Skorpios confirms BroadEx as 400G customer, new pricing paradigm

Skorpios Technologies confirmed that BroadEx Technologies is now a customer of its 400G Engines. 

The SKRP4501 is a 400G-FR4 Optical Engine combining the transmit/receive optical functions of Skorpios' Heterogeneous Photonic Integrated Circuits (HPIC) with TIA amplification and DSP functionality on a single Multichip Module. Skorpios' unique Tru-SiPh™ platform heterogeneously integrating lasers, modulators, and other components on a polarization insensitive silicon photonics platform.

"With our intrinsically hermetic Tru-SiPh™ platform, and our Engine technology, we are simplifying implementation for our customers," said David Huff, SVP Sales and Marketing for Skorpios. "We continue to make parts that allow our customers to get to market cheaply and quickly." In addition, Skorpios announced that it will be offering volume customers for CWDM4 and FR4 Optical Links pricing for the complete optical function that changes the pricing paradigm. Skorpios will offer its transmit and receive pairs for less than 15 cents/Gb/s in volume. This includes 100G-CWDM4, 200G-FR4, and 400G-FR4. Skorpios' Tru-SiPh platform heterogeneously integrating lasers, modulators, and other components on a polarization insensitive silicon photonics platform. 

At OFC22, Skorpios demonstrated its SKRP2035 HPIC, a new highly integrated 800Gb/s Heterogeneous Photonic Integrated Circuits (HPICs). The transmitter chip includes all 30 optical elements necessary for 800Gb/s 2xFR4 module designs in a single uncooled silicon device connecting eight PAM4 lanes to two optical fibers.

http://www.skorpiosinc.com 

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Skorpios and ColorChip partner on optical modules

Skorpios Technologies and ColorChip announced a strategic relationship to provide optical modules.

Skorpios offers proprietary, wafer-scale, heterogeneous integration process known as Tru-SiPh™. This novel process leverages the existing silicon manufacturing ecosystem to enable high bandwidth interconnectivity at mature CMOS manufacturing costs.

ColorChip will sell modules under its own brand, and private label modules for sale by Skorpios at various speeds and performance levels. The companies also agreed to cooperate on future products such as Co-packaged Optics and Coherent Modules. 

"Skorpios' fully integrated optical functionality greatly simplifies our manufacturing and reduces our costs with known good die," said Yigal Ezra, CEO of ColorChip. "Our long experience building modules with integrated photonic platforms reaches its ultimate with Skorpios' product. We believe that Skorpios' Silicon Photonics technology combined with our multi-million unit annual capacity will help the industry to enable single mode transceiver pricing at 50 cents per gigabit for 200G, 400G and beyond."

www.color-chip.com

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Skorpios presents its Co-packaged Optics at ACP2021 in Shanghai

Skorpios Technologies presented its Tru-SiPh platform for integrating lasers, modulators, and other components on a polarization-insensitive silicon photonics platform at the ACP2021 Conference in Shanghai, China. 

Skorpios' highly integrated photonic chip will provide 3.2 Tb/s FR4 optical interfaces and is small enough that 16 can be placed around an Integrated Circuit to provide 51.2 Tb/s as a chip-scale interface for the next generation of high bandwidth switches.

Skorpios' Silicon Photonics platform integrates lasers, electro-absorption modulators (EAM), semiconductor optical amplifiers (S)A) and photodiodes (PD) in III-V compounds directly into silicon-based wafers. Electronics and optics can then be integrated, burned in, and tested at wafer scale. Laser materials are bonded directly to the silicon substrate vastly improving heat management and minimizing size of the laser. Since all laser stripe processing happens after bonding, multiple devices can be implemented on each implanted epitaxial layer, and laser power into the waveguide is optimized. Similarly, EAMs are built from other implanted epitaxies, reducing size and control complexity of the modulator.

The thick silicon platform Skorpios uses offers several advantages: Low waveguide loss, low coupling loss, polarization insensitivity, and high optical power handling. Multiplexing (Mux) and demultiplexing (DeMux)functions do not require tuning. The entire platform is covered in silicon dioxide after fabrication meaning that III-V devices and facets are environmentally protected, eliminating the need for hermetic packaging.

"It was exciting to present our 3.2Tb/s CPO design at this conference. With our design, we can integrate all devices on a single small chip, including 16 lasers (plus 16 redundant), 32 EAMs, 32 SOAs, 32 PDs, and 8 tuning-free wavelength Mux and DeMux, to provide eight standard 400Gb/s FR4 links," said Glenn Li, Skorpios' CTO. "This product is an outstanding demonstration of highly integrated heterogeneous silicon photonics possible with our platform."

http://www.skorpiosinc.com

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Skorpios 100G CWDM4 chipset passes Telcordia

Skorpios Technologies announced Telcordia qualification for its 100G CWDM4 chipset, as well as its 100G CWDM4 optical transceiver, both of which are shipping in limited quantities. The chipset is based on Skorpios' Heterogeneous Photonic Integrated Circuit (HPIC) technology platform, which seamlessly integrates III-V material into a standard CMOS process flow.

At the device level, extensive testing demonstrated full compliance to GR-468. Testing beyond Telcordia requirements resulted in demonstrating >10,000 hours high temperature operating life (HTOL) against a requirement of 2,000 hours, and extensive accelerated aging testing demonstrated a 50+ year lifetime for the four-channel devices.

At the optical transceiver level, full compliance was demonstrated to GR-468, GR-326 and GR-1217 standards. Testing beyond Telcordia requirements resulted in demonstration of 2,000 hours of unbiased damp heat against a 1,000-hour requirement.

"With a technology platform passed full Telcordia qualification with no issues and demonstrated industry-leading lifetimes, Skorpios secures a commanding position in current and future applications requiring high levels of photonic integration with many lasers and modulators on a single die" said Glenn Li, CTO for Skorpios Technologies.

https://www.skorpiosinc.com/

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Skorpios Technologies Launches Micro-ITLA Tunable Laser for 100G

Skorpios Technologies, a start-up based in Albuquerque, New Mexico, demonstrated a micro-ITLA tunable laser utilizing its Template Assisted Bonding (STAB) process.

The laser was designed for next gen coherent 100G transceivers with linewidths of less than 100 kHz, low optical noise, high power and high stability.

"Launching our micro-ITLA is an important inflection point for Skorpios," commented John Zyskind, VP Engineering. "Not only have we productized one of the hardest types of laser to develop, but we have initiated production based on our STAB platform, where we integrate a small amount of heterogeneous material using a wafer-scale process within a commercial CMOS fab. This gives us a very attractive cost structure, as well as high reliability because the device is natively hermetic.  The Skorpios micro-ITLA will be used as a springboard into more highly integrated devices with a wide range of applications."

http://www.skorpiosinc.com

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