Open Optical Momentum at #OFC21

Openness was a big theme at this year's virtual #OFC21 event, with big announcements concerning XR optics, OSFP modules, 800G, disaggregated platforms based on Telecom Infra Project (TIP) designs, and market-ready 400ZR solutions.

Marvell announced sampling on an ultra low-power, 400G DSP chipset and a 50Gbps PAM4 DSP chipset which integrates transimpedance amplifiers (TIAs) and laser drivers in the CMOS package -- both targeting disaggregated optical platforms.

In this video, Jim Carroll and Roy Chua discuss the new Marvell, and whether "Open" can be a strategic differentiator for the company.

For more videos on Next-Gen Infrastructure visit: https://nextgeninfra.io/

https://youtu.be/Zg0OSqQSrt0

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Hengtong Rockley demos 800G QSFP-DD800 DR8 pluggable

Hengtong Rockley Technology Co. announced an 800G QSFP-DD800 DR8 optical module based on EML technology.

There are two main form factors for 800G MSA: OSFP and QSFP-DD800. Because of the tight space, QSFP-DD800 module design has been considered as the most challenging, in term of layout, signal integrity and thermal management. 

Hengtong Rockley is adapting 7nm DSP with built-in drivers, and COB structure to achieve this 800G QSFP-DD800 DR8 design, the total module power consumption is around 16W. Sampling is expected later hits year and commercial production is expected in the second half of 2022. Hengtong Rockley also plans to have 800G optical module based on Silicon Photonics technology in 2022.

Hengtong Rockley Technology Co.is a joint venture established by Hengtong Optic-Electric Co., Ltd., China and Rockley Photonics Limited, UK. Hengtong Rockley is based in Suzhou, China.

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Furukawa develops light sources for SUPER C-band and SUPER L-band

Furukawa Electric Co., Ltd. announced new laser light source products for SUPER C-band and SUPER L-band optical transmission, including a new wide tuning range micro-ITLA (Integrable Tunable Laser Assembly) and pump laser diode modules for Raman amplifiers with the expanded wavelength range.

Furukawa Electric developed the micro-ITLAs and Raman pump laser diode modules for wider wavelength range using its lower loss waveguide technology by optimizing designs based on its crystal growth and precision semiconductor processing expertise.

The wavelength range of the new micro-ITLA has been expanded from 96 to 120 channels for 50 GHz spacing. The available bandwidth has expanded from the conventional C-band: 191.300 - 196.100 THz (4.8 THz width) to Super C-band: 190.675 - 196.675 THz (6 THz width). In the same way it will also be possible to expand bandwidth from the conventional L-band: 186.350 - 190.700 THz (4.35 THz width) to Super L-band: 184.350 - 190.500 THz (6.15 THz width).

For the new pump laser diode modules, the wavelength range has been expanded for 400/500/600 mW products from 1420 - 1510 nm to 1330 - 1520 nm.

https://www.furukawa.co.jp/en/release/2021/comm_20210607.html

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Silicon Photonics integration of Indium phosphide distributed feedback lasers

Sivers Photonics, imec, and ASM AMICRA successfully completed a wafer-scale integration of indium phosphide (InP) distributed feedback (DFB) lasers from Sivers’ InP100 platform onto imec’s silicon photonics platform (iSiPP). 

Using ASM AMICRA’s latest NANO flip-chip bonder tool, the InP DFB laser diodes were bonded onto a 300mm silicon photonics wafer with an alignment precision within 500nm, enabling reproducible coupling of more than 10mW of laser power into the silicon nitride waveguides on the silicon photonics wafer. Supported by its partners, imec will offer this technology later in 2021 as a prototyping service, thereby accelerating the adoption of silicon photonics in a wide range of applications from optical interconnects, over LiDAR, to biomedical sensing.

Sivers says many silicon photonic systems today still rely on external light sources, owing to the lack of efficient on‐chip light sources. Silicon itself does not emit light efficiently and, therefore, light sources made of III-V semiconductors, such as indium phosphide (InP) or gallium arsenide (GaAs), are typically implemented as separately packaged components. These off‐chip lasers often suffer from higher coupling losses, a large physical footprint and a high packaging cost.

“We’re excited to work with imec and ASM AMICRA on the development of advanced integrated photonic components. The availability of tailored InP laser sources, designed and fabricated on our InP100 manufacturing platform, will boost the adoption of silicon photonic circuits for a wide variety of commercial applications ”, says Billy McLaughlin, Sivers Photonics Managing Director.

Joris van Campenhout, Optical I/O Program Director at imec: “We are very pleased to be working with Sivers Photonics and ASM AMICRA to extend our silicon photonics platform with hybrid integrated laser sources and amplifiers. This additional functionality will enable our joint customers to develop and prototype advanced photonic integrated circuits (PICs) with capabilities well beyond what we can offer today, in key areas such as datacom, telecom and sensing.”

Dr. Johann Weinhändler, ASM AMICRA Managing Director: “Our strength in high-precision placement seamlessly complements the expertise of all partners. With automated and ultra-precise flip-chip bonding, the way to high-volume manufacturing of these hybrid assemblies is open.”

https://www.imec-int.com/en/press/imec-joins-forces-sivers-photonics-and-asm-amicra-accelerate-hybrid-integration-inp-lasers

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Marvell intros Atlas 50Gbps PAM4 DSP chipset

Marvell announced its Atlas 50Gbps PAM4 DSP chipset which integrates transimpedance amplifiers (TIAs) and laser drivers in the CMOS package.

The integration of the new Atlas chipset, which is based on Marvell’s Polaris 50G PAM4 DSP family,  reduces supply chain complexity and power consumption by up to 25%. Atlas is also the industry’s first PAM4 DSP available to wire bond directly with lasers and photodiodes, further simplifying the assembly process for optical module integrators, effectively reducing both product lead times and time to market. Sampling is underway.

Atlas PAM4 DSP Key Features:

• Leverages Polaris-class quad-channel DSP core, providing world-class performance and signal integrity while driving faster time to market and product yields.
• Uses existing Polaris DSP software, minimizing software development expense for module developers.
• Comprehensive suite of performance monitoring tools to reduce bring-up time and support mission-mode telemetry critical for hyperscale deployments.
• Integrated laser drivers support both single- and multi-mode interconnect applications.
• Suitable to support a wide range of module form factors including OSFP, QSFP56, QSFP-DD and AOCs.
• Broad range of IEEE standard support including 100G-xR2, 200G-xR4 and 400G-xR8.
• Manufactured in mainstream CMOS process technology optimized for high volume production to deliver a high-performance, low-power PAM4 DSP solution.

“Disaggregated data centers define today’s new cloud computing paradigm, and this trend is driving hyper-connectivity within the data center, putting PAM4 data center interconnects at the heart of the network,” said Xi Wang, VP of Marketing, Optical Connectivity at Marvell. “The new Atlas PAM4 DSP targets this burgeoning, high-volume data center market as well as cost-sensitive applications at the network edge.”

“Marvell understands the requirements of today’s hyperscale data center operators and has delivered a highly integrated, high-performance PAM4 DSP.

https://www.marvell.com/ 

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OSFP MSA completes specification for 800G modules

The Octal Small Form Factor Pluggable (OSFP) Multi Source Agreement (MSA) group has published its OSFP 4.0 Specification for 800G OSFP modules. 

While the OSFP module was designed from the beginning to support 800G performance, the OSFP 4.0 specification adds support for dual 400G and octal 100G breakout modules with dual LC, dual Mini-LC, dual MPO and octal SN/MDC fiber connector options.

“At 800G, the number of use cases involving aggregation or breakouts are increasing,” said Andreas Bechtolsheim, OSFP MSA Chair. “Being able to use existing standard fiber connectors for these breakout ports is a key issue since it avoids the optical performance impact and cost of fiber adaptor cables, splitter cables or patch panels.”

“Cloud operators have deployed tens of millions of LC and MPO fiber connectors with existing optics transceivers,” said Sameh Boujelbene, Senior Director at Dell’Oro Group. “A smooth transition from single port to dual port 400G optics in the 800G form factor requires backward compatibility with this large installed base of fiber connectors.”

“The ability to do rolling networking upgrades in existing cloud data centers is essential since cloud data centers are always on,” said Alan Weckel, Founding Technology Analyst at the 650 Group. “As the Cloud grows in size, the majority of equipment installed goes into existing facilities, a very different dynamic compared to previous upgrade cycles. Being able to install new network switches without replacing millions of installed fiber connectors is one of the most important issues customers are facing as they transition to 800G optics form factor modules.”

“The OSFP 4.0 specification offers customers compatibility with existing fiber connectors and a broad choice of potential optical breakout options, which will likely become even more important with the upcoming early adoption of 800GbE data center switching starting next year,” said Seamus Crehan, President of Crehan Research.

With the 800G OSFP module specification completed, the OSFP MSA has sponsored a working group that is defining 200G/Lane electrical specifications to support 1600G OSFP modules. When this activity is completed, this development will be merged into a future OSFP 5.0 Specification.

“We have received strong interest from OSFP MSA members to start the 200G/Lane Electrical Signaling Group,” said Brian Kirk, Director of Engineering, Amphenol Corp. “Based on the work done so far, we are confident that the OSFP module will be able to support 200G electrical signaling speed per lane in a backward compatible fashion.”

“1600G-OSFP enables next-generation switch designs with up to 57.6T bandwidth per rack unit,” said Nathan Tracy, Technologist at TE Connectivity. “It is remarkable that the OSFP can support this level of bandwidth density in a pluggable form factor.”

https://www.osfpmsa.org/press-releases/pr-20210603.html

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Corning intros bendable SMF-28 optical fiber

Corning introduced its SMF-28 Contour optical fiber featuring enhanced bend resilience, network compatibility, and industry-leading low loss characteristics.

Highlights:

• Superior bendability designed to reduce the impact of errors during installation and optimize reach in densely cabled environments where 5G networks are being deployed. SMF-28 Contour fiber is an ITU-T G.657.A2 fiber that has 10 times the macrobend resilience of G.652.D fibers and seven times the macrobend resilience of G.657.A1 fibers. The associated increase in microbend resilience enables dense, high-fiber-count cables needed to meet the demands of future high-capacity networks.
• 
  Exceptional compatibility with legacy networks while providing superior bend protection, which can mean up to 50% faster installation by minimizing corrective splice-loss work. Other G.657.A2 fibers also provide bend protection but with a compromised, lower mode field diameter. SMF-28 Contour fiber does not compromise, providing both G.657.A2 bend protection and a matched 9.2-micron mode field diameter in the same product.
• Wide spectrum and industry-leading low-loss transmission across all the wavelengths that constitute the communication systems of today and tomorrow. First, SMF-28 Contour fiber’s industry-leading low attenuation delivers 10% longer reach in all networks and up to 20% wider access-network coverage. Second, SMF-28 Contour fiber’s bend loss protection enables up to twice the network reach in new long-wavelength FTTH systems. Together, these features enable larger FTTH subscriber areas and greater revenue potential.

SMF-28 Contour fiber is available in a standard 242-micron configuration and a smaller 190-micron configuration. 

Corning says smaller-diameter designs are increasingly important because while bandwidth demands have grown, the space available for network infrastructure has not. The 190-micron version of SMF-28 Contour fiber enables smaller cables with higher fiber counts – maximizing use of existing infrastructure

“Corning’s revolutionary SMF-28 Contour optical fiber is the latest example of our ability to solve tough industry challenges,” said Dr. Bernhard Deutsch, vice president and general manager, Corning Optical Fiber and Cable. “Operators today are looking to deploy future-ready networks as efficiently as possible, often in densely cabled environments, and we’ve designed this new product to answer those needs. Fifty years after Corning scientists invented the first low-loss optical fiber, we’re proud to help drive a new era of industry growth and network transformation.”

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Lumentum intros 400G CFP2-DCO coherent modules, PAM4 DMLs with 2 km reach for 400G+

At next week's virtual Optical Fiber Communication Conference (OFC) Lumentum will introduce new 400G CFP2-DCO coherent modules, enhanced PAM4 DMLs with 2 km reach for 400G+ applications, and expanded WSS capabilities.

The new high-performance 400G CFP2-DCO coherent transmission modules build on the company's existing its 200G CFP2-DCO coherent pluggable transceiver modules, enabling next-generation data center interconnects (DCI) and metro/regional to long-haul coherent networks at bit rates of 100G, 200G, 300G, and 400G. The new flex-coherent module supports all major industry initiatives including OpenROADM, OpenZR+, and OIF 400G ZR. It also adds numerous innovative proprietary modes when best performance is needed and cross-vendor interoperability is not. In addition, it supports L1 encryption, Link Layer Discovery Protocol, and Overhead IO channel. Currently, the 400G CFP2-DCO is shipping as beta samples with production release planned for the third quarter of 2021. To sample the 400G CFP2-DCO, contact a Lumentum representative at customer.service@lumentum.com.

High-Speed 100G PAM4 DML for up to 2 km Data Center Reach 400G+ Applications - Lumentum has enhanced its latest 100G PAM4 (53 Gbaud) directly-modulated laser (DML) to expand the usage from 500m for 100G DR and 400G DR4 and 100m for 800G PSM8 DR4, to also transmit up to 2 km for 100G FR and 400G FR4 CWDM transceiver module applications. These DMLs satisfy the needs of customers seeking lower cost and lower power consumption solutions by providing a smaller footprint with fewer components needed to operate in high-speed transceiver applications. To request beta samples of the new 100G PAM4 DML for 2 km applications, contact a Lumentum representative at customer.service@lumentum.com.

Expanded Capability for its TrueFlex wavelength selective switches (WSS) to now support all spectral bands, including C-band, L-band, and extended C-band for next-generation colorless, directionless, and contentionless (CDC) and colorless, directionless (CD) ROADM architectures. Additionally, Lumentum has reinforced their exceptional manufacturing scale with production, agility, and flexibility to rapidly respond to changes in requested build configurations and spectral bands across any of its high-performance WSS products. Lumentum's best-in-class lead on WSS delivery continues to be a critical enabler for network operators worldwide as they resume buildouts of massively-scalable and flexible high-capacity optical networks.

https://www.lumentum.com/en/media-room/news-releases/lumentum-highlight-and-present-latest-innovations-ofc-2021-virtual-event

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OE Solutions announces 400G QSFP-DD LR4 transceiver with 10km reach

OE Solutions announced a new high-speed optical transceiver module, the 400G QSFP-DD LR4 supporting distances up to 10km. 

The 400G QSFP-DD LR4 module, which utilizes the standard 4 CWDM wavelengths from 1271nm to 1331nm, will be available for testing in Q4 of this year and mass production will commence in Q1 2022.

“We are very excited to announce our first 400G transceiver module”, said Per Hansen VP of Marketing and Sales at OE Solutions America. “This module utilizes the latest technology to enable a maximum power consumption of only 10W, which is critical for many high-density applications in both telecom and datacom.”

https://oesolutions.com/

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