unrelenting quest for lower power, cost and form factor reduction,” said Vijay Janapaty, vice president and general manager of the Physical Layer Products Division at Broadcom. “Broadcom’s innovative and highly integrated optical DSPs drive industry leading optical module solutions that meet the roadmap needs of our hyperscale cloud customers.”

“Networking and compute advances continue to push the boundaries of the power, performance and cost of optical modules,” said Adit Narasimha, vice president and general manager of Optoelectronics at Molex. “Molex’s PAM-4 optical modules pair the advantages of Broadcom’s highly integrated DSPs with the high performance of Molex’s SiPh ICs to deliver extremely low power, high performance and cost-effective solutions that will serve the industry’s multi-generational needs.”

https://www.broadcom.com/company/news/product-releases/59716