This year is the tenth anniversary of the Open Compute Project, an organization that has advanced the cause of "vanity free" infrastructure for cloud providers. The mission is broadening and the next 10 years will see advances in additional domains. Here is a 2-minute perspective from Rebecca Weekly, Board Chair, Open Compute Project.
For more video interviews with industry experts, visit: https://nextgeninfra.io/
Broadcom confirmed that Meta is now deploying the 25.6 Tbps StrataXGS Tomahawk 4 switch in its data center network fabric.
The Tomahawk4 is now shipping in high volume in Meta’s Minipack2 platform.
The Tomahawk4 family has been shipping in volume for over one year. Members of the Tomahawk4 family, currently in production, include the Tomahawk4-50G, Tomahawk4-100G and Tomahawk4-12.8T.
The Broadcom Tomahawk3, the Tomahawk4’s predecessor, has been shipping in production since 2018. It has been deployed in Meta’s previous and current generation platforms.
In addition to Tomahawk4, Minipack2 uses Broadcom’s 7nm Barchetta2, a 16×56-Gb/s full-duplex PHY, featuring demonstrated interoperability with Broadcom merchant switches and ASICs. This 400G/200G/100G retimer is designed with industry-leading 56-Gbps PAM4 Serdes architecture that supports greater than 30dB of insertion loss on both host and line interfaces.
Broadcom announced its 100G/lane optical PAM-4 DSP PHY families with integrated transimpedance amplifier (TIA) and laser driver, the Jesko BCM8741x and Gemera BCM8781x, optimized for 400G DR4/FR4 and 800G DR8/2xFR4 module applications, respectively.
The new, highly integrated PHYs, which are built on Broadcom’s proven 112G PAM-4 DSP platforms, can be used to power 7W 400G DR4/FR4 and sub 14W 800G DR8/2xFR4 optical modules.
Highlights
“Ever increasing compute density and networking bandwidths demand unrelenting quest for lower power, cost and form factor reduction,” said Vijay Janapaty, vice president and general manager of the Physical Layer Products Division at Broadcom. “Broadcom’s innovative and highly integrated optical DSPs drive industry leading optical module solutions that meet the roadmap needs of our hyperscale cloud customers.”
“Networking and compute advances continue to push the boundaries of the power, performance and cost of optical modules,” said Adit Narasimha, vice president and general manager of Optoelectronics at Molex. “Molex’s PAM-4 optical modules pair the advantages of Broadcom’s highly integrated DSPs with the high performance of Molex’s SiPh ICs to deliver extremely low power, high performance and cost-effective solutions that will serve the industry’s multi-generational needs.”
https://www.broadcom.com/company/news/product-releases/59716
Inspur Information, which ranks among the world’s top 3 server manufacturers, and Samsung announced a Poseidon V2 E3.x reference system for the Open Compute Project community.
This product adopted composable architecture to maximize the benefits of EDSFF E3.x form factor. Poseidon V2 system can accommodate not only the PCIe Gen5 SSDs but also various devices like AI/ML accelerators or CXL Memory Expanders. Data center users can configure the system according to application's needs.
“Following the development of the E1.S reference system, we expect that this type of storage solution will become one of the most sought-after and cost-effective storage solutions on the market for leading cloud data center servers and hyperscale companies that operate large data centers,” according to Jongyoul Lee, Executive Vice President of Samsung’s Memory Software Development Team. “We are eager to continue our collaborative work on the E3.S reference system with Inspur to drive further advancements in future server and storage systems.”
“Through our combined vision with Inspur's general purpose server design and Samsung's Poseidon, we believe E1.S and E3.x will bring a revolutionary use case that fulfills the need for an efficient high-performance and high-density storage system,” stated Alan Chang, VP of Technical Operation at Inspur Information. “Customers who use general purpose severs as their compute can smoothly transition to Poseidon whose modularized design will reduce redundant engineering and validation across the board. We anticipate even broader usage models and applications with the new Poseidon v2 specification.”
Windstream Wholesale is expanding its 400 Gigabit wave offerings to meet rapidly growing customer demand for high-bandwidth solutions. The carrier cited several milestones:
Windstream and Infinera were the first to successfully demonstrate 400 Gig client-side services in April 2020 with commercially available ultra-efficient 400GbE-LR8 QSFP-DD compact pluggable interfaces.
In February 2021, Windstream announced that it had deployed 400 Gbps single-wavelength transmission across its long-haul network using Acacia Communications’ pluggable modules. These modules will drive high-capacity optical connections to the network edge to deliver ultra-fast speeds to more end-users than ever before.
In October 2021, Windstream announced that it had partnered with II-VI to co-develop next-generation transceivers that will streamline deployment of 400 gigabit services while significantly reducing costs, power consumption and network complexity.
“Windstream Wholesale has a robust nationwide network with 400 Gigabit waves available to more than 30 sites already in service and more coming online by year’s end,” said Joe Scattareggia, executive vice president of Windstream Wholesale. “Large wholesale and hyperscale customers are looking to deploy high-bandwidth solutions at a lower cost per bit, and our multi-layer open network architecture enables us to deliver these solutions in a way that is fast and flexible and meets their needs.”
LINX, the UK’s leading interconnection and peering community, will install Nokia's 400GE IP edge routing platforms to connect its 950+ membership.
The installation includes Nokia's 7750 SR-7s edge routers deployed by LINX in three locations around London, providing greater bandwidth and higher density than its existing solution.
The platforms will allow LINX to support services at speeds of up to 400GE initially with the ability to seamlessly grow capacity and scale to higher speeds in the future. LINX will benefit from Nokia FP silicon that ensures network performance and capabilities such as traffic engineering do not degrade as network traffic levels increase.
Richard Petrie, CTO and Executive Director at LINX, said: “Our partnership with Nokia highlights LINX’s commitment to delivering high-speed IP interconnection and peering for its members. The scalability and capabilities of Nokia’s IP routing platforms and the integration with our automation platform will enable us to respond to our members’ needs more quickly, offering them better connectivity, improved network performance and more control.”
Manuel Ortiz Fernandez, Senior Vice President of EMEA Webscale business at Nokia, said: “LINX is experiencing greater demand for its market-leading interconnection services than ever before. We are pleased LINX has chosen Nokia’s market-leading 400GE IP routing technology to help ensure its infrastructure is as up to date as possible and that it remains at the forefront of the IXP industry.”
Rockley Photonics has kicked off a research collaboration with Caltech’s Sensing to Intelligence (S2I) Center that will focus on the development of next-generation solutions that combine advanced sensors with artificial intelligence.
Through its investment in S2I, Rockley plans to support a range of projects, including the development of new integrated spectrometer technologies using advanced photonics sensors. Researchers in the S2I center will explore and further analyze the relationship between spectral data and individual biomarkers to broaden and enhance the health monitoring capabilities and will utilize Rockley’s platform in the process.
Rockley Photonics and Caltech have collaborated previously on research projects including co-packaged optics and the co-design and integration of advanced photonics and electronics. This new agreement deepens an already strong association.
“Over the years, we have had a wonderful relationship with our Pasadena neighbors at Caltech, and it is an honor to continue our research agreement with them through the S2I Center,” said Dr. Andrew Rickman, chief executive officer and founder of Rockley Photonics. “Caltech has a strong history of supporting the development of health-related technologies, including Professor Arnold Beckman’s invention of the DU spectrophotometer, which was hailed as perhaps the most important instrument ever developed toward the advancement of bioscience. This new partnership will combine our experience building Rockley’s unique biomarker sensing platform, which incorporates a spectrophotometer-on-a-chip, with Caltech’s extensive research capabilities. We are happy to be working with Caltech once again to push the boundaries of bioscience even further.”
Rockley’s full-stack sensing solution features a wristband that contains the sensor module and communicates with custom cloud-based analytical engines via a Rockley smartphone app. The wristband will be used in a sequence of in-house human studies in the coming months.
“Our full-stack sensor solution, which brings together optical and electronic hardware, firmware, algorithms, and cloud-based analytics, is an exciting milestone on our roadmap. Our reference designs will significantly aid our customers and partners with the deployment of our technology and accelerate their own scalable, high-volume product delivery,” said Dr. Andrew Rickman, chief executive officer and founder of Rockley Photonics. “We believe that combining machine learning algorithms with continuous monitoring of an extended set of biomarkers from accessible wearable devices will provide new actionable insights to enhance and transform digital healthcare.”
Samsung Electronics introduced Hybrid-Substrate Cube (H-Cube) technology, its latest 2.5D packaging solution specialized for semiconductors for HPC, AI, data center, and networking chips that require high-performance and large-area packaging technology.
Samsung said its H-Cube technology features a hybrid substrate combined with a fine-pitch substrate which is capable of fine bump connection, and a High-Density Interconnection (HDI) substrate, to implement large sizes into 2.5D packaging.
“H-Cube solution, which is jointly developed with Samsung Electro-mechanics (SEMCO) and Amkor Technology, is suited to high-performance semiconductors that need to integrate a large number of silicon dies,” said Moonsoo Kang, senior vice president and Head of Foundry Market Strategy Team at Samsung Electronics. “By expanding and enriching the foundry ecosystem, we will provide various package solutions to find a breakthrough in the challenges our customers are facing.”
“In today’s environment where system integration is increasingly required and substrate supplies are constrained, Samsung Foundry and Amkor Technology have successfully co-developed H-Cube to overcome these challenges,” said JinYoung Kim, senior vice president of Global R&D Center at Amkor Technology. “This development lowers barriers to entry in the HPC/AI market and demonstrates successful collaboration and partnership between the foundry and outsourced semiconductor assembly and test (OSAT) company.”
Telia has deployed Nokia's 5G Standalone (SA) Core network in Finland enabling advanced 5G services like slicing.
Nokia is also in the process of rolling out its 5G SA Core for Telia in Denmark, Estonia, Lithuania, Norway and Sweden.
The rollout in Finland includes Nokia’s cloud packet core and registers, which allows subscriber data to be consolidated into a common repository using a distributed and flexible architecture. Telia is also using Nokia’s Radio Access Network.
Nokia is leading the 5G SA Core market, with over 80 CSP and enterprise customers around the world; that includes nearly 30 CSPs in Europe. In addition, 25 of the top 40 service providers by revenue rely on Nokia core network products.
Jari Collin, Telia Finland CTO, said: "We are now taking the most significant step forward since the launch of 5G, as SA enables all the revolutionary features of 5G. Thanks to our cooperation with our trusted partner Nokia, Finland will keep its position as a leading mobile country in the world.”
Fran Heeran, SVP & Head of Core Networks, Cloud and Network Services, Nokia, said: “We are delighted that Nokia’s 5G SA Core is now live for Telia in Finland. This provides Telia with the industry’s leading Core Network technology, enabling the rapid rollout of advanced 5G services to its customers. Our work continues with this longstanding Nokia partner and we look forward to the additional Nokia 5G Core rollouts in other Telia Nordic and Baltic countries.”
Lockheed Martin and Keysight Technologies are actively collaborating on a 5G.MIL testbed that Lockheed Martin teams will use to advance 5G capabilities for multiple aerospace and defense applications.
The testbed, which reached initial operational capability in July, will help Lockheed Martin’s 5G.MIL teams quickly verify interoperability and performance with a wide range of 5G assets and simulate reliable and secure communications. Since that time, both companies have worked together to emulate, test and validate 5G Open Radio Access Network and Non-Terrestrial Network communications.
“Lockheed Martin is leveraging expertise in the commercial sector to scale, adapt and integrate 5G technology rapidly and affordably across mission-critical operations across land, sea, air, space and cyber domains,” said Dan Rice, vice president for 5G.MIL Programs at Lockheed Martin. “Keysight’s end-to-end 5G test platforms, widely used commercially, provide an opportunity to develop customized solutions that meet the stringent requirements of the defense industry.”
“Deployment of future-proof, seamless and secure communication links serving operations across ground, sea and air depends on the successful integration of 5G, satellite, unmanned aerial vehicle, artificial intelligence and cloud technologies,” said Vince Nguyen, general manager for Aerospace Defense Government Solutions at Keysight Technologies. “Leveraging Keysight’s portfolio of flexible, scalable, and fully automated test, measurement, verification and optimization tools, Lockheed Martin has implemented the most advanced testbed for 5G and hybrid networks that we have seen in the aerospace and defense industry.”
Backblaze’s Class A common stock is expected to begin trading on the Nasdaq Global Market on November 11, 2021 under the ticker symbol "BLZE." The offering is expected to close on November 15, 2021, subject to the satisfaction of customary closing conditions.
https://www.backblaze.com
NVIDIA announced the next generation of its InfiniBand networking platform for cloud computing providers and supercomputing centers.
NVIDIA Quantum-2 is a 400Gbps InfiniBand networking platform that consists of the NVIDIA Quantum-2 switch, the ConnectX-7 network adapter, the BlueField-3 data processing unit (DPU) and all the software that supports the new architecture.
NVIDIA Quantum-2 includes key features required for demanding workloads running in either cloud enviroments or superomputing clusters. The multi-tenant performance isolation of NVIDIA Quantum-2 keeps the activity of one tenant from disturbing others, utilizing an advanced telemetry-based congestion control system with cloud-native capabilities that ensure reliable throughput, regardless of spikes in users or workload demands.
A nanosecond-precision timing system integrated into NVIDIA Quantum-2 can synchronize distributed applications, like database processing, helping to reduce the overhead of wait and idle times. This new capability allows cloud data centers to become part of the telecommunications network and host software-defined 5G radio services.
The Quantum-2 platform is powered by new Quantum-2 InfiniBand switching ASIC with 57 billion transistors implemented in 7-nanometer silicon. It features 64 ports at 400Gbps or 128 ports at 200Gbps and will be offered in a variety of switch systems up to 2,048 ports at 400Gbps or 4,096 ports at 200Gbps — more than 5x the switching capability over the previous generation, Quantum-1.
The NVIDIA Quantum-2 switch is now available from a wide range of leading infrastructure and system vendors around the world, including Atos, DataDirect Networks (DDN), Dell Technologies, Excelero, GIGABYTE, HPE, IBM, Inspur, Lenovo, NEC, Penguin Computing, QCT, Supermicro, VAST Data and WekaIO.
“The requirements of today’s supercomputing centers and public clouds are converging,” said Gilad Shainer, senior vice president of Networking at NVIDIA. “They must provide the greatest performance possible for next-generation HPC, AI and data analytics challenges, while also securely isolating workloads and responding to varying demands of user traffic. This vision of the modern data center is now real with NVIDIA Quantum-2 InfiniBand.”
Arista Networks introduced its next generation of 7050X and 7060X Series switches optimized for 400G networks.
Introduced at OCP 2021, the all new Arista 7388X5 continues the modular system innovation from the 7368X4 and is compliant to the OCP Minipack2 specifications, doubling performance with 30% improved power efficiency. The Arista's 7388X5 shares Meta’s Minipack2 goals of a choice of form factor that supports high density 200G and 400G links. Arista offers a choice of operating systems with enhancements and supports additional use cases with operational efficiency benefits that simplify cloud network designs.
The Arista 7060X5 systems are the highest density 400G options for leaf-spine architectures, offering next-generation performance at the lowest power consumption and leverages the latest Broadcom 25.6Tbps silicon. With up to 64 ports of 400G in 2U, the 7060DX5-64S delivers 10.6Bpps that can be flexibly used in 100G, 200G and 400G environments.
“We are seeing customers of all sizes show interest in the next generation of 400G systems that provide incremental improvements without sacrificing backward compatibility. The Arista 7050X4 and 7358X4 are the latest in the long line of systems built around the Broadcom Trident chipsets that have delivered 20 times the performance increases over the last 10 years,” said Anshul Sadana, Chief Operating Officer at Arista Networks.
The 7050X4 Series 32 x 400G and 7358X4 Series 128 x 100G / 32 x 400G systems enable large enterprise and service provider customers to unlock the potential of 400G.
Arista says the new systems provide a smooth evolution to higher performance without disruption to existing architectures and increase network capacity by 4 times over the previous generation. All parts of the 7358X4 are field replaceable, simplifying deployment and leveraging the same common equipment and modules as the Arista 7368X4 Series, accelerating the migration to 400G data center networks with up to 32 ports of 400G in 4RU with pay-as-you-grow flexibility.
The 7050X4 and 7358X4 feature:
The new 7050X4 and 7358X4 are available in Q1 2022. The 7050X4 is available in a choice of two port configurations supporting 32 ports of 400G OSFP or QSFP-DD in 1RU. The 7358X4 modular system provides a choice of 25G, 100G and 400G ports.
Arista 7060X5 and 7388X5 doubles performance from the 7060X4 and 7368X4 in a choice of form factors:
The 7388X5 and 7060X5 will be available in 1H 2022, with customer testing currently in progress. Pricing starts at $1800 / 400G.
https://www.arista.com/en/company/news/press-release/13400-pr-20211109
At the tenth annual OCP Summit in San Jose, Cisco confirmed that Meta is deploying its Cisco Silicon One Q200L device along with the Wedge400C Top of Rack (TOR) switch. Cisco Q200L uses 7nm technology to provide a 12.8 Tbps solution for web scale switching and routing. The 12.8 Tbps Wedge400C supports up to 16 ports of 400G and 32 ports of 200G.
“Cisco Silicon One is uniquely positioned in the industry to provide a common architecture across the entire network, enabling massive operational efficiencies for our customers,” said Rakesh Chopra, Cisco Fellow, Common Hardware Group Architecture and Platforming, Cisco. “The Q200L is an important part of Cisco’s expanding Silicon One product family and as part of our overall disagg component model, it provides Meta a building block to innovate on top of, at hyperscale efficiency and scale.”
https://newsroom.cisco.com/press-release-content?type=webcontent&articleId=2207937
ADVA launched its OSA 5400 TimeCard, enabling operators of data center network infrastructure and 5G open RAN architectures to achieve highly accurate and reliable distribution and synchronization of time.
The new PCIe card, which is built on the OSA 5400 SyncModule, transforms an open compute server into a precise and stable PTP grandmaster, boundary clock, slave clock or NTP server. The OSA 5400 TimeCard is the market’s first solution developed to the framework of the Open Compute Project’s (OCP) Time Appliance Project (TAP) and enhanced with both PTP and NTP functions. With advanced synchronization capabilities, it solves a key challenge for network operators as they virtualize their infrastructure and replace purpose-built hardware with standard servers.
“Timing in data centers and other open compute cases like 5G open RAN is becoming increasingly crucial as a growing number of applications require new levels of performance. But the sub-microsecond synchronization needed for efficient resource sharing is something that open compute servers often cannot provide. Open compute customers need a way to inject the most advanced synchronization capabilities into their white box hardware. That’s why we’ve engineered our OSA 5400 TimeCard™. It brings our experience in network and application synchronization to open compute servers as well as open RAN equipment, enabling a whole new group of customers to benefit from our unique expertise,” said Gil Biran, general manager, Oscilloquartz, ADVA.
https://www.adva.com/en/newsroom/press-releases/20211109-adva-timing-card-brings-precise-synchronization-to-open-compute-servers
Digital Realty selected Ciena to deliver an open, secure and dynamic cloud-based interconnectivity to customers across Asia Pacific.
Digital Realty operates a network of industry-leading data centers in Asia Pacific, with locations in Singapore, Hong Kong, Tokyo, Osaka, Seoul, Melbourne, and Sydney. It is implementing Ciena’s 6500 Reconfigurable Line System, Waveserver Ai compact interconnect platform, and Manage, Control and Plan domain controller, enabling high capacity DCI and disaster recovery/backup between data centers.
Ciena said its DCI solution will allow Digital Realty’s customers to reach provider ecosystems beyond primary customer deployment, scale data center footprint and establish connectivity between deployments, and enable Digital Realty to be a one-stop shop for interconnectivity. Digital Realty’s customers will also have expanded data center options without compromising cloud and network connectivity needs by choosing facilities connected to premium Internet Gateways.
“Data gravity across Asia Pacific is reaching incredible new levels with increased digital workflows and massive bandwidth demands driven by 5G, gaming, digital entertainment and Internet of Things (IoT). Enhancing Digital Realty’s network with Ciena’s coherent optics enables us to not just sell space, power, and security management facilities but also bundle DCI capabilities for customers at the lowest operational cost,” says Robert Davidson, APAC Head of Network Strategy at Digital Realty.
Peter Kisang Kim, a former Broadcom engineer, has been indicted by a U.S. federal grand jury on 18 charges of trade secret theft.
Kim has entered a plea of not guilty to the charges.
https://www.justice.gov/usao-ndca/pr/former-broadcom-engineer-charged-theft-trade-secrets
Lightpath announced a 50-mile expansion of its all-fiber network in the Boston region, following the company's entrance into the market via multiple acquisitions in June. The additional 50 route miles of network brings the total route miles in the Boston metropolitan area to over 130.
The network expansion is focused on the five key areas of Boston, Waltham, Bedford, Burlington, and Lowell, MA, and is designed to enable access to additional, strategic data centers and business centers while at the same time providing options for service diversity and protection.
Specifically, Lightpath has added a second, diverse route between Boston and Lowell, while adding diversity and density in the Bedford, Burlington, and Waltham areas. Customers will benefit from access to critical area data centers at 55 Middlesex Turnpike, Bedford, MA and 115 2nd Avenue, Waltham, MA. Additionally, Lightpath is adding more network density in Boston to reach the Longwood Medical area, home to numerous hospitals, schools, and research facilities.
"These new network builds address multiple high opportunity markets and business centers, including two, highly-connected data centers in the heart of Boston Metro's Route 128 Tech Corridor," stated Chris Morley, Lightpath CEO. "The extensions in Boston, Bedford, Burlington, and Waltham increase Lightpath network addressability to over 1,200 new target organizations in the region."
Lightpath, which operates over 18,000 route miles of fiber in the New York metropolitan region, announced its entrance into the Boston market via the acquisition of three fiber networks.
Cambridge Network Solutions (CNS), a second area connectivity provider, and the purchase of fiber network assets from Hub Fiber. The CNS and the second acquisitions have closed, while the Hub Fiber purchase is expected to close within 30 days. Financial terms were not disclosed.
Together, the three propertiews represent 80 route miles of in-place, high-count fiber network reaching over 100 locations, including 12 area data centers, throughout Boston, Cambridge, Somerville, Waltham, Burlington, Billerica, Bedford, and Lowell. Additionally, Lightpath's network in the region will be connected to its New York Metro network, expanding on the company's existing 18,000 route miles of fiber serving over 12,000 locations.
"Greater Boston is a perfect expansion area for Lightpath, with its robust technology and biotech industries, financial services sector, world leading universities and research institutes, tech-savvy governments, and other enterprise businesses," stated Chris Morley, Lightpath's CEO. "This is the first step for Lightpath expanding beyond the NY Metro region after reliably serving thousands of customers there for over 30 years. We are excited to bring our network, connectivity solutions, and innovative customer service approach to more organizations. These acquisitions will help us hit the ground running, and we will be able to start serving new customers right away."
Altice USA owns a 50.01% controlling interest in Lightpath and Morgan Stanley Infrastructure Partners (MSIP) owns 49.99% of the company.
https://lightpathfiber.com/
At a virtual event ahead of this week's Open Compute Project Summit, Dr. Lisa Su, president and CEO of AMD, introduced the company's Instinct MI200 series accelerators for high performance computing (HPC) and artificial intelligence (AI) workloads, and provided a preview of the 3rd Gen AMD EPYC processors.
AMD also confirmed that Meta will adopt its EPYC processors in its hyperscale data centers supporting Facebook, Instagram and other applications. AMD and Meta worked together to define an open, cloud-scale, single-socket server designed for performance and power efficiency, based on the 3rd Gen EPYC processor.
“We are in a high-performance computing megacycle that is driving demand for more compute to power the services and devices that impact every aspect of our daily lives,” said Dr. Su. “We are building significant momentum in the data center with our leadership product portfolio, including Meta’s adoption of AMD EPYC and the buildout of Frontier, the first U.S. exascale supercomputer which will be powered by EPYC and AMD Instinct processors."
Next up on the AMD roadmap are EPYC processors codenamed “Genoa” and “Bergamo.”
“Genoa” will have up to 96 high-performance “Zen 4” cores produced on optimized 5nm technology, and will support the next generation of memory and I/O technologies with DDR5 and PCIe 5. “Genoa” will also include support for CXL, enabling significant memory expansion capabilities for data center applications. “Genoa” is on track for production and launch in 2022.
“Bergamo” is a high-core count CPU, tailor made for cloud native applications, featuring 128 high performance “Zen 4c” cores. AMD optimized the new “Zen 4c” core for cloud-native computing, tuning the core design for density and increased power efficiency to enable higher core count processors with breakthrough performance per-socket. “Bergamo” comes with all the same software and security features and is socket compatible with “Genoa.” “Bergamo” is on track to ship in the first half of 2023.
https://ir.amd.com/news-events/press-releases/detail/1031/amd-unveils-workload-tailored-innovations-and-products-at
America's new infrastructure package is the single, largest investment in broadband deployment in history and represents a once-in-a-generation opportunity to get fiber out to every American, says Gary Bolton, president and CEO of the Fiber Broadband Association. Here is a one-minute perspective.
