MACOM and CIG demo 200G QSFP module

MACOM Technology Solutions demonstrated a 200G optical module designed in collaboration with Cambridge Industries Group (CIG).

The new 200G (4 x 50Gbps) QSFP module was developed by CIG leveraging a high-performance analog chipset from MACOM, and is optimized for volume-scale deployment in high-density Cloud Data Center links.

MACOM’s fully analog transmit and receive chipset is comprised of the MAOM-38053 four-channel transmit CDR with integrated EML driver and, on the receive side, features MACOM BSP56B photodetectors, a MATA-03819 quad TIA and the MASC-38040 four-channel receive CDR.

“MACOM is applying its expertise and market leadership in 25Gbps and 100Gbps solutions to 50Gbps PAM-4 applications and specifically to 200G QSFP and 2 x 200G OSFP/QSFP-DD modules to bring the benefits of low power and low latency solutions to Cloud Data Centers,” said Marek Tlalka, Senior Director of Marketing, High-Performance Analog, MACOM. “We are excited to collaborate with CIG to deliver the industry’s first 200G optical module based fully on a low cost and low power analog chipset.”

“CIG has again advanced its leadership in 200G QSFP module applications with MACOM’s low cost, lower power, fully analog technology for volume production in our highly automated production lines,” said Michael Xin, VP of Sales and Marketing, CIG. “This breakthrough affirms our commitment to advancing optical module technology and enabling a new ecosystem for analog technology in Data Center interconnects.”

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ADVA showcases SDN-controlled 600 Gbps transport

At OFC 2019, ADVA demonstrated SDN-controlled 600 Gbps transport with automated line rate and modulation adjustment.

In the demo, the ADVA FSP 3000 TeraFlex terminal monitors the condition of the fiber link and then automatically adapts speed and modulation for maximum efficiency. By adjusting transmission rates and modulation format, the technology ensures availability, signal quality and cost-efficiency in DCI deployments. The ADVA FSP 3000 TeraFlex terminal provides native support for YANG device modeling and the NETCONF protocol to enable full SDN control. Specifically engineered for a disaggregated environment, the platform can transmit 600 Gbps of data over a single wavelength and a total capacity of 38.4Tbit/s per fiber.

“This demo redefines what’s possible for open and disaggregated hyperscale DCI transport. It takes SDN-based control to the next level and highlights the enormous potential of flexible network configuration to optimize reach and spectrum utilization,” said Niall Robinson, VP, global business development, ADVA. “The key to this demo is the phenomenal flexibility and versatility of our FSP 3000 TeraFlex™ terminal. Its completely open design with programmable management interfaces and open APIs makes it ideal for disaggregated architectures. By utilizing NETCONF/YANG, TeraFlex™ can fully be integrated into an SDN environment. It also supports a multitude of constellations and baud rates on the line interface. What's more, with its advanced telemetry, TeraFlex™ updates operators with performance data for total visibility and big data-enabled control.”

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Finisar expands its optical portfolio, conducts OFC demos

Finisar introduced several new products and technology demonstrations at OFC in San Diego, including:

Suite of 200G, 2x200G, and 400G FR4 modules for data centers -- building on the industry’s massive adoption of 100G CWDM4 in data centers for links up to 2 km, Finisar is extending this technology to both 200G and 400G data rates. Finisar is demonstrating a 200G FR4 module in a QSFP56 form factor, a 2x200G FR4 in an OSFP form factor, and a 400G FR4 in a QSFP-DD form factor, each running over single mode fiber.

400G DR4 QSFP-DD modules in break-out and shuffle configurations -- Finisar is demonstrating its 400G DR4 QSFP-DD module in both break-out and shuffle configurations, allowing maximum deployment flexibility. In the break-out configuration, two 400G DR4 modules receiving data streams from an Ixia AresONE QSFP-DD test system, transmit four independent 100G PAM4 lanes to four separate Finisar 100G FR QSFP28 modules. In the shuffle configuration, 100G PAM4 lanes from a 400G DR4 module connect to another 400G DR4 module via shuffled lane assignments. The 400G DR4 transceiver module, compliant to the IEEE802.3bs standard, is critical not only to support the continuing growth in network bandwidth, but also to provide the flexibility needed by large scale data center customers that require 100G granularity in their architectures.

400G SR8 OSFP modules for multimode applications -- Finisar is unveiling 400G transceiver modules designed for short reach, multimode applications. This demonstration will showcase IEEE-compliant 400G SR8 optical modules in the OSFP form factor, running over 100 meters of standard OM4 multimode fiber. The modules use a 16-fiber, MPO-16 optical connector and can be deployed as point-to-point or in a break-out configuration of its 50G PAM4 lanes. They leverage VCSEL technology in the 850nm band to achieve the lowest power dissipation and lowest cost structure.

Finisar has actively participated in the definition of the QSFP-DD (Quad Small Form Factor Pluggable Interface Double Density) and OSFP (Octal Small Form Factor Pluggable) MSA modules, which are the latest form factors targeting 400G data rates. Both designs provide an eight-lane electrical interface, compared to traditional single or four-lane interfaces, thereby increasing bandwidth, channel capacity and port density. These form factors address the need for high-density, high-speed networking solutions.

25G Direct Detect Tunable Bidi SFP28 technology for 5G wireless networks -- Building on the success of Finisar’s first-to-market 10G tunable Bidi SFP+ transceiver, the company is demoing its next generation 25G tunable Bidi technology in an SFP28 form factor. This technology is the key building block for deploying these transceivers and will enable cost-effective next generation 5G wireless build-outs while also providing significantly more data capacity per fiber than other 25G-based optical architectures. The Bidi technology will also incorporate innovative and unique Finisar transceiver features, such as T2DOC and Flextune. These features enable transceiver-to-transceiver communications and self-wavelength tuning of remote modules during commissioning without host interaction. Both T2DOC™ and Flextune™ simplify field installation and remote maintenance while lowering operational expenses.

25G LR Lite SFP28 transceiver for 5G networks -- Finisar is demonstrating a new, cost-optimized 25G SFP28 module for front-haul applications in 5G wireless networks, which uses a Fabry-Perot (FP) laser. Most single-mode 25G optical modules rely on more costly Distributed Feedback (DFB) lasers to reach the 10km distances set by the IEEE standard. Finisar’s demonstration shows that low-cost FP lasers running at 25G data rates can support not only the 300 meters of reach required by the majority of 5G front-haul deployments, but also exceptional cases of 1km spans. The company has been a strong supplier of optical modules for 3G and 4G mobile infrastructure, and it is now rolling out its portfolio for 5G.

64Gbaud Integrated Coherent Transmit & Receive Optical Sub-Assembly -- Progressing on the path to miniaturize coherent optics, Finisar is exhibiting the industry's first technology demonstration of an Integrated Coherent Transmit & Receive Optical Sub-Assembly, designed to the current draft of the OIF IC-TROSA Type-2 requirements. The IC-TROSA Type-2 is an optical sub-assembly combining all key building blocks of a coherent optical front-end (i.e. tunable laser, optical amplifier, modulators, drivers, coherent mixer, photodiode array, and TIAs) – with internal control electronics. The device is Flexgrid® C-band tunable and supports multiple modulation formats, including QPSK, 8QAM, and 16QAM, at symbol rates up to 64Gbaud, enabling data transmission up to 400 Gb/s. The IC-TROSA’s low power dissipation and miniature footprint enables small form factor Digital Coherent Optics (DCO) transceivers in a QSFP-DD or OSFP form factor, as well as very high-density coherent line card or daughtercard designs.

http://www.finisar.com

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Lumentum to divest certain transceiver product lines to CIG

Lumentum announced plans to sell certain optical transceiver product lines developed and manufactured by its subsidiary Oclaro Japan to Cambridge Industries Group (CIG). The sale is not expected to impact the guidance ranges provided on February 5, 2019 for Lumentum's third fiscal quarter, ending March 30, 2019. Revenue attributable to the products to be sold in the proposed transaction is approximately $20 million of the $50 million to $55 million of datacom revenues previously included in Lumentum's guidance for the third fiscal quarter of 2019.

CIG also entered into a long-term strategic supply agreement for Lumentum's photonic chips.

"I am pleased to partner with CIG and leverage our respective strengths to better address the market opportunity created by the highly anticipated growth in high-speed datacom and telecom client-side transceiver volumes driven by datacenter expansion and 5G wireless over the coming years," said Walter Jankovic, Lumentum's Senior Vice President and General Manager, Datacom. "This transaction enables Lumentum to become more commercially focused on its differentiated Indium Phosphide photonic chip capabilities and brings a new customer that is well positioned to compete in the datacom transceiver market."

"With this acquisition and on-going partnership with Lumentum for supply of their industry leading photonic chips, together with CIG's proven quality and volume JDM and ODM capabilities, CIG expands its capabilities with industry leading optical transceiver products and technology spanning the range of 10G, 25G to 400G serving many long-standing Tier 1 customers," said Gerald Wong, CIG's President and CEO. "We believe with the combination of CIG's strengths in cost effective high-volume manufacturing, and Lumentum's optical transceiver team in Japan with their decades of experience in high performance datacom and telecom transmission, we are well positioned to address customer needs in the datacom and telecom client-side transceiver market."

The transaction is expected to close in the second calendar quarter of 2019 and is subject to certain customary closing conditions for a transaction of this type.

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Elenion debuts Silicon Photonic BGA Packaged Coherent Optical Sub-Assembly

Elenion Technologies, a start-up developing silicon photonics-based System-on-Chip solutions, announced its next-generation Coherent Silicon Transmitter and Receiver CSTAR optical BGA platform for transmission of up to 600G on a single wavelength, as well as new small form factors for compact pluggable modules such as OIF 400G ZR QSFP-DD.

The CSTAR-200 is a DSP agnostic, coherent optical engine that enables pluggables such as CFP2-DCO and on-board applications, from data center interconnect to long haul in 100/200G coherent optical communication links.

“We are excited to be partnering with Elenion on our award winning CFP2-DCO. Elenion’s CSTAR platform allows us to offer differentiated coherent solutions to our customers,” said Siraj ElAhmadi, President & General Manager, Menara Networks.

The CSTAR platform comprises a multi-chip-module (MCM) and integrates Elenion’s advanced Silicon Photonics and RFICs. Integrated into a non-hermetic BGA package, CSTAR offers the next generation coherent optical engine for todays and future 100 to 600Gb/s Network applications.

“From the beginning at Elenion, we’ve built our silicon photonic chips in a production CMOS fab, which enables us to build complex optical devices. Having leveraged on-chip complexity to eliminate all of the isolators, lenses, and other free space optics from our package, Elenion is taking these chips and having them assembled in a production electronics-attach environment, reusing the infrastructure investment from the ASIC industry. We believe that this is a milestone for the silicon photonics industry, and represents an inflection point with regard to the cost of packaging for silicon photonics and integrated photonic components in general,” said Michael Hochberg, CTO, Elenion.

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UC Berkeley develops 240x240 silicon photonics switch

Researchers at the University of California, Berkeley have demonstrated an experimental, silicon photonics switch with 240 inputs and 240 outputs.

In a paper presented at OFC, researchers Tae Joon Seok and colleagues will report the successful scale up of a 240x240 integrated silicon photonic switch.

The switch was manufactured at the Marvell Nanofabrication Laboratory at UC Berkeley using a process known as lithography stitching, creating a wafer-scale 240x240 silicon photonic switch by stitching together nine 80x80 switch blocks in a 3x3 array, with three input and three output coupler blocks.

The research team demonstrated signal loss lower than any previously reported, said Seok, who is assistant professor at the Gwangju Institute of Science and Technology in South Korea and a visiting scholar at UC Berkeley. The on-chip loss to port-count ratio  was measured at 0.04 dB/port.

"Recently, many research groups competitively reported silicon photonic switches with large input/output port counts," said Seok. However, the physical size of a silicon photonic chip has been limited to 2 to 3 cm because of the limitations of the lithography tools necessary to etch the required geometric patterns on the silicon wafers used as a base for the integrated chips.

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MACOM announces drivers for Single-Lambda 100G and 400G

MACOM Technology Solutions announced the availability of a new family of drivers for Single-Lambda 100G and 400G applications. These 2nd generation EML and Silicon Photonic drivers in low-cost SMT packaging include:

• MAOM-005321: Single-channel EML driver in 3x4mm package
• MAOM-005324: Single-channel Silicon Photonics driver in 3x4mm package
• MAOM-005421: Quad-channel EML driver in 7x7.2mm package
• MAOM-005424: Quad-channel Silicon Photonics driver in 5x6mm package

“To date we’ve had multiple design wins at 100G and 400G, and with customers expected to
ramp, MACOM’s goal is to continue our leadership in the datacom segment by providing optimal driver solutions to our customers,” said Rajiv Somisetty, Senior Product Marketing Manager at MACOM. “Our new driver family underscores our ability to do exactly that. Whether it’s an EML or SiPh based module solution our customer is working on, MACOM’s second-generation driver family with improved performance at lower cost is the ideal solution.”

http://www.macom.com/applications/optical-networking

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MACOM expands 400G PAM-4 with Low Noise Transimpedance Amplifiers

MACOM Technology Solutions announced availability of production versions of its four-channel (4 x 100G) 56/106 Gbit PAM-4 linear transimpedance amplifiers (TIAs) optimized for use in 400G optical modules targeting cloud data center applications.

MACOM's new MATA-03820 and the MATA-03819 are available in flip chip and wire bonding packaging options, respectively, for fast, flexible deployment in single-lambda 400G-FR4 and DR4 format QSFP-DD and OSFP optical modules. The devices deliver low noise performance less than 1.5 uA RMS typical and support bandwidth up to 35 GHz.

“In the rapid evolution to single fiber 100G and parallel fiber 200G and 400G connectivity, we believe that MACOM has again affirmed its leadership position in delivering the high-performance, power-efficient optical components needed to maximize bandwidth density in the Cloud Data Center”

“Molex is excited to collaborate with MACOM. Leveraging MACOM’s technical support along with its broad portfolio of TIAs we are able to ensure the availability of industry leading 400G optical modules,” said Adit Narasimha, Vice President and General Manager, Molex Optoelectronics. “The low noise performance of MACOM’s TIA along with its flexible programmability, enable delivery of industry leading low bit error performance when implemented with a DSP for 400G modules.”

https://www.macom.com/products/product-detail/MATA-03820
https://www.macom.com/products/product-detail/MATA-03819

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DustPhotonics ships 400Gbps QSFP-DD SR8

DustPhotonics announced sampling availability and pre-production ramp of 400G QSFP-DD SR8 optical transceiver for short reach, high-density applications over multi-mode optical fiber. The 400Gbps module incorporates DustPhotonics' AuraDP optical engine with unique fiber integration and manufacturing technology .

Dust Photonics notes that 400G QSFP-DD SR8 transceivers support both 400G switch to switch and breakout options for high-radix configurations.

DustPhotonics claims its AuraDP light engine enables reduced power consumption, higher reliability, and superior module performance. The optical packaging design results in improved sensitivity and efficient coupling. The QSFP-DD optical transceiver is designed for use with cost effective multimode fiber and supports reaches of up to 100 meters using OM4 fiber. The SR8 module features; 8 parallel 50Gbps PAM4 optical channels, supports the latest CMIS Management Interface, and is compliant to the latest QSFP-DD MSA and IEEE 802.3bs 400GBASE SR8 standards.

The 400G QSFP-DD module is part of the DustPhotonic's family of 400G multimode transceiver and AOC product line. The 400G QSFP-DD SR8 has an expected production release date in the second half of 2019. DustPhotonics is currently sampling and accepting orders for evaluation of 400G QSFP-DD SR8 transceivers.

"QSFP-DD SR8 is the most versatile 400G module for the large enterprise and hyperscale cloud data center markets supporting fanout to 200G and 50G," says Ben Rubovitch, CEO and co-founder of DustPhotonics. "With the majority of fiber lengths in hyperscale data centers being less than 100 meters, multimode is the economic choice supporting high-radix interconnection networks. This offers significantly better cost/performance solutions needed for broad market adoption of 400Gbps data rates."

http://www.dustphotonics.com

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Evertz Microsystems Selects Ranovus’ 200G CFP2 Direct Detect Transceivers

Evertz Microsystems, which supplies technology solutions for the broadcast, media and entertainment industries, will deploy Ranovus’ 200G CFP2 Direct Detect transceiver product into the Evertz Software Defined Video Networking switch and routing infrastructure.

Ranovus transceivers employ quantum dot laser (QDL) and micro-ring resonator Silicon Photonics technologies. Highlights:

• Fully compliant with Telcordia GR-468 Standard
• DCI, metro access, 5G Mobility and multi-access edge computing applications
• Transmission distances of 15km, 40km and 80km+
• Platform capable of supporting Industrial Temperature Range
• 96 DWDM channels in the C-band now and L-band in the future
• 1.6 Tb/s 1RU Shelf Density
• Form factor and compatible electrical interface with CFP2-DCO
• 56Gb/s PAM4 PHY with multiple programmable FEC options to optimize link performance
• Full diagnostics and self-monitoring capabilities to enable high-reliability networks

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MACOM hosts InnovationZone at OFC 2019

At OFC 2019, MACOM is hosting an InnovationZone featuring key industry vendors demonstrating interoperability with live and static modules, including:

• 64 GBaud Coherent for Long-Haul, Metro and DCI
• 400 Gbps PAM-4 for FR4/DR4
• 200/400 Gbps for SR-8 and AOC
• 200 Gbps Analog CDRs for CWDM4
• 100 Gbps for DR/FR and CWDM4
• 25/50 Gbps Optical Connectivity for 5G
• 10/25 Gbps PON

Participating companies include Accelink, Alpha, CIG, Colorchip, Cube Optics, Delta, Dust Photonics, FOC, Hisense, Innolight, Intel, Lumentum, Luxhsare-ICT, Mentech, Molex, NeoPhotonics, OE Solutions, Potron Tech, Ruigu, T&W, Tibitcom, Tsuhan, W Optics and YSOD.

“MACOM’s InnovationZone represents the best of today’s innovative solutions for Cloud Data Center and 5G connectivity,” said Preet Virk, Senior Vice President and General Manager, Networks, MACOM. “Featuring MACOM’s leading components and technology in industry solutions, the InnovationZone showcases the ongoing progress component suppliers and module vendors are making towards enabling the next-generation of optical connectivity, demonstrated in the newly popular PlugFest event style.”

“Intel is pleased to join in the industry’s first ever InnovationZone at OFC with MACOM,” said Scott Schube, Director of Strategic Marketing, Intel Corporation. “This event showcases leading solutions for supporting next-generation optical networking, including Intel’s 100Gbps silicon photonics-based CWDM4 modules.”

http://www.macom.com/applications/optical-networking

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