OIF Update: External Light Source and CPO, 400ZR Survey, new WG chairs

The OIF provided the following updates following its  Q4 Technical and MA&E Committees Meeting, which were held in Hawaii and virtually November 1-3, 2022.

New White Paper – Management of External Light Sources and Co-packaged Optical Engines

• Properly managing optical engines and external light sources requires an efficient system management architecture. A newly launched white paper from OIF outlines the recommended system management architecture that enables co-packaged optical transceivers to use lasers as external light sources. It also describes how OIF’s Common Management Interface Specification (CMIS) can manage transceivers and light sources. The key feature is placing the intelligence for controlling the continuous wave light sources in the host board controller, not in the optical engines.

400ZR Demonstrations and Plugfests Survey – Deadline December 7

OIF is launching a survey designed to gather feedback from network operators and stakeholders on OIF’s 400ZR demonstrations and plugfests. The survey also includes collecting input on the interest of an 800ZR and/or 800LR OIF demo and reaches of interest for 800G (800LR, 800ZR, > 800ZR).

The survey is available and open to all who can represent their company’s viewpoint – module vendors, system vendors and network operators. Multiple responses per company are also allowed. Responses will be collated anonymously and summarized for presentation to the public. Interested parties, please email survey@oiforum.com. The deadline for completing the survey is December 7.

Working Group Chairs Re-Election

OIF members re-elected Working Group Chairs (for two-year terms):

• Mike Klempa, Alphawave IP Group – Physical & Link Layer (PLL) Interoperability Working Group Chair
• Jeffery Maki, Juniper Networks – Physical Layer User Group Working Group Chair

Guest Speaker – Francis Alueta, Hawaiian Telecom

As Director, Network Reliability, Alueta, presented a high-level overview of Hawaiian Telcom’s investment in its next-generation network, the landmark Southeast Asia (SEA) US Trans-Pacific Cable System and backbone transport network. Next generation network plans include pushing a low-latency network edge closer to the customer and deploying a resilient, 400G backbone network. He also outlined some of the unique challenges they face as an island chain, geographic limits to route and path diversity options and climate change.

“Big Mahalo for OIF allowing me to present an overview of the architectural and operational challenges we have to overcome, as we transform our network,” said Alueta. “The work OIF continues to do will allow us to address those challenges and ensure a resilient network for our customers and the people of Hawaii.”

https://www.oiforum.com/

 

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Ayar Labs lands $15m DoD project for Optical I/O

Ayar Labs was awarded a $15 million multi-year prototype Other Transaction Agreement (OTA) in support of Project KANAGAWA (the Co-Packaged Analog-Drive High-Bandwidth Optical Input/Output Project).

This project will promote the next-level development of Ayar Labs’ optical interconnects to lead its transition into the Defense Department’s advanced packaging ecosystem.

During the first phase of Project KANAGAWA (Task A), Ayar Labs will deliver its optical I/O chiplets and lasers at data rate bandwidth levels exceeding 2 Tbps and energy losses below 5pJ/bit. In phase two of the project, running parallel to Task A, Ayar Labs will collaborate with Intel, Lockheed Martin and Qorvo to develop and demonstrate co-packaged optical I/O solutions built on TeraPHY™ optical I/O chiplets and SuperNova™ multi-wavelength lasers, with the goal of advancing the supply chain ecosystem for domestic manufacturing of Ayar Labs’ optical I/O solution.

“We look forward to working closely with Ayar Labs as part of Project KANAGAWA to benchmark its optical I/O chiplets and lasers toward the transition of this technology into large-scale defense applications,” said Dr. Joshua Hawke, Chief Engineer of RF & Optoelectronics, NSWC Crane, Radar Technologies Division and Execution Lead of the OUSD(R&E) Trusted & Assured Microelectronics program.

“Project KANAGAWA comes at an important time for both our nation and Ayar Labs as we look to mature U.S.-based manufacturing for our optical I/O solutions,” said Charles Wuischpard, CEO of Ayar Labs. “We are excited to partner with the DoD, Intel, Lockheed Martin and Qorvo to not only strengthen our nation’s security by establishing domestic production of our optical I/O chiplets but also introduce next-generation defense architectures and systems.”

https://ayarlabs.com

Lockheed Martin integrates Ayar Labs' optical I/O chipsets

Wednesday, October 12, 2022  Ayar Labs  

Lockheed Martin is partnering with Ayar Labs in developing multi-chip package (MCP) solutions which place high-density, high-efficiency optical I/O chiplets in the same microelectronics package as the RF processing devices. The collaboration will integrate the Ayar Labs TeraPHY optical I/O chiplets and SuperNova light source in new sensory platforms that could be used across Department of Defense (DoD) applications to capture, digitize, transport,...

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Molex intros optical-electrical interconnects for Co-Packaged Optics

Molex introduced its pluggable module solution for co-packaged optics (CPO), which moves optical connections from the front panel to within the host system—right next to high-speed ICs.

The new External Laser Source Interconnect System (ELSIS) is a complete system of cage, optical and electrical connectors with a pluggable module.

"From high-speed networking chips to graphics processing units (GPUs) and AI engines, the demand for I/O bandwidth continues to escalate," said Tom Marrapode, director of advanced technology development, Molex Optical Solutions. "By placing the optics closer to these ASICs, CPO will address the growing complexities associated with high-speed electrical traces, including signal integrity, density and power consumption."

Molex notes that traditional pluggable modules have their optical connections at the user side of the module, creating concerns about eye safety when used with high-power laser sources, such as those planned for CPO. As a blind-mating solution, ELSIS eliminates user access to optical fiber ports and cables, providing a complete external laser source system for safe, easy implementation and maintenance. The use of external laser sources also means a major heat source is moved away from the optoelectronics and IC package. Plus, the design eliminates high-speed electrical I/O drivers on the IC and in pluggable modules, further reducing thermal loads and power consumption within the equipment.

Molex is currently sampling the ELSIS hybrid optical electrical connector and cage system. Supporting design and development materials for the fully pluggable module system, including 3D models, technical drawings and detailed specifications, are available now. Molex is targeting Q3 2023 for release of the fully integrated solution.

https://www.molex.com

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Broadcom advances its co-packaged optics network switch

Broadcom will provide its new 25.6-Tbps Humboldt co-packaged optics (CPO) network switch to Tencent.

Humboldt features Broadcom’s StrataXGS Tomahawk 4 switch chip directly coupled and co-packaged with four 3.2-Tbps Silicon Photonics Chiplets In Package (SCIP) optical engines. 

Tencent has defined the system architecture and worked closely with Broadcom to develop hardware and software for field deployment of the 25.6-Tbps CPO switch system. Ruijie Networks Co., Ltd. will verify the design, manufacture and test the full CPO switch system, and then provide the finished product to Tencent. 

The companies plan to demonstrate the jointly developed 25.6-Tbps CPO switch system at the China International Optoelectronic Exposition (CIOE) in Shenzhen from September 7th to 9th.

Humboldt 25.6-Tbps CPO Switch Product Highlights:

• 2RU system design with high efficiency air cooling to support 4x3.2-Tbps optical CPO interfaces routed to 16 MPO connectors and 32x400G electrical QSFP112 ports
• CPO engine to front-panel routing supports both traditional fiber and flexible printed fiber (FPF) solutions
• System design compatible to support multiple remote laser modules (RLM)
• More than 50% optical interconnect power consumption savings compared to standard pluggable optics solutions
• Production ready for data center deployment

Broadcom said CPO will become increasingly important for data center switches as copper interconnects approach a reach limit.  Likewise, traditional pluggable optical transceivers require high power to equalize signal impairments incurred on a signal as it traverses long traces and through multiple connector discontinuities in a standard switch system. 

The 25.6-Tbps Humboldt CPO switch leverages Broadcom's uncooled continuous wave (CW) laser at 1310 nm for silicon photonics, delivering significant power efficiency and cost gains.

Broadcom also notes that it has over 15 external partners currently working on its SCIP and CPO designs.

“We are pleased to announce our strategic partnership with Tencent as we enable the industry’s first 25.6-Tbps CPO system for hyperscale data center field deployment,” said Near Margalit, Vice President and General Manager, Optical Systems Division, Broadcom. “We expect to continue to innovate and extend our market leadership position with Tencent as we migrate to 51.2-Tbps switch CPOs and next generation 200G/lane PAM-4 applications.”

“Customer demands for higher bandwidth have pushed Tencent to perpetually scale our network,” said Sage Zou, Vice President of Tencent Cloud. “We are glad to partner with Broadcom on CPO based technology, which will bring not only higher bandwidth for applications such as AI/ML and HPC, but also it could address the power constraints from the acceleration of growth in new workloads.”

“Addressing the general trend towards chip-scale optical interconnects versus traditional copper-based implementation, CPO technology combines microelectronics and optoelectronics on silicon-based platforms, which can carry more information and transmit longer distances,” said Liu Zhongdong, President and CEO, Ruijie Networks. “CPO switching networks have the advantages of high bandwidth and low power consumption, and Ruijie is glad to participate in the innovation and implementation of this new technology with Tencent & Broadcom.”

https://www.broadcom.com/info/optics/cpo

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CIR: Co-Packaged Optics market to hit $1.3 billion in 2025

Sales of specialized components for co-packaged optics (CPO) will exceed $1.3 billion in revenues in 2025 and grow to $2.7 billion by 2028, according to Communications Industry Researchers' (CIR) latest CPO report, "Markets for Co-Packaged Optics 2022-2030". The report analyzes both component and module-level CPO product developments. 

CIR's new report examines the latest developments in connectivity, lasers, and cooling systems for CPO as well as showing how CPO modules will be used in four kinds of data center.  The report forecasts CPO from 2022 to 2030 with breakouts by type of data center and location (inter-building/inter-machine or rack/server) in the data center.  This report has a strong emphasis on CPO's impact on the optoelectronic supply chain in the wake of both technological change and geopolitical developments. Key companies discussed include AMD, Anritsu, Ayar Labs, Broadcom, Furukawa Electric, GlobalFoundries, IBM, Marvell, Lumentum, Ranovus, SENKO, TE Connectivity, Xilinx, and others.

https://cir-inc.com/reports/co-packaged-optics-market-report/

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OIF's Multi-vendor demonstration of Co-Packaged Optics (CPO)

Nathan Tracy, Vice President of Marketing for the OIF, gives a multivendor demonstration of OIF's 3.2T Module project and external laser project (ELSFP). A variety of interoperable components that enable co-packaging are shown, along with a system implementation.

https://youtu.be/qUidEpTG_aw

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Lumentum and Ayar Labs target external light sources for CPO

Lumentum and Ayar Labs announced a strategic collaboration agreement to deliver CW-WDM MSA compliant external laser sources in high volume. 

“Co-packaged optics to replace traditional copper interconnects is a massive new market opportunity broadly recognized by the industry and one that Lumentum is well-positioned to address with our proven laser technologies and manufacturing scale,” said Walter Jankovic, Senior Vice President and General Manager of Datacom at Lumentum. “Ayar Labs is a leader in the development and commercialization of this market opportunity, and we believe that working together, we can accelerate this technology transition for the benefit of all.”

“Since our founding, Ayar defined optical I/O as the disruptive transition from copper and electrons to fiber optics and photons for short-reach data communication,” said Charles Wuischpard, Chief Executive Officer at Ayar Labs. “Ayar Labs’ patented silicon photonics technology and new industry standards like the CW-WDM MSA are critical to this transition, as is the development of the manufacturing, supply chain and packaging ecosystem to cost-effectively deliver the solution at scale in the millions of units. Lumentum is one of the largest and most efficient laser manufacturers in the world, and will provide the proven capability to address the volume, quality, and reliability requirements of our optical I/O solution.”

Last year, Ayar Labs demonstrated its 64-wavelength WDM optical source running at temperatures up to 100 degrees Celsius. 

Ayar Labs also notes its strategic collaboration with Hewlett Packard Enterprise (HPE) for next-generation data center architectures and networking with optical I/O, along with related news from GlobalFoundries.

http://www.ayarlabs.com

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OIF releases Co-Packaging Framework IA

OIF published a framework Implementation Agreement (IA) for co-packaging of communication and computing interfaces with one or more ASICs. The document identifies critical co-packaged applications and their requirements and charting a path for interoperability standards.

The Co-Packaging track of OIF’s Physical & Link Layer (PLL) Working Group began by studying the application spaces contributed by the end-users. Then, it examined various related topics, including electrical and optical interfaces, thermal and mechanical considerations, reliability, safety, environmental and management interfaces. The findings of the work are summarized in the Framework Document IA.

OIF has initiated two follow-on co-packaging projects: External Laser Small Form Factor Pluggable (ELSFP) Project, announced in May 2021, and the 3.2T Module Project, announced in March 2021.

“OIF is leading industry discussion on this critical dense integration technology,” said Jeff Hutchins, Ranovus and OIF Board Member and PLL Working Group – Co-Packaging Vice Chair. “This framework IA provides the industry with a foundation for developing interoperable energy efficient co-packaged solutions.”

“Co-packaging represents a significant change to the way high-performance communications ASICs are packaged today,” said Technical Editor of the Co-Packaging Framework IA, Kenneth Jackson, Sumitomo Electric. 

https://www.oiforum.com/oif-releases-co-packaging-framework-implementation-agreement/

OIF initiates 3 projects, including co-packaged optics external laser module

Wednesday, May 26, 2021  OIF  

OIF initiated three new projects, including a Co-Packaged Optics external laser module, Artificial Intelligence (AI) for Enhanced Network Operations and CEI-112G-Linear, in addition to announcing a network operator survey for the 2022 Networking Demo.External Laser Small Form Factor Pluggable (ELSFP) Module Project – companion project to support co-packaged optics applicationsThis project for a blind-mate pluggable external light source module will...

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OIF begins 3.2T Co-Packaged Module Project for data center switching

Thursday, March 11, 2021  OIF  

OIF started a 3.2T Co-Packaged Module project for intra data center switching applications. The 3.2T Co-Packaged Optical Module Implementation Agreement (IA) is the first project initiated under the umbrella of the Co-Packaged Framework Project announced in November 2020. The IA will define a 3.2T co-packaged optical module that targets Ethernet switching applications utilizing 100G electrical lanes. It will include the following interoperability...

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Senko introduces highest density fiber connector

 Senko introduced the industry’s highest density fiber connector - the SN - CONNECTOR.

The connector carries a maximum of 16-fiber in a row with the same footprint and features as the company's SN duplex connector. The design improves connector density by 2.7X over MPO-16F and 1.3X over MPO-32F. It’s suitable for many applications that require high-density fiber solutions such as patch panels, cassettes, a faceplates to next gen co-packaged optics (CPO) data center switches.

https://www.senko.com/

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Rain Tree Photonics and MaxLinear deliver 400G module for hyperscalers

Singapore-based Rain Tree Photonics (RTP) and MaxLinear announced the availability of a silicon photonics-based solution for 400G-DR4 optical modules for hyperscale data centers.

Rain Tree Photonics’ proprietary photonics engine leverages the company's silicon photonics integration technology and offers high yield and volume scalability. It is also developed to be ready for Co-Packaged Optics (CPO) architectures, while maintaining compatibility with pluggable module architectures.

MaxLinear’s MxL93542 Telluride PAM4 DSP is a key component in the development of high-speed, mega-scale data centers based on 100Gbps single lambda optical interconnects. This SOC and others in the Telluride family are the world’s first DSPs with integrated electro-absorption modulated laser (EA-EML) drivers for 100/400Gbps optical interconnects and breakout mode clocking support for 400Gbps DR4 optical modules.

The RTP1908, RTP’s 400G-DR4 silicon photonic engine, integrates multiple photonic devices allowing all 4 channels to fit into a tiny chip footprint. Each channel also features RTP’s energy-efficient modulator which is directly driven by the MxL93542’s integrated EA-EML driver. The entire photonic circuit is optimized for low optical insertion loss and features large mode-field-diameter fiber couplers that ensure high yield with standard packaging lines.

The MxL93542 16nm CMOS PAM4 DSP SoC consumes an extremely low 6.7W of power, which includes the integrated EA-EML driver power dissipation. The minimal power consumption of the MxL93542 meets the stringent power constraints of 400Gbps optical module form-factors, including QSFP-DD, OSFP and COBO devices.

“MaxLinear’s MxL93542 PAM4 DSP with integrated quad-channel EML drivers provides outstanding cost benefits for 400G-DR4 optical module customers. Driver integration also simplifies the module design, which together with RTP’s fabless++ approach, improves NPI cycle-time for customer adoption,” said Dr. Huang Ying, Co-founder at Rain Tree Photonics. “The MxL93542’s integrated drivers also work well with the high-efficiency, low-drive silicon photonic modulators in the RTP1908, achieving excellent TDECQ and OMA performance.”

“We are pleased with the successful pairing of the MxL93542 with Rain Tree Photonics’ RTP1908 silicon photonics engine to provide a compelling integrated solution for 400G-DR4 modules,” said Will Torgerson, Vice President and General Manager of MaxLinear’s High-Speed Interconnect Group. “The highly integrated Telluride DSPs offer superior link-margin performance and industry-leading power consumption.”

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