Thursday, January 24, 2019

Perspective: The Best of Optics Technology in 2019

by Martin Zirngibl, Finisar CTO 

400G needed for explosive bandwidth growth everywhere in the network

It seems like 100G pluggable modules were introduced just yesterday but they are already running out of steam for leading-edge applications. 2019 will be the year of the early roll-outs of 400G across the entire network, for short-reach links such as server-to-top-of-rack switches in data centers, for leaf-to-spine connections inside data centers, for data center interconnection links (DCI) and DWDM metro networks.

But there is no one-size-fits-all solution

Although 400G will appear almost simultaneously throughout the network, there is no one-size-fits-all solution. Cost, power and footprint per bit need to be carefully tailored for each application, requiring a diverse set of technologies to optimally address the various distances and capacities. There is a strong trade-off between power consumption, footprint and cost of transponders versus their performance in reach and fiber capacity, which translates into the cost of the link. For instance, an electrical copper link based on direct attach copper cables (DAC) consumes on the order of 1W/100G and costs a few dollars but it can only reach three meters. On the other end of the spectrum, an optical transmitter transponder for long haul (several thousand km) burns up to 30-40W/100G and costs about three orders of magnitude more than the above copper link. A network provider must carefully choose the interconnection technology in their network. If the technology has too much performance, then there is a penalty to be paid in terms of power and cost. However, a transponder with low performance may constrain the scalability of future network expansions.

Multimode fiber (MM) will increasingly replace copper for high volume server to TOR links
 There are three types of optical interconnection technologies today: optical multimode, optical single-mode direct detect, and optical signal-mode coherent. Optical multimode transponders can be as low as 2W per 100G power consumption. They are based on Vertical Cavity Emitting Lasers (VCSEL) which are directly modulated. VCSEL-based multimode technology is very cost-effective since VCSELs can be processed and tested on wafer scale and the alignment tolerances of MM is very forgiving, allowing low-cost packaging technology. The main disadvantage of MM is their short reach: At 400G it is typically 30-70m, limited by modal dispersion. Multimode links can come in the form of parallel fibers, where there is typically one fiber per 50G lane capacity; or wavelength division multiplexed channels, where there are 4 lanes of 50G per fiber, the latter reducing the amount of fiber four times.

It is expected MM links will become the “new copper” and therefore their volumes will explode. Indeed, the great majority of links in a data center are between the servers and the top-of-rack switch and currently, they are based on electrical copper cables. Their volume dwarfs that of all the other optical links in a data center. But as SERDES speeds increase to 100G, the reach of copper links will be significantly curtailed, thus many of these high-volume links will need to become optical. This transition represents a significant opportunity for optical multimode VCSEL technology and they will be even more ubiquitous in all data centers.

For links beyond 100m, SiP and InP are competing for lowest cost solution
Once reach needs to extend beyond 100 meters at 400G, single mode optics is required. There are several technology options: Silicon Photonics (SiP), direct modulated lasers (DML) and externally modulated lasers (EML). It is generally accepted in the technical community that SiP-based transponders are best suited for parallel fiber, with one 100G lane per fiber, because this technology allows sharing of a single laser source amongst multiple modulators, each one creating a 100G lane. The sweet spot for parallel-fiber solutions is around 500m applications, although technically SiP can go longer reaches, the cost of the parallel fibers starts to outweigh the transponder cost savings. For links that need to reach 2km or 10km, most network providers, therefore, prefer duplex fiber, reducing the amount of fibers fourfold. Since either four or eight separate wavelengths are now required, the above described laser sharing is no longer an option thereby making DMLs and EMLs appealing. However, SiP solutions are also competing in this space and the jury is still out about which technology will eventually dominate.
 
Coherent transponders will dominate the DCI and metro applications 

Of course, the bandwidth explosion will ripple through data center interconnection, metro and access networks as well. It is the consensus in the technical community that for distances >30km and rates of 100G and above coherent technologies offer the best trade-offs between cost of the transponders versus cost of the fiber plant. One big advantage of coherent is that the fiber plant does not have to be engineered, because a coherent transponder can undo most of the transmission impairments on its own. Coherent transponders can also bridge very lossy links without need of optical amplification, making them attractive even for access networks.

Finisar to play in all segments: multimode, single-mode direct detect and coherent

In 2019, Finisar expects to ship 400G products across all reaches. We are now sampling single mode parallel 400G modules based on internal Silicon Photonics (shown at ECOC 2018), supporting up to 500m links.  For longer reaches (2km) and duplex fiber, 400G FR8 pluggable modules based on InP components are also available. Direct detect at 400G can even go much longer; our recently demonstrated QSFP-DD “eLR8” module with directly modulated 50G lasers can transmit data up to 30km through unamplified grey optics links. For coherent optical links we have developed what we believe is the highest integrated, lowest power coherent optical components on the market. The integrated tunable transmitter receiver assembly (ITTRA) integrates all the optical and control functionality into a single gold box. These very small form factor components are designed to fit into future coherent pluggable modules such as QSFP-DD, OSFP, CFP2, and CFP4. Its bandwidth of 40GHz will enable capacities of about 600Gb/s per single wavelength, something that was unimaginable only a few years ago. The low power, cost and footprint profile of the ITTRA will make coherent competitive for new non-unamplified applications that have been, up to now, the undisputed domain of direct detect technology.

Only the future will tell where the boundaries between multimode, single-mode direct detect, and coherent lies. There are powerful new technologies such a Silicon Photonics, low-power CMOS, chip-on-glass packaging technology and high-volume applications in data centers and 5G Mobile networks that will push the boundaries in unknown directions. What is clear is that Finisar has all the tools and technologies in-house to offer products that are cost and performance competitive for any of the emerging optical interconnection needs.


Martin Zirngibl was named Corporate CTO of Finisar in June 2018. He joined the company in 2016 as a VP Technology Fellow responsible for coherent product strategy. Prior to Finisar, he held progressive managerial roles at Nokia Bell Labs including Director of Optical Networking Research and Executive Director of Device and Subsystems Research. He also served as a member of technical staff at AT&T Bell Laboratories. Dr. Zirngibl holds a PhD in Physics from the Swiss Institute of Technology, Lausanne and a Diploma in Theoretical Physics from the same Institute. He received the Bell Labs Fellow award in 2008 and has published more than 100 scientific papers and filed over 50 patents.

Huawei launches its own 5G Base Station core chip

Huawei introduced its own core chip for 5G base stations.

Huawei said its TIANGANG chip will support networks of all standards and all bands (C band, 3.5G, and 2.6G), helping customers access the best wireless and microwave services. Huawei said its silicon design aims for simplified 5G networks and large-scale 5G network deployment all over the world. The chip can support large-scale integration of active power amplifiers (PAs) and passive antenna arrays into very small antennas. It also boasts super high computing capacity, with a 2.5-fold increase over previous chips. Using the latest algorithms and beamforming technology, a single chip can control up to 64 channels, which is the industry's highest standard. This chip also supports the 200 MHz high spectral bandwidth, getting ready for future network deployment.

Huawei also claims significant improvements in active antenna units (AAUs), with 50% smaller, 23% lighter, and 21% less power consuming base stations.

"Huawei has long been committed to investing in basic science and technology. We were the first to make breakthroughs in key technologies for large-scale 5G commercial use," said Ryan Ding, Huawei Executive Director of the Board and Carrier BG CEO.

To date, Huawei claims 30 commercial 5G contracts. The company says it has already shipped over 25,000 5G base stations globally.

Microsemi and Acacia collaborate on Flexible Rate Optical at up to 600G

Microsemi and Acacia Communications announced interoperability between Microchip’s DIGI-G5 Optical Transport Network (OTN) processor and Acacia’s AC1200 Coherent Module.


Microsemi's DIGI-G5 OTN processor supports FlexE and OTUCn protocols, enabling new terabit scale line cards with flexible rate optical interfaces for packet optical transport platforms. Acacia's AC1200 modules support for metro and data center interconnect networks. Specifically, while the DIGI-G5 processes client traffic into OTN, the 1.2T AC1200—powered by Acacia’s Pico digital signal processor (DSP) ASIC—on the line card will enable the OTN connections over two 600G tunable DWDM wavelengths with flexible transmission three-dimensional (3D) shaping features. These features, which include fractional quadrature amplitude modulation (QAM) and adaptive baud rate optimize transmission reach and capacity, approaching theoretical limits on a wide range of network configurations, in a power efficient manner.

The companies said their collaboration enables the first flexible rate system architectures with an established ecosystem to support the market’s transition to 200G, 400G, 600G and flexible rate OTN networks built with new Flexible Ethernet (FlexE) and OTUCn protocols. FlexE was designed to provide up to 30 percent greater bandwidth efficiency compared to traditional Ethernet link aggregation (LAG) with fewer limitations. Combining it with OTUCn and tunable fractional dense wavelength division multiplexing (DWDM) transmission brings service providers the potential to improve their OTN network capacity by up to 70 percent.

“DIGI-G5 allows our optical transport system partners to deliver terabit-class OTN switching line cards at 50 percent less power per port while enabling flexible rate ports and protocols up to 600G,” said Babak Samimi, vice president for Microchip’s Communications business unit. “Demonstrating interworking of the DIGI-G5 with Acacia’s AC1200 coherent module highlights that the ecosystem is ready to support the market transition to these new protocols, rates and multi-terabit architectures.”

“In addition to high capacity and density, our AC1200 module introduces several key features designed to enable network operators to optimize capacity, reach and spectral efficiency —making flexible transmission solutions up to 600G a reality,” said Benny Mikkelsen, Chief Technology Officer of Acacia Communications. “With Microchip’s DIGI-G5 scaling up capacity and reducing power at the same time, and the optical performance provided by our AC1200, we believe that Acacia and Microchip are helping to enable the market to scale network capacity with improved efficiency.”

ECOC 2018: Acacia presents 600 Gbps per Wavelength Coherent Transmission

At the European Conference on Optical Communications (ECOC) in Rome, Acacia Communications demonstrated its AC1200 coherent module with dual-core design enabling 1.2 Tbps error-free transmission over fiber with 600 Gbps per wavelength.

The Acacia AC1200 module supports transmission capacity of up to 1.2 Tbps in a footprint that is 40 percent less than the size of the 5” x 7” modules that support transmission speeds of 400 Gbps today.

The module is based on Acacia’s Pico DSP ASIC, which utilizes two wavelengths that can be configured to support from 100 Gbps to 600 Gbps capacity each. The Acacia AC1200 supports a suite of advanced three-dimensional (3D) shaping features that may be optimized to enable performance approaching theoretical limits on a wide range of network configurations.

Acacia shipped its first AC1200 module customer samples in March 2018 and anticipates production to begin by the end of 2018.

Acacia said its high-capacity solution targets the requirements for connections between large data centers with reaches of 100km and above using standard single-mode fiber.

 Microsemi's DIGI-G5 powers Terabit OTN switching cards
Microsemi introduced its DIGI-G5 Optical Transport Network (OTN) processor for terabit capacity OTN switching cards.

The company said this newest generation in its DIGI franchise enables packet-optical transport platforms to triple in capacity while slashing power consumption by 50 percent per port.

DIGI-G5 delivers 1.2 terabits per second (Tbps) of combined OTN and client interfaces and is first to market with newly standardized 25 Gigabit Ethernet (GE), 50GE, 200GE, 400GE, Flexible OTN (FlexO) and Flexible Ethernet (FlexE) with integrated security engine enabling flexible encrypted optical connections.

Transporting Ethernet, storage, intellectual property (IP)/ multiprotocol label switching (MPLS) and 4G/5G Common Public Radio Interface (CPRI)/eCPRI services over 100G OTN switched connections has proven to be the most fiber, power and cost-efficient deployment solution for moving bits in today's metro and long-haul networks.

“Our DIGI OTN processor portfolio has been instrumental in transforming service provider networks to mass deploy 100G OTN switched networks,” said Babak Samimi, vice president and business unit manager for Microsemi's Communications Business Unit. “Our DIGI-G5 breaks new ground by enabling the industry’s transition to new OTN 3.0 architectures at terabit scalability by delivering three times the port density while lowering power consumption by 50 percent per port.”

DIGI-G5 highlights

  • Total interface bandwidth of up to 1.2Tbps
  • Comprehensive Ethernet support: 10GE, 25GE, 50GE, 100GE, 200GE, 400GE and the new OIF FlexE specification
  • New OTN 3.0 rates, enabling flexible (FlexO) and fractional 100G+ (OTUCn, OTUCn-m) transmission
  • 56G PAM-4 Serializer/Deserializer (SerDes) allows direct connection to QSFP-DD, OSFP and coherent digital signal processors (DSPs)
  • Integrated packet test set enables remote troubleshooting and debug, driving down capital and operating expenditures
  • Integrated security engine enabling end-to-end AES-256 based encryption and authentication
  • Integrated G.HAO bandwidth-on-demand processing for OTN switching networks
  • Innovative DIGI-Mesh-Connect architecture which enables compact, pay-as-you-grow OTN switching at lowest cost and power by eliminating the need for a centralized switch fabric device.
  • Sampling is expected in Q2

Linux Foundation targets Unified Open Source Framework for the Edge

The Linux Foundation is unifying a number of its projects into a new umbrella organization to establish an open, interoperable framework for edge computing independent of hardware, silicon, cloud, or operating system. The goal is the formation of a software stack that brings the best of telecom, cloud, and enterprise (representing location, latency and mobility differentiation).

LF Edge is initially comprised of five projects: Akraino Edge Stack, EdgeX Foundry, and Open Glossary of Edge Computing, formerly stand-alone projects at The Linux Foundation. The initiative also includes a new project contributed by Samsung Electronics, which will create a hub for real-time data collected through smart home devices, and another project from ZEDEDA, which is contributing a new agnostic standard edge architecture.

“The market opportunity for LF Edge spans industrial, enterprise and consumer use cases in complex environments that cut across multiple edges and domains. We’re thrilled with the level of support backing us at launch, with 60 global organizations as founding members and new project contributions,” said Arpit Joshipura, general manager, the Linux Foundation. “This massive endorsement, combined with existing code and project contributions like Akraino from AT&T and EdgeX Foundry from Dell EMC, means LF Edge is well-positioned to transform edge and IoT application development.”

LF Edge is already supported by the following founding members: (Premier) Arm, AT&T, Baidu, Dell EMC, Dianomic Inc., Ericsson, HP Inc., HPE, Huawei, IBM, Intel, inwinStack, Juniper Networks, MobiledgeX, Netsia, Nokia Solutions, NTT, OSIsoft, Qualcomm Technologies, Radisys, Red Hat, Samsung Electronics, Seagate Technology, Tencent, WindRiver, Wipro, ZEDEDA; and (General) Advantech Co., Alleantia srl,  Beechwoods Software Inc., Canonical Group Limited, CertusNet, CloudPlugs Inc., Concept Reply, DATA AHEAD AG, Enigmedia, EpiSensor, Foghorn Systems Inc., ForgeRock US Inc., Foundries.io, Hangzhou EMQ Technologies Co. Ltd., IOTech Systems Ltd., IoTium, KMC, Linaro, Mainflux, Mocana, NetFoundry, Packet, Pluribus Networks, RackN, Redis Labs, VaporIO, Vitro Technology Corp., Volterra Inc., Wanxiang Group; and (Associate) Automotive Edge Computing Consortium (AECC), Beijing University of Posts and Telecommunications (BUPT), Electronics and Telecommunications Research Institute (ETRI), Infrastructure Masons, Inc., and Project Haystack.

More about LF Edge projects: 

  • Akraino Edge Stack -- creating an open source software stack that supports high-availability cloud services optimized for edge computing systems and applications;
  • EdgeX Foundry -- focused on building a common open framework for IoT edge computing.
  • Home Edge Project -- seed code contributed by Samsung Electronics, is a new project that concentrates on driving and enabling a robust, reliable, and intelligent home edge computing framework, platform and ecosystem running on a variety of devices in our daily lives.
  • Open Glossary of Edge Computing -- provides a concise collection of terms related to the field of edge computing.
  • Project EVE (Edge Virtualization Engine) -- contributed by ZEDEDA, will create an open and agnostic standard edge architecture that accommodates complex and diverse on- and off-prem hardware, network and application selections.


Intel grew 13% in 2018 but outlook disappoints

Intel reported Q4 2018 revenue of $18.7 billion, up 9 percent year-over-year (YoY); and full-year revenue set an all-time record of $70.8 billion, up 13 percent YoY. Q4 earnings per share amounted to $1.12 ($1.28 on a non-GAAP basis);

The Q4 results, however, fell short of analyst expectations, as did the company's outlook for 2019. Data center revenues came in below market expectations. The company has not yet appointed a permanent CEO. Intel said it remains on-track to launch 10nm products in volume during 2019.

“2018 was a truly remarkable year for Intel with record revenue in every business segment and record profits as we transform the company to pursue our biggest market opportunity ever,” said Bob Swan, Intel CFO and Interim CEO. “In the fourth quarter, we grew revenue, expanded earnings and previewed new 10nm-based products that position Intel to compete and win going forward. Looking ahead, we are forecasting another record year and raising the dividend based on our view that the explosive growth of data will drive continued demand for Intel products.”


Some highlights:

The PC-centric business (CCG) was up 10 percent in the fourth quarter due to continued strong demand for Intel's higher performance products and strength in commercial and gaming. CCG expanded its product portfolio for 2019 with the recent launch of new 9th Gen Intel® Core™ processors and unveiled "Ice Lake" the upcoming, 10nm-based PC processor, which is expected to be in OEM systems on shelves for holiday, 2019.

Collectively, Intel's data-centric businesses grew 9 percent YoY in the quarter and 20 percent YoY in 2018. In the fourth quarter, DCG achieved 24 percent cloud segment growth and 12 percent communications service provider segment growth while enterprise revenue declined 5 percent. Intel recently announced that the new "Cascade Lake" family of high performance Intel® Xeon® processors with advanced AI and memory capabilities is now shipping.

Fourth-quarter Internet of Things Group (IOTG) revenue declined 7 percent YoY. However, excluding Wind River, which Intel divested in the second quarter, fourth-quarter IOTG revenue was up 4 percent YoY despite supply tightness. Record quarterly revenue in Intel's memory business (NSG) was up 25 percent YoY. Intel's Programmable Solutions Group (PSG) also achieved record quarterly revenue, up 8 percent YoY driven by strength in the data center and communications market segments.

Mobileye fourth-quarter revenue of $183 million was up 43 percent YoY as customer momentum continued. In 2018, Mobileye achieved 28 new design wins and 78 vehicle model launches.

Telefónica sells affiliates in Guatemala and El Salvador to América Móvil

Telefónica agreed to sell its interests in local affiliates in Guatemala and El Salvador to América Móvil for EUR 570 million.

The aggregate amount of the transaction (enterprise value) for both companies is US$648 million (approximately EUR 570 million at the current exchange rate, EUR 293 million of which correspond to Telefónica Guatemala and EUR 277 million to Telefónica El Salvador), an implicit multiple for the total amount of the transaction of 9.7 times the estimated 2018 EBITDA of the two companies. Both of the local affiliates provide mobile, fixed line voice, data and paid TV services.

Telefónica said it is disposing of these assets as part of its portfolio management policy based on a strategy of value creation, improving return on capital and strategic positioning.

Wednesday, January 23, 2019

Vodafone and Telefónica UK expand network sharing deal to 5G

Vodafone and Telefónica UK agreed to extend their existing network sharing partnership to include 5G at joint radio network sites and to upgrade their optical transmission networks.

The carriers said the expanded partnership will enable them to deploy 5G faster, to offer 5G services to more customers over a wider geographic area, and to do so at a lower cost. However, the companies plan to extend greater network autonomy in a number of larger cities by deploying their own separate radio equipment on approximately 2,500 sites, which represents around 15% of sites outside London.

In addition, Vodafone and O2 further intend to devolve additional activities to CTIL, the 50:50 owned joint venture company that owns and manages the parties’ passive tower infrastructure. This will empower CTIL to take an enhanced role in the operation of the passive infrastructure, in order to improve the efficiency of its operations and pursue opportunities to add further third party tenants to the towers. In that context, the parties will explore a potential monetisation of CTIL after the new arrangements have been finalised.

Nick Jeffery, CEO, Vodafone UK, said: “We believe that these plans will generate significant benefits for our business and our customers as we move into the digital era of connected devices, appliances and systems on a mass scale. Customers will benefit from the best 5G experience available and we will deliver even faster speeds by using our spectrum holding more effectively.”

Mark Evans, CEO, Telefónica UK, said: “I’m excited by the potential of these plans to meet the future needs of our customers while delivering value for our business.  In addition, these plans would allow us to utilise the spectrum we acquired in the last auction very effectively.”  

AWS to lease fiber pair on Marea's transatlantic cable

Amazon Web Services (AWS) signed an IRU agreement for the use of a fiber pair on MAREA, the transatlantic submarine cable partially owned by Telxius.

MAREA is the highest capacity submarine cable in the world and provides the lowest latency route between the U.S. and Southern Europe. The route is further south than other transatlantic cables, with landing points in Virginia Beach and Sopelana, Spain.

“We have developed a deep relationship with Amazon Web Services across the geographies we serve and are excited by their long-term commitment with the MAREA submarine system. As the market pioneer and leader in cloud IaaS for over 10 years, it’s encouraging to see AWS active in the subsea cable market. Cloud providers increased activity in the cable business is now a major driver of the submarine telecom industry,” says Rafael Arranz, Chief Operating Officer of Telxius, Cable Business.

https://telxius.com/en/amazon-web-services-agreement/

Microsoft and Facebook test 400G on trans-Atlantic cable

A field demonstration conducted by Acacia Communications, in collaboration with Microsoft and Facebook, achieved the first 400G single carrier DWDM transmission over the 6,600 km Marea submarine cable between Virginia Beach, Virginia and Bilbao, Spain. The transmission employed Acacia’s AC1200 coherent module, which is powered by its Pico digital signal processor.  Utilizing Acacia’s patented Fractional QAM modulation, the field demonstration achieved 400G transmission using approximately 4 bits/symbol, with a baud rate of nearly 70Gbaud. Additionally, modulation formats greater than 4 bits/symbol were utilized to achieve a spectral efficiency of 6.41 b/s/Hz on the same 6,600 km cable.

The Marea submarine cable, a joint project between Microsoft, Facebook, and global telecommunications infrastructure company Telxius, features an “open” design that allows it to evolve with technology and enables adoption of new technologies, such as the Acacia AC1200 coherent module.

http://www.acacia-inc.com


MAREA redefines the transAtlantic subsea bandwidth equation

Construction of the highest-capacity subsea cable to cross the Atlantic is now complete.

The 6,600 km MAREA subsea cable, which was jointly funded by Microsoft and Facebook, links Virginia Beach, Virginia to Bilbao, Spain. The cable will be managed by Telxius, Telefónica’s new infrastructure company. The cable features eight fiber pairs and an initial estimated design capacity of 160 Tbps.

The cable takes a more southern route than other transatlantic cables, which mostly connect northern Europe to the New York/New Jersey region.

  • TE SubCom served as the system supply partner for MAREA.

Arrcus extends its network OS to 400GbE switches

Arrcus, a start-up offering an independent, Linux-based network operating system, announced support for multiple 400GbE and high-density 100GbE switching platforms.

ArcOS is a modular, extensible microservices-based networking software for building scale-out networks. A production release is available for switches based on Broadcom's StrataXGS Trident 3 and StrataDNX Jericho+ platforms.

Arrcus is now adding support for Broadcom’s StrataXGS Tomahawk 3 silicon, with platforms from multiple ODM vendors, featuring 32 ports of 400G (1 RU) and 128 ports of 100G (4 RU).



This enables use cases including hyperscale data center IP fabrics for deep learning workloads, massively distributed and inter-connected edge data centers in telco cloud environments (PoPs, central offices, edge computing clusters, etc.) as 5G networks roll out; and flatter topology of high-radix, low-latency storage environments using high-density 100G and 400G interconnects.

Key features enabled on these platforms include:

  • Faster network speeds - 12.8 Terabits/sec line-rate switching (2X the performance compared to previous generation)
  • 4X increase in port density compared to existing 100G switches
  • Larger switching and routing databases with improved convergence times at global mega-data-center scale
  • New high-performance shared buffering and congestion control architecture to reduce tail latencies for AI and machine learning workloads
  • Traffic-aware scheduling for elephant flow detection and re-prioritization
  • Enhanced ECMP hashing and dynamic load balancing to optimize performance in cloud and HPC environments
  • Comprehensive ArcOS feature support with in-built automation and real-time visibility
  • QSFP-DD optic support for 50G/100G/200G and 400G speeds with flexibility to support other optics alternatives per market demand

 “Immersive, data-intensive applications demand major advancements in network-bandwidth, scale-out performance, and convergence latency. To meet this explosive growth, our customers are looking for faster, smarter, and better networking solutions,” said Devesh Garg, Co-founder and CEO, Arrcus. “ArcOS delivers all of these and our rapid support of Tomahawk 3-based platforms unlocks elastic, open networking, standards-based solutions for building flatter, high-density data center fabrics.”

“With our flagship 12.8Tbps StrataXGS Tomahawk 3 Switch silicon anchoring the current wave of 100GbE and 400GbE cloud network deployments, we are pleased to work with Arrcus to enable their differentiated ArcOS solution”, said Ram Velaga, Senior Vice President and General Manager, Switch Products, Broadcom. “The combined platform addresses the need for flatter, cost-effective, highly resilient networks with lower end-to-end latency while delivering massive bandwidth for distributed, data-intensive applications.”

Arrcus is based in San Jose, California.

http://www.arrcus.com

Broadcom confirms mass production of 12.8 Tbps Tomahawk 3 

Broadcom's StrataXGS Tomahawk 3 switch series is now in mass production.

The Tomahawk 3 series supports high-density, line-rate 400GbE, 200GbE, 100GbE, and 50GbE interconnect for massive scale-out of software-defined cloud data centers. The Tomahawk 3 switch series features multiple devices at 12.8Tbps, 8.0 Tbps, and 6.4 Tbps based on the industry’s most performant 50G PAM4 / 25G NRZ SerDes technology. All devices in the series have completed extensive functional, performance, and reliability testing and have been qualified for volume production.

“We are delighted and humbled by the widespread adoption of Tomahawk 3 based switching solutions in cloud infrastructure,” said Ram Velaga, senior vice president and general manager, Switch Products at Broadcom. “Our engineering team has executed to the demands of the largest cloud operators globally, including the most rigorous system and network-level qualification requirements – both in our labs and in customer testbeds. Network operators are able to immediately deploy Tomahawk 3 based fabrics, at scale, and with confidence.”

Broadcom announces 12.8 Tbps Tomahawk 3 switching silicon

Broadcom announced commercial shipments of its StrataXGS Tomahawk 3 Ethernet switch silicon boasting 12.8 Terabits/sec in a single device -- double that of any other switching chip currently in the market.

Tomahawk 3 paves the way for high-density, standards-based 400GbE, 200GbE, and 100GbE switching and routing for hyperscale cloud networks. The latest gen silicon is expected to be adopted by leading network equipment OEMs as well as by hyperscale cloud companies.

Third party companies cited in the product announcement included Microsoft, Alibaba, Arista Networks, Baidu, Juniper Networks, LinkedIn, Tencent, Accton, Celestica, Delta Networks, Quanta, Applied Optoelectronics, Foxconn Interconnect Technologies, Intel Silicon Photonics, and Luxtera.

The new chip, which arrives 14 months after Broadcom introduced its 6.4Tbps product generation, offers 40% lower power consumption per 100GbE switch port and up to 75% lower cost per 100GbE switch port.

Key features of the StrataXGS Tomahawk 3 Series:

  • Supports 32 x 400GbE, 64 x 200GbE, or 128 x 100GbE line-rate switching and routing on a single chip
  • Delivers 40% reduction in power per 100Gbps, and up to 75% lower cost per 100Gbps, versus alternatives
  • New, state-of-the-art, integrated 12.8Tbps shared-buffer architecture offers 3X to 5X higher incast absorption and provides the highest performance and lowest end-to-end latency for RoCEv2 based workloads
  • Broadview Gen 3 integrated network instrumentation feature set and software suite provides full visibility to network operators into packet flow behavior, traffic management state, and switch internal performance
  • Supports all packet processing and traffic management requirements for next-gen hyperscale network use cases: >2X IP route forwarding scale, 2X ECMP scale, Dynamic Load Balancing and Group Multipathing, In-Band Network Telemetry, Elephant Flow detection and re-prioritization
  • Robust connectivity using 256 instances of the best performing and longest-reach 50G PAM-4 integrated SerDes core, enabling long-reach (LR) East-West optical links and Direct-Attached-Copper (DAC) in-rack cabling in the data center, fully compliant to new IEEE standards for 50/100/200/400GbE
  • Implemented on proven, high-volume 16nm process technology node, ensuring fastest time to CY2018 production network deployment for hyperscale customers 

Jingfang Optotelectronics acquires Eindhoven-based Anteryon

Jingfang Optotelectronics (WLOPTs), which is based in Suzhou, China, has acquired Anteryon International B.V and Anteryon Wafer Optics B.V. Financial terms were not disclosed.

acquired the Dutch optical precision components and assembly designer and manufacturer Anteryon to steal a march on new opportunities.

Anteryon, which is based in Eindhoven, Netherlands, was spun off from Philips. The company is an assembly designer and manufacturer of precision optical components. Its core technologies comprise of IP and a proprietary world class replication technique to produce high-end hybrid optical lenses combined with ultraprecise glass and surface structuring, optical and mechanical coatings and opto-mechanical and -electronic assemblies including Hyper Spectral Imaging. Industrial applications range from semiconductor, industrial sensing/scanning, construction, agriculture, medical and security and consumer applications.

"This acquisition is an important milestone in WLOPTs long-term growth strategy and provides WLOPT with access to key technologies for the development of miniaturized optical solutions for high-volume consumer applications, such as smartphones, next-generation security and automotive applications," said Wang Wei, WLOPT's chairman. "By leveraging our core competencies in building mega scale service, technology and IP businesses, we believe that we can effectively enter emerging application areas related to the Internet of Things and Artificial Intelligence, next to current applications as 3D scanning, Imaging and Fingerprint while vertically integrating in the value chain. The Anteryon technology and renowned team of experts in micro-optics, combined with our resources, will strengthen our ability to provide radically distinctive solutions in a variety of high-growth, high-volume consumer optics applications."

"We are extremely excited about the vision, commitment, drive and innovation power of our new partner. The technology and innovation level and execution power of WLOPT is unique and guarantees a market introduction of the upcoming OptiL products in line with high-volume market demands," said Gert-Jan Bloks, CEO of Anteryon.

https://anteryon.com/

OIF to provide CEI-112G project update at DesignCon

At next week's DesignCon conference in Santa Clara, California,

The panel, called “112-Gbps Electrical Interface: An OIF Update on CEI-112G,” is scheduled for Thursday, January 31 at 3:45 pm (local).

Since 2000, OIF has defined Interoperability Agreements (IA)s for electrical interconnects known as CEI. CEI is a clause-based document that defines implementation details for interoperable electrical channels initially issued for 6 Gbps, then 11, 28, and 56 and includes definitions for multiple channel implementation topologies and will soon include 112 Gbps clauses. In August of 2016, OIF announced the first CEI-112G project in an overall effort that has now expanded to five projects.

“Previous CEI development has been highly influential and has been adopted, influenced or adapted by many other high-speed interconnect specifications throughout the industry,” said Tracy. “Given that the CEI-112G generation of high-speed transmitters, receivers and channels will be challenging to define, implement and measure, this panel will provide guidance to where the industry is headed and what the key challenge points are likely to be.”

Check the status of OIF’s current work in CEI-112G here: https://www.oiforum.com/technical-work/current-oif-work/#CEI-112G-XSR


Rakuten picks VIAVI to validate cloud-native mobile network

Rakuten, one of the world's leading internet services companies and soon to be the newest mobile network operator in Japan, selected the VIAVI TM500 system to support the rapid deployment of a nationwide, end-to-end cloud-native mobile network.

Rakuten offers e-commerce, fintech, digital content and communications services to over one billion members worldwide. The company received approval for its 4th generation mobile communications system (4G) special base station deployment plan, and is targeting October 2019 to launch the new service.

Rakuten's network will leverage cloud-based architecture, from the RAN to the core, an industry-leading level of automation, and collaboration with the top vendors in the mobile ecosystem.

Viavi said Rakuten will use its TM500 for user equipment (UE) simulation as part of a state-of-the-art operator lab, designed to simulate and stress the network from end to end. As consumers and regulators increasingly demand highly resilient and high-quality network performance, the lab's mission is to provide all stakeholders with a high degree of confidence in the quality of service and reliability of the live network for both existing and future services.

"Consumers across Japan trust Rakuten for services throughout their daily lives, from e-commerce to fintech to digital content, and we are immensely excited to prepare to deliver a new mobile network service to them this year, with the support of world-class technology partners such as VIAVI," said Tareq Amin, Chief Technology Officer, Rakuten Mobile Network. "As we aim to realize our vision for the world's first end-to-end cloud-native, nationwide mobile network, VIAVI's know-how and expertise in network testing will be key to building a high-quality, highly resilient network for our customers."

Confluent adds $125M in funding for business data streaming

Confluent, a start-up based in Palo Alto, California, announced $125 million in Series D funding for its live data streaming solutions based on Apache Kafka technology. The founders of Confluent created Apache Kafka while at LinkedIn to help cope with the very large-scale data ingestion and processing requirements of the business networking service.

Apache Kafka, an open source technology created and maintained by the founders of Confluent, acts as a real-time, fault tolerant, highly scalable messaging system. It is widely adopted for use cases ranging from collecting user activity data, logs, application metrics, stock ticker data and device instrumentation.

The company said 2018 was a banner year, with 3.5X subscription bookings growth year over year. During the year, the company launched its Confluent Platform 5.0, which introduced significant new capabilities, from making infrastructure more secure, reliable and easier to manage, to enabling more powerful applications with streaming data. Confluent made KSQL generally available and released theStream Processing Cookbook, which features KSQL recipes to solve specific, domain-focused problems using KSQL. The company also launched Confluent Hub, an online service for finding, reviewing and downloading extensions for the Apache Kafka and Confluent Platform ecosystems.

The latest funding round was led by Sequoia Capital, joined by existing investors Index Ventures and Benchmark. This brings Confluent’s total funding to $206 million.

“Industry-leading companies are re-architecting their businesses around real-time events,” said Jay Kreps, co-founder and CEO at Confluent. “With Confluent, companies can connect all of their applications and data sources, enabling them to react and engage their customers in a faster, more personalized and more efficient manner. We think event streaming has the opportunity to become as big a category in infrastructure technology as databases, and we’re excited to be creating that future.”

F5 posts revenue of $544 million, up 4% yoy

F5 Networks reported $543.8 million for its first quarter of fiscal year 2019, up 4% from $523.2 million in the first quarter of fiscal year 2018. Growth compared with the first quarter of fiscal year 2018 was driven by continued momentum in software solutions, which drove year over year product revenue growth for the third consecutive quarter.

GAAP net income for the first quarter of fiscal year 2019 was $130.9 million, or $2.16 per diluted share, compared to $88.4 million, or $1.41 per diluted share, in the first quarter of fiscal year 2018. Non-GAAP net income for the first quarter of fiscal year 2019 was $163.5 million, or $2.70 per diluted share, compared to $141.6 million, or $2.26 per diluted share, in the first quarter of fiscal year 2018.

For its Q2 of fiscal year 2019, ending March 31, 2019, F5 set a revenue goal of $543 million to $553 million with a non-GAAP earnings target of $2.53 to $2.56 per diluted share.

Xilinx posts record sales of $800M, up 34% yoy

Xilinx reported record revenues of $800 million for the third quarter of fiscal year 2019, up 7% from the prior quarter and up 34% year over year. GAAP net income for the December quarter was $239 million, or $0.93 per diluted share.  Non-GAAP net income for the December quarter was $237 million, or $0.92 per diluted share.

"I am very excited to report yet another record revenue and earnings quarter.  During the third fiscal quarter, we delivered revenues of $800 million, representing 34% year over year growth. Based on the guidance we are providing for the fiscal fourth quarter, we expect to exceed $3 billion in annual revenues for the first time in our history. In addition to the robust revenue growth, we also demonstrated strong profitability by posting over 60% growth in non-GAAP operating income and over 40% growth in non-GAAP diluted earnings per share year over year.  We continue to execute to our strategy and drive growth across our portfolio," said Victor Peng, President and Chief Executive Officer.

ADTRAN posts Q4 sales of $140 million

ADTRAN posted Q4 2018 sales of $140.1 million, compared to $126.8 million for the fourth quarter of 2017. Net loss was $8.4 million compared to a net loss of $11.1 million for the fourth quarter of 2017. Earnings per share were a loss of $0.18 compared to a loss of $0.23 for the fourth quarter of 2017. Non-GAAP earnings per share were a loss of $0.12 compared to earnings of $0.05 for the fourth quarter of 2017.

ADTRAN Chairman and Chief Executive Officer Tom Stanton stated, “Operating results for the final quarter of 2018 came in largely as expected with strong international revenue growth and an increase in U.S. tier 1 sales allowing the company to offset its normal sequential seasonal trend. International revenue contributed 46.6% of the total with strong contributions from the Asia-Pacific and LATAM regions. Our customer engagements increased, centering around our comprehensive portfolio of software-defined access, 10G solutions and G.fast products. During the quarter, we also acquired SmartRG, a leading provider of open-source connected home platforms and cloud services, whose software approach to delivering both hardware-based and virtualized solutions will enable us to extend the value of our open, programmable and web scalable Mosaic Cloud platform."

Santec introduces Liquid Crystal on Silicon spatial light modulator

SANTEC introduced a high-power, durable LCOS spatial light modulator (SLM) with enhanced Liquid Crystal on Silicon (LCOS). The SLM-300 has been tested to withstand up to 200 Watts of power, making it the world’s most durable SLM. Target applications include high-power laser processing, 3D-Printing and IC trimming applications.

Features

  • 100 times higher power durability (up to CW 200 Watts in Visible ~ IR) compared to the SLM-200
  • High precision resolution, WUXGA (1920 x 1200) and Full-HD (1920 x 1080) support
  • 10 times higher relative phase stability (~0.002 πrad) than conventional products
  • 4 times superior 10-bit (1024 gray level) than conventional products


https://www.santec.com/en/14188

Airtel rolls out LTE 900 in Andhra Pradesh and Telangana

Airtel has begun rolling out LTE in the 900 Mhz spectrum band in the states of Andhra Pradesh and Telangana.

In Andhra Pradesh and Telangana, Airtel is already using 2300 Mhz (TD LTE) and 1800 Mhz (FD LTE) for its 4G network. The 900 Mhz deployment boosts in-building penetration. The carrier said it is also working on Massive MIMO and 4G Advanced and Carrier Aggregation to step up high speed network capacity and coverage.     

Recently, the company announced that it will expand its network in the Andhra Pradesh by rolling out 15,000 new sites and 3,000 km of optic fiber during FY 19 under its network transformation program – Project Leap.


Tuesday, January 22, 2019

AOI samples 400G silicon-photonics module based on COBO

Applied Optoelectronics (AOI) has begun sampling 400G optical modules designed to demonstrate the feasibility of on-board optics (OBO), as outlined in specifications such as the recently-released version 1.1 of the onboard optical module specification published by the Consortium for Onboard Optics (COBO). AOI is an active member of COBO.

In contrast to traditional pluggable optical modules, OBO modules are designed to be used in higher-speed data switches, with interface speeds ranging from 400 Gbps to 1.6 Tbps. By designing the optical modules to be mated directly to a circuit board within such a switch, the OBO modules enable an increase in the density of optical interfaces to the switch, which in turn enables greater data throughput through the switch fabric, while also simplifying cooling and electrical interfaces, two areas where traditional pluggable modules have increasing difficulty as interface speeds increase.

AOI said its sample OBO modules are specifically designed for customers developing next-generation switches for large data centers, as these switches gradually evolve from 100 Gbps interconnects to 400 Gpbs, and higher. The modules currently leverage new silicon-based optical technology to support 16 optical channels with a total data throughput of 400 Gbps. Future versions of the device are expected to leverage the same silicon-photonics technology, but increase the bandwidth up to 100 Gbps per optical channel, ultimately enabling 1.6 Tbps of data throughput over a single OBO module. In turn, this would enable next-generation 12.8 Tbps switches to utilize only 8 optical modules, significantly improving density and reducing power consumption compared to a similar solution, which would require 32 400-Gbps pluggable modules.

“We gathered very positive feedback while demonstrating early 16-channel OBO prototypes at the European Conference on Optical Communications (ECOC) in Rome last year,” commented David Chen, AOI’s AVP of Transceiver Technology. “We are very excited to take the next step in offering samples to our customers. This OBO module incorporates several new technologies, including an advanced silicon-photonics based optical sub-assembly, which are the culmination of years of R&D effort by AOI and our technology partners. We believe that this platform will enable solutions well beyond 400 Gbps, and eventually, 1.6 Tbps.”

“AOI has made significant progress on the development of OBO modules since the publication of revision 1.0 of COBO’s specification,” stated Brad Booth, President of the Consortium for On-Board Optics. “AOI’s ability to sample OBO modules after their ECOC demonstration of an OBO prototype shows their commitment to bringing alternative solutions for the next generation of networking equipment. Having a single module footprint that supports bandwidth scaling from 400 Gbps to 1.6 Tbps provides flexibility to equipment vendors.”

http://ao-inc.com/news-events/applied-optoelectronics-announces-sampling-of-400g-silicon-photonics-optica

OFS intros rollable fiber ribbon backbone cable

OFS introduced its R-Pack Rollable Ribbon (RR) Backbone Cable in 24, 48 and 72 fiber counts. The R-Pack RR Backbone Cable, which meets Telcordia GR409 standards for horizontal backbone applications and NFPA 202 requirements, can be used in data center, central office and Fiber-to-the-Business (FTTB) applications.

OFS said that to form a rollable ribbon, 12 (twelve) 250 micron (µm) optical fibers are connected intermittently by
matrix material to form a very flexible ribbon. This design allows the ribbons to be rolled into very tight bundles, helping to double the fiber density of a cable. These fibers can then be unrolled into preorganized ribbon packages that help to reduce fiber crossovers and speed termination. The rollable ribbons can be spliced using traditional flat ribbon splicing machines and procedures.

Benefits of rollable ribbons include efficient and cost-effective mass fusion splicing, easy individual fiber breakout and fiber alignment that aids with multi-fiber connector terminations.

"This unique cable design combines plenum-rated materials with OFS rollable ribbons. The result is a cable that literally doubles the available fiber density in a highly-compact, robust cable that helps customers to substantially improve cable routing and save on space in demanding and congested pathways,” states Dan Hendrickson, Premises Cable Product Manager, OFS.

https://www.ofsoptics.com