Tenstorrent licenses Baya's WeaveIP fabric

Tenstorrent has licensed Baya Systems’ customizable WeaveIP fabric to scale its AI and RISC-V chiplet solutions. Baya’s IP and software flow enables Tenstorrent and its partners to analyze, customize and deploy its intelligent compute platform for current and future workloads and deliver highly scalable chiplet solutions to meet the emerging demand.

Baya Systems’ WeaveIP portfolio optimizes standard protocols, distributed caching, advanced coherent and non-coherent fabric while allowing customizable protocols for AI and other applications over a unique transport architecture. The WeaverPro software provides a data-driven platform that enables designers to architect cache and memory architecture followed by algorithmically optimized unified fabric design from concept to post-silicon tuning, accelerating the development and deployment of a chiplet-ready system architecture that is globally and locally optimized. The company is based in California.

Tenstorrent, founded in 2016 by Ljubisa Bajic and based in Toronto, Ontario, is developing high-performance processors and software for AI and machine learning applications. Their products include the Grayskull AI processor, designed for complex neural networks, and Wormhole, an interconnect technology for scalable AI workloads, along with various software solutions. Tenstorrent has raised significant funding, including $200 million in a Series C round led by Fidelity Management & Research Company, with participation from Eclipse Ventures and others. The company has a notable partnership with Siemens. Tenstorrent has attracted industry leaders like Jim Keller, who joined as President and Chief Technology Officer (CTO) in 2021, later becoming CEO.

“Tenstorrent is reputed for highly customized, high-performance AI and RISC-V solutions tailored to specific workloads and applications, which need to be future-proof,” said Sailesh Kumar, CEO of Baya Systems. “We believe Baya’s high-performance, reliable chiplet-ready fabric, and advanced analysis capability, design-time, and post-silicon runtime tuning, will be an essential component of Tenstorrent’s ability to deliver high-performance cost-effective multi-chip designs that next-level energy efficiency and are future-proofed for fast evolving applications.”

“Baya makes great, comprehensive fabric tools. Their tools start with top level architecture then allow us to plan at a detail level including performance modeling, transport, quality of service and cache coherency," said Tenstorrent CEO Jim Keller. "This, coupled with their visualization tools, enables designers to build next generation chips, chiplets and IP. This data-driven, correct by construction fabric IP delivers the performance and scale needed for Tenstorrent's chiplet-based solutions.”

https://bayasystems.com/

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Bharat 6G Alliance signs European partners

The Bharat 6G Alliance(B6GA), which is an initiative of Indian industry, academia, national research institutions and standards organizations, has signed partnership agreements with two European bodies:

• The 6G Smart Networks and Services Industry Association (6G-IA) is the voice of European Industry and Research for next generation networks and services. The 6G-IA carries out a wide range of activities in strategic areas including standardization, frequency spectrum, R&D projects, technology skills, collaboration with key vertical industry sectors, notably for the development of trials, and international cooperation.
• 
  The 6G Flagship programme is a world-leading research initiative funded by the University of Oulu and the Research Council of Finland. It aims to develop key 6G technology components, establish a comprehensive 6G Test Centre, and drive the societal digitisation of the 2030s through ground-breaking 6G research and innovation.

Last year, B6HA announced a similar partnership with ATIS’ Next G Alliance, which is an initiative to advance North American wireless technology leadership over the next decade.

https://bharat6galliance.com/bharat6G/

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SES ASTRA 1P broadcast satellite launched

 The SES ASTRA 1P satellite was successfully launched by a SpaceX Falcon 9 rocket from Cape Canaveral Space Force Station in Florida.

ASTRA 1P, which was built by Thales Alenia Space, is based on the 100% electric Spacebus NEO platform and features 80 transponders capable of delivering 500 HD TV channels. It is the most powerful satellite to operate at 19.2 degrees East, seamlessly replacing the current four satellites at the orbital location and continuing their mission of serving 119 million TV households.

The Ku-band satellite will enhance SES's TV neighbourhood at 19.2 degrees East, delivering content to public and private broadcasters, sports organizations, and content owners across Europe's largest TV markets. ASTRA 1P will also provide premium HD content to subscribers of HD+, SES’s high-definition satellite TV platform in Germany.

Recent developments at SES

• November 2023: SES successfully launched its fifth and sixth O3b mPOWER satellites. This completion of the six-satellite constellation marks a significant milestone in its second-generation medium Earth orbit (MEO) system, enhancing global high-performance connectivity services​ (.
• January 2024: SES and Luxembourg-based satellite ground infrastructure provider, RHEA Group, announced a collaboration to develop advanced cybersecurity solutions for satellite communications, enhancing the security of SES’s global network​ 
• February 1, 2024: SES appointed Adel Al-Saleh as its new CEO, effective February 2024, bringing in leadership from his previous role as CEO of T-Systems International GmbH 
• April 24, 2024: SES’s O3b mPOWER system began providing high-performance connectivity services. This new system, with its first six satellites in MEO, is designed to offer flexible and low-latency services globally, ranging from tens of Mbps to multiple Gbps​
• April 30, 2024: SES announced its plan to acquire Intelsat for $3.1 billion. The acquisition is aimed at expanding SES’s multi-orbit space network and enhancing its competitive position in the market. The deal is expected to close in the second half of 2025​
• May 15, 2024: SES and Microsoft announced a partnership to deliver improved cloud and connectivity solutions via Azure Orbital, leveraging SES’s multi-orbit satellite network to provide seamless cloud access in remote and underserved regions​
• June 10, 2024: SES signed a contract with the US Department of Defense to provide satellite communication services worth $180 million. This agreement underscores SES’s strategic role in providing reliable and secure communications for defense operations​
  

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Ribbon Secures $385 million credit facility

 Ribbon Communications finalized a $385 million senior secured credit facility. This new financial arrangement, known as the 2024 Credit Facility, includes a $350 million term loan and a $35 million revolving credit line. The funds will be utilized to refinance an existing credit facility, fully redeem Ribbon's outstanding Series A Preferred Stock, and cover associated fees and expenses. Any remaining proceeds will support the company's working capital and other general corporate needs, facilitating further network modernization and protection for its global clientele.

The loans under the 2024 Credit Facility are set to mature on June 21, 2029. Initially, the interest rate will be SOFR plus 6.25%, which will adjust to a range between SOFR plus 5.75% to 6.25% depending on Ribbon's consolidated net leverage after the fiscal year ending December 31, 2024. Alternatively, Ribbon has the option to choose an interest rate based on an alternative base rate with a margin from 4.75% to 5.25%. The credit facility is secured by nearly all of Ribbon's and certain subsidiaries' assets. HPS Investment Partners, LLC will act as the Administrative Agent, with HPS and WhiteHorse Capital serving as joint lead arrangers and bookrunners.

Key Points:

• Ribbon Communications finalizes a $385 million senior secured credit facility.
• The facility includes a $350 million term loan and a $35 million revolving credit line.
• Proceeds will refinance existing debt, redeem Series A Preferred Stock, and support general corporate purposes.
• Loans mature on June 21, 2029, with interest rates tied to SOFR plus a margin based on net leverage.
• HPS Investment Partners, LLC and WhiteHorse Capital lead the arrangement and administration of the facility.

https://ribboncommunications.com/

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Alphawave demos 9.2 Gbps HBM3E, 1.2 TBps memory bandwidth

Alphawave Semi has announced a 9.2 Gbps HBM3E sub-system (PHY + Controller IP) silicon platform, achieving an unprecedented memory bandwidth of 1.2 Terabytes per second (TBps) through chiplet-enabled technology.

In collaboration with Micron, channel simulations have demonstrated the platform’s exceptional performance, reaching 9.2 Gbps in an advanced 2.5D package across a complete HBM3E system. This system comprises the HBM3E IP subsystem, an innovative Alphawave Semi silicon interposer, and Micron’s HBM3E memory. 

HBM3E has become the preferred memory choice for AI and HPC systems due to its high bandwidth, optimal latency, compact footprint, and excellent power efficiency. Alphawave Semi customers are deploying comprehensive HBM subsystem solutions that integrate the company’s HBM PHY with a versatile, JEDEC-compliant, highly configurable HBM controller, which can be fine-tuned to maximize efficiency for application-specific AI and HPC workloads.

Alphawave Semi has also developed an optimized silicon interposer design to achieve best-in-class results in signal integrity, power integrity, and thermal performance at 9.2 Gbps.

“Micron is committed to advancing memory performance through our comprehensive AI product portfolio as the demand for AI continues to grow in data centers,” said Praveen Vaidyanathan, vice president and general manager of Micron’s Compute Products Group. “With their end-to-end channel simulations, we are pleased to see Alphawave Semi demonstrate a performance of 9.2 Gbps for AI accelerators with HBM3E. Together, we are empowering customers to accelerate system deployment with our Micron HBM3E solutions, delivering up to 30% lower power consumption compared to competitive offerings.”

“We are excited to lead the industry in delivering a complete 9.2 Gbps HBM3E PHY and controller chiplet-enabled platform achieving 1.2 TBps bandwidth, backed by channel simulations across the SoC, interposer, and Micron’s HBM3E memory,” said Mohit Gupta, senior vice president and general manager, Custom Silicon and IP, Alphawave Semi. “Leveraging this, along with our leading-edge custom silicon and advanced 2.5D/3D packaging capabilities, allows Alphawave Semi to provide a significant time-to-market advantage to our hyperscaler and data center infrastructure customers for their AI-enabled systems.”

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Denmark's TDC NET upgrades to 800G with Ciena

TDC NET will deploy Ciena’s converged packet optical solutions to upgrade its metro and long-haul networks with 800G. 

TDC NET will deploy a modern OTN network based on Ciena’s 6500 family of Packet Optical platforms, powered by WaveLogic 5 Extreme programmable 800G technology and WaveLogic 5 Nano 100G-400G coherent pluggable transceivers.

TDC NET will utilize a range of Ciena products and services:

• 6500 Family of Platforms and O-NIDs that enable sustainable OTN network evolution from the edge to the core with scalability, flexibility, and multi-layer programmability.
• WaveLogic 5 Extreme to efficiently support up to 800 Gb/s speeds and 400GE client connectivity across any distance.
• WaveLogic 5 Nano coherent pluggables that offer power- and space-efficient connectivity up to 400 Gb/s.
• Coherent ELS edge-optimized open line system (OLS) for cost-efficient delivery of 100G to 800G coherent DWDM.
• Navigator Network Control Suite that provides end-to-end visibility and assurance from a single point of control.

“By upgrading our network with Ciena we can offer our customers a full suite of modern digital services both nationally and internationally,” said Robert Dogonowski, Chief Commercial Officer of TDC NET. “We wanted a vendor that could support our network transformation without disrupting service and allow us to remain in control of the customer experience. The Ciena team has been collaborative throughout the process, and we are excited by what Ciena’s technology can do for our network.”

Anders Grand, Senior Director and General Manager, Ciena, added: “Leading service providers like TDC NET know the importance of being able to sustainably scale their networks. With Ciena’s WaveLogic technology, TDC NET can offer 800 Gb/s connectivity to its customers while also providing important savings in power usage to reach its climate targets.”

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Crehan Research: Fibre Channel host bus adapter market rebounds strongly

As the supply-constraint-driven enterprise server and storage inventory levels have started to normalize, the demand for Fibre Channel Host Bus Adapters (HBAs) – which provide the mission-critical networking for these devices – has rebounded strongly. During the first calendar quarter of 2024, the Fibre Channel HBA market posted its second consecutive quarter of close to 30% revenue growth, according to the most recent report from Crehan Research.

The Fibre Channel networking market has been bolstered by the recent strong customer adoption of 64Gbps HBAs. In fact, 64Gbps HBAs have recently started to see better customer adoption than that of 32Gbps HBAs at a similar point in time.

Stronger 64Gbps HBA adoption has been helped by the arrival of Intel’s Sapphire Rapids server-class CPUs, with these scalable processor platforms placing more bandwidth demands on data center storage networks. Moreover, some enterprise customers are looking to incorporate high-speed Fibre Channel HBAs into AI-optimized servers, in order to access their more-valuable and proprietary data residing on Fibre Channel storage arrays.

Crehan’s report also notes that Broadcom has been the main beneficiary of the stronger 64Gbps Fibre Channel HBA adoption as a result of its first-to-market Emulex product introductions and the incorporation of key security features within these. As a result, Broadcom accounted for the majority share of the 64Gbps Fibre Channel HBA market, as well as the overall Fibre Channel HBA market.

“As enterprise storage networking demand has increased, Fibre Channel has shown that it is still a vital technology in this realm, with robust market growth," said Seamus Crehan, president of Crehan Research. "In correlation with the HBAs, Fibre Channel switching revenue has also grown strongly over the past couple of quarters, with a year-over-year increase in excess of 25%.”

https://crehanresearch.com

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Dell'Oro: Cable Outside Plant Equipment revenues rise 15% yoy

Total Cable Outside Plant Equipment revenues are expected to increase to $972 M in 2024, up 15 percent year-over-year (Y/Y), according to a new report from Dell'Oro Group. The rise is driven largely by continued mid- and high-split DOCSIS 3.1 and DAA (Distributed Access Architecture) projects in the North American market, which are driving purchases of new DAA Nodes to support Remote PHY deployments. The market will heat up later this year as Full Duplex 1.2 GHz and 1.8 GHz amplifiers will begin shipping, with significant volumes expected in 2025.

“The current focus on Remote PHY and band splitting will lead to longer-term DOCSIS 4.0 upgrades, particularly in the North American and select European markets, where operators are looking to increase capacity and keep pace with fiber ISPs,” said Jeff Heynen, Vice President of Broadband Access and Home Networking market research at Dell’Oro Group. “These upgrades will result in a significant increase in spending on optical nodes, amplifiers, and passive equipment, including taps and hardline splitters, through 2028,” added Heynen.

Additional highlights from the Cable Outside Plant Equipment Advanced Research Report:

• Global Cable Outside Plant Equipment revenues are projected to peak at $2 B in 2027, when the largest number of tier one operators in North America are expected to be in the middle of their amplifier and node upgrades for DOCSIS 4.0.
• The North American market will remain the largest region for Cable Outside Plant Equipment revenue, as operators in other regions either continue with DOCSIS 3.1 or increasingly overbuild with fiber.
• The DOCSIS 4.0 upgrade cycle will continue through 2030 as operators consistently expand their footprint using 1.8 GHz amplifiers, Full Duplex 1.2 GHz amplifiers, and 2 GHz taps where necessary.
• Generic Access Platform (GAP) Nodes are expected to ramp up in the North American market, with unit shipments peaking in 2029.

https://www.delloro.com/news/cable-operators-expected-to-spend-10-b-on-outside-plant-equipment-through-2030-according-to-delloro-group/

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Oracle plans to open a third cloud region in Spain

Oracle plans to invest more than US $1 billion to open a third cloud region in Madrid, Spain.

The new public cloud region will enable Oracle customers and partners across all industries in Spain, including its prominent financial services sector, to migrate mission-critical workloads from their data centers to Oracle Cloud Infrastructure (OCI) while helping them address regulations like the Digital Operational Resilience Act (DORA) and the European Outsourcing Guidelines (EBA, EIOPA, ESMA). Telefonica España will be the host partner for the planned cloud region.

The upcoming cloud region in Madrid will help public and private sector organizations migrate all types of workloads to the cloud, modernize their applications, and innovate with data, analytics, and AI. Oracle is the only hyperscaler capable of delivering AI and a full suite of 100+ cloud services across dedicated, public, and hybrid cloud environments, anywhere in the world. This includes Oracle Autonomous Database, MySQL HeatWave Database Service, Oracle Container Engine for Kubernetes, Oracle Cloud VMware Solution, OCI Generative AI service, and OCI AI Infrastructure.

"The opening of the third Oracle cloud region in Spain is excellent news for our country," said José Luis Escrivá, minister for digital transformation and public administration, Government of Spain. "The investment announced by Oracle provides a significant boost that will help Spanish enterprises and public sector organizations innovate with AI and continue advancing on the path of digital transformation."

Oracle also offers a separate EU Sovereign Cloud with one region in Madrid to help public and private sector customers with data and applications that are sensitive, regulated, or of strategic regional importance, move to the cloud. The Oracle EU Sovereign Cloud in Madrid is operated by EU-based personnel and supports workloads that fall under EU guidelines and requirements for sovereignty and data privacy.

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Cisco named Official Network Equipment Partner of LA28 Olympic Games

Cisco has been selected as the Official Network Equipment Partner for the LA28 Olympic and Paralympic Games.

Cisco will deliver on its long-standing history with the Olympic and Paralympic Movement to not only provide secure connectivity through its industry-leading networking infrastructure, but also positively impact the city of Los Angeles and people in the region.

Since 2012, Cisco has served as an Official Partner of several editions of the Olympic and Paralympic Games, connecting and protecting athletes, fans and stakeholders in London (2012), Rio de Janeiro (2016), Tokyo (2020) and Paris (2024). Cisco’s networking solutions will be deployed across numerous venues throughout the Los Angeles Metropolitan Area to ensure secure and reliable connectivity for all involved in the LA28 Games.

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Neoconix ships connectors supporting 112Gbps data rates

Neoconix has begun shipping its latest board-to-board array connectors, the “Mini” (CBM) and SPH3 “Ultra,” powered by innovative C-Beam™ technology. These connectors are designed to support high-speed data rates of up to 112Gbps and are available in pitches of 0.5mm and 0.6mm.

Neoconix said its C-Beam technology, an enhancement of its PCBeam technology, is tailored for ultra-dense pitches down to 0.4mm and high-speed applications up to 112Gbps. It offers up to a 40% reduction in pitch compared to PCBeam, enabling high pin counts that combine numerous high-speed differential pairs, power, and signals in a single connector.

The Neoconix CBM “Mini” connector family features 84 and 128 position counts at 0.6mm and 0.5mm pitches respectively, all within a standard configuration smaller than a U.S, dime. The SPH3 “Ultra” connector family includes six offerings with three configurations (Large, Medium, and Small) across two pitches (0.5mm and 0.6mm), with pin counts ranging from 408 to 840 positions.

https://neoconix.com

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Renesas acquires Transphorm for gallium nitride (GaN)

Renesas Electronics has acquired Transphorm (Nasdaq: TGAN), a supplier of gallium nitride (GaN) power semiconductors. With this acquisition, Renesas will immediately begin offering GaN-based power products and related reference designs to meet the rising demand for wide bandgap (WBG) semiconductor products.

WBG materials such as GaN and silicon carbide (SiC) are considered key technologies for next-generation power semiconductors due to their superior power efficiency, higher switching frequencies, and smaller footprints compared to conventional silicon-based devices. Both GaN and SiC-based products are expected to grow rapidly over the next decade, driven by demand from electric vehicles (EVs), inverters, data center servers, artificial intelligence (AI), renewable energy, industrial power conversion, consumer applications, and more.

Renesas stated that investing in its power business is part of its long-term strategy for achieving sustainable growth. Other recent initiatives by Renesas to bolster this market segment include the opening of the Kofu Factory, a dedicated 300-mm wafer fab for power products; ramping up a new SiC production line at the Takasaki Factory; and forging an agreement with Wolfspeed to secure a steady supply of SiC wafers over the next 10 years. With GaN technology now part of Renesas’ portfolio, the company is poised to offer more comprehensive power solutions to support the evolving needs of customers across a broad range of applications.

On the same day it completed the acquisition of Transphorm, Renesas rolled out 15 new Winning Combinations, market-ready reference designs that combine the new GaN products with Renesas’ embedded processing, power, connectivity, and analog portfolios. These include designs integrating Transphorm’s automotive-grade GaN technology for on-board battery chargers and 3-in-1 powertrain solutions for EVs.

Founded in 2007 in Goleta, California, Transphorm has roots from the University of California at Santa Barbara and the Wide Bandgap industry. 

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Adtran joins Luxembourg Internet eXchange

Adtran has joined the Luxembourg Internet eXchange (LU-CIX), a major European internet exchange. The LU-CIX community, comprising internet service providers, telecommunication companies and content networks, collaborates to improve network efficiency and strengthen Luxembourg as a major digital hub.

Adtrans' FSP 3000 open optical transport solution was instrumental in expanding LU-CIX’s network capacity efficiently and sustainably, and the Adtran ALM fiber monitoring platform is helping boost the reliability of LU-CIX’s services.

“We’re very pleased to be part of the LU-CIX community. The power of collaborative initiatives like this one cannot be overstated. The LU-CIX supporting member hub is key to driving technological advancements and shaping the future of digital infrastructure in this region and across Europe,” commented Stuart Broome, GM of EMEA sales at Adtran. “LU-CIX’s proactive approach to interworking and its leadership in the industry align perfectly with our commitment to open, multi-vendor networks. Our technologies are ideal for enhancing and supporting the scalability and security of major internet exchanges like LU-CIX, ensuring a more connected and resilient future.”

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Astera demos PCIe optical connectivity for expansive GPU clusters

Astera Labs has demonstrated end-to-end PCIe optical connectivity to provide unprecedented reach for larger, disaggregated GPU clusters.

The company’s technology for PCIe over optics expands its Aries family of Smart DSP Retimers and Smart Cable Modules (SCMs) for Active Electrical Cables (AECs) to deliver PCIe and CXL connectivity in chip-to-chip, box-to-box, rack-to-rack, and now row-to-row topologies throughout the data center.

Astera Labs said its new technology for PCIe over optics operates with end-to-end PCIe link connectivity in compliance with current PCIe specifications and is flexible enough to address future standards requirements through software-enabled configurability. The company is collaborating with leading optical cable suppliers to enable a wide variety of industry-standard form factors.

In addition, Astera Labs’ COSMOS software suite has been enhanced to provide link, fleet, and RAS management features over optical links, delivering deep insights into every lane and link inside a cluster to facilitate maximum uptime and optimal infrastructure utilization. Customers already using Astera Labs’ Intelligent Connectivity Platform will be able to seamlessly and transparently enable optical interconnects.

Casey Morrison, Chief Product Officer at Astera Labs, said, “GPU clusters are growing in size to handle the expanding complexities of AI workloads within disaggregated cloud infrastructure. We’re proud to broaden our PCIe leadership once again by demonstrating robust PCIe links over optical interconnects between GPUs, CPUs, CXL memory devices, and other PCIe endpoints. This breakthrough expands our Intelligent Connectivity Platform to allow customers to seamlessly scale and extend high bandwidth, low latency PCIe interconnects over optics, including Active Optical Cables, in addition to copper-based AECs.”

Large AI models benefit from tightly clustering more GPUs over a backend mesh network, often using PCIe interfaces that are natively found on GPUs. Larger GPU clusters must be distributed beyond a single rack to meet power delivery and cooling requirements. PCIe optical interconnects are essential to scale PCIe-based GPU clusters to multiple racks and rows, improve AI model performance, and increase GPU utilization.

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Black Semiconductor raises EUR 254.4 million for graphene PICs

Black Semiconductor, a start-up based in Aachen, Germany, announced €254.4 million in funding, marking one of the largest investments for a deep tech company manufacturing chips in Europe to date.

The company is targeting optical chip-to-chip connections using graphene as an intermediate layer to integrate optics with electronics. Black Semiconductor asserts that graphene, a material just one atom thick and known for its superior optical, electrical, and thermal properties, is key to enabling the co-integration of electronics and optics. "Graphene outperforms any other material system, opening the door to products that were previously inaccessible," the company stated. "Our solution combines computing with electrons and communication with photons, which we believe could enable parallel optical chip connectivity over distances of up to kilometers."

Black Semiconductor has secured €228.7 million in public funding from the German Ministry of Economic Affairs and Climate Action and the state of North Rhine-Westphalia over the next seven years under the IPCEI ME/CT2 program. Additionally, the company has raised €25.7 million in equity funding. This round was led by Porsche Ventures and Project A Ventures, with participation from leading venture capital firms, corporates, and industry leaders including Scania Growth Capital, Capnamic, Tech Vision Fonds, and NRW.BANK, joining the seed round investors Vsquared Ventures, Cambium Capital, and Hermann Hauser’s Onsight Ventures.

Founded in 2020 by Dr. Daniel Schall and Sebastian Schall, Black Semiconductor plans to use the new capital to accelerate its R&D initiatives and establish pilot line manufacturing capabilities in Aachen by 2026—an essential step towards its long-term goal of producing and implementing high-quality graphene in Europe. The company also aims to increase its headcount from 30 to 120 by 2026.

https://blacksemi.com/

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Global Telco AI Alliance builds Multilingual Telco LLM

SK Telecom, Deutsche Telekom, e&, Singtel, and SoftBank Corp., the founding members of the Global Telco AI Alliance (GTAA), have signed a Joint Venture agreement at TM Forum's DTW24-Ignite. This follows the announcement made at MWC Barcelona 2024 to establish a Joint Venture, marking the founding parties' commitment to co-develop and launch multilingual Large Language Models (Telco LLM) specifically tailored for telecommunications companies. The Telco LLM aims to enhance customer interactions through digital assistants and other innovative AI solutions.

The Joint Venture will see equal investments from the founding parties to support its initial working capital requirements. The Telco LLM will cater to a global customer base of approximately 1.3 billion people across 50 countries, offering multilingual capabilities in languages such as Korean, English, German, Arabic, and Bahasa, among others. The launch of the Joint Venture is pending customary regulatory approvals. The focus will be on deploying innovative AI applications tailored to the unique needs of each founding party's market.

The second Global Telco AI Roundtable (GTAR) was also held at DTW24, emphasizing the GTAA’s dedication to innovation and collaboration in the telecom industry. SKT’s CEO Ryu Young-sang highlighted the transformative potential of AI in telecoms, positioning the Global Telco AI Alliance as a key player in the global AI ecosystem. He stressed the importance of creating new business opportunities and enhancing customer experiences through the Telco LLM JV while addressing social and environmental responsibilities through effective AI governance frameworks.

Key Points:

• SK Telecom, Deutsche Telekom, e&, Singtel, and SoftBank Corp. sign Joint Venture agreement at TM Forum's DTW24-Ignite.
• Joint Venture to develop multilingual Large Language Models (Telco LLM) tailored for telecommunications.
• Equal investments from founding parties to support initial working capital requirements.
• Telco LLM to cater to a global customer base of 1.3 billion across 50 countries.
• Second Global Telco AI Roundtable reaffirms GTAA’s commitment to innovation, collaboration, and effective AI governance.

https://www.telekom.com/en/media/media-information/archive/agreement-jv-for-telco-specific-llm-1068392

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SNS Telecom & IT: Private 5G market to grow at 42% CAGR to 2027

 Private LTE networks have been a niche market for over a decade, with early installations like iNET's 700 MHz LTE network in the Permian Basin and Rio Tinto's network in Western Australia. However, private cellular networks based on the 3GPP-defined 5G standard are now advancing from Proof-of-Concept (PoC) trials to production-grade implementations. These standalone 5G networks are set to lay the foundation for Industry 4.0 and advanced application scenarios, offering significant improvements over LTE in terms of throughput, latency, reliability, and connection density. Despite initial challenges, early adopters are seeing tangible benefits, affirming the long-term potential of private 5G networks, according to a recently published study by SNS Telecom & IT.

SNS Telecom & IT estimates that annual investments in private 5G networks for vertical industries will grow at a CAGR of approximately 42% between 2024 and 2027, eventually accounting for nearly $3.5 Billion by the end of 2027. 

Compared to LTE, private 5G networks can meet more demanding performance requirements. They offer capabilities like Ultra-Reliable, Low-Latency Communications (URLLC) and Massive Machine-Type Communications (mMTC), making them a viable alternative to wired connections for industrial-grade communications. Despite higher costs, 5G's wider coverage, scalability, and security features have attracted strong interest for use in Industrial IoT (IIoT) environments. China leads in this adoption, with large-scale private 5G installations supporting complex industrial operations. As digitization initiatives ramp up globally, private 5G networks are being implemented for diverse use cases, showing practical benefits in efficiency, cost savings, and worker safety.

Some Highlights

• Private LTE networks have been in use for over a decade, particularly in niche segments like mining and offshore infrastructure.
• Private 5G networks are moving beyond PoC trials to full-scale deployments, providing the foundation for Industry 4.0.
• Private 5G networks offer superior performance in terms of throughput, latency, reliability, and connection density compared to LTE.
• 5G's URLLC and mMTC capabilities support industrial-grade communications, making it a viable alternative to wired connections.
• China leads with large-scale private 5G installations, while other countries are also increasing their adoption for digitization and automation.
• Diverse Use Cases: Applications include wirelessly connected machinery, autonomous mobile robots, augmented reality, remote-controlled cranes, and digital twin models.
• Challenges: Early adopters face challenges like high costs, limited device variety, and lack of cellular wireless systems competence.
• Long-Term Potential: Despite initial challenges, early adopters are seeing tangible benefits, affirming the long-term potential of private 5G networks.

The “Private 5G Networks: 2024 – 2030 – Opportunities, Challenges, Strategies & Forecasts” report presents an in-depth assessment of the private 5G network market, including the value chain, market drivers, barriers to uptake, enabling technologies, operational and business models, vertical industries, application scenarios, key trends, future roadmap, standardization, spectrum availability and allocation, regulatory landscape, case studies, ecosystem player profiles and strategies. The report also presents global and regional market size forecasts from 2024 to 2030. The forecasts cover three infrastructure submarkets, 16 vertical industries and five regional markets.

More info here: https://www.snstelecom.com/private5g

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Datagrid surveys route for subsea cable linking NZ and Australia

Datagrid New Zealand has initiated a research project with international marine survey company EGS Survey to find the shortest and most secure route for the proposed 2,700km Te Waipounamu submarine cable between the South Island of New Zealand and Australia, linking Invercargill to Sydney and Melbourne. Datagrid, which is developing a 43-hectare sustainable data center park in Makarewa, aims to provide direct connectivity to Australia, enhancing internet speeds and digital infrastructure for the South Island.

The Te Waipounamu submarine cable is expected to significantly boost the digital development of cities like Christchurch, Dunedin, Queenstown, Nelson, and Invercargill, transforming Invercargill into a regional digital hub. The cable will also enhance New Zealand's network resiliency by offering backup to existing North Island cables. Perrine Dhalluin, CEO of Datagrid, emphasized the strategic importance of the cable for faster internet and regional digital growth. EGS Survey, with 48 years of geophysical surveying experience, will conduct a detailed desktop study to determine the optimal route across the Tasman Sea, ensuring maximum diversity and reliability. An optional branch to Hobart, Tasmania, is also being considered to provide further connectivity options.

Key Points:

• Companies Involved: Datagrid New Zealand and EGS Survey.
• Project Goal: To find the shortest and most secure route for the Te Waipounamu submarine cable.
• Significance: First international submarine cable connecting South Island, NZ, to Australia.
• Impact: Enhanced internet speed, digital development, and network resiliency for the South Island.
• Additional Consideration: Potential branch to Hobart, Tasmania, for increased connectivity.
• The project is named after the Maori term for the South Island

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TM and Singtel's Nxera plan 200 MW data center campus near Singapore

 TM (Telekom Malaysia) has announced a strategic joint venture with Nxera, the regional data center arm of Singtel’s Digital InfraCo unit, to develop state-of-the-art data centers in Malaysia. The first project under this partnership is a sustainable, hyper-connected AI-ready data center campus in Johor. This venture aims to cater to the growing demands of hyperscalers, next-generation AI application providers, and enterprises pursuing accelerated digitalization and cloud services in the region. Leveraging TM's extensive subsea cable networks and Singtel’s global connectivity, the collaboration promises enhanced network performance with lower latency and improved reliability.

The data center campus, located in Iskandar Puteri, just 16 km from Singapore, will be the largest for both TM and Nxera. It is designed to meet the highest standards of reliability, security, and sustainability, offering superior local and international connectivity. The proximity to subsea cable links between Singapore and Malaysia positions it well to support the increasing digitalization efforts of both nations. The initial phase of the data center will have a capacity of 64MW, scalable up to 200MW, featuring advanced technologies like liquid cooling to support high-power density workloads efficiently. The facility will also be LEED-certified, underscoring its commitment to energy efficiency and sustainable practices.

Highlights

• Strategic Partnership: TM partners with Nxera to develop hyper-connected AI-ready data centers in Malaysia, starting with a major facility in Johor.
• Advanced Infrastructure: Initial phase of 64MW, scalable to 200MW, featuring liquid cooling and LEED certification for energy efficiency.
• Enhanced Connectivity: Proximity to subsea cable links ensures superior local and international connectivity.
• TM’s Data Centers: TM operates seven data centers across Malaysia, with key locations in Klang Valley and Johor.
• Nxera’s Expansion: Nxera, backed by Singtel and KKR, is developing additional AI-ready data centers, increasing its capacity to over 200MW in the next three years.
• This partnership marks a significant step forward in enhancing Malaysia’s data infrastructure, positioning the country as a key player in the regional digital economy.

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Three UK gains energy efficiency at base stations with Ericsson

Three UK has reached a significant milestone in network sustainability through the deployment of next-generation AI-powered hardware and software solutions from Ericsson. Over the past 18 months, Three UK has collaborated with Ericsson to enhance network energy performance using industry-leading energy-efficient radios and advanced AI and data analytics.

In late 2023, Three UK became one of the first major UK operators to deploy Ericsson’s award-winning dual-band Radio 4490, which is 25% lighter and consumes less power than previous models. This technology simplifies site access and expedites upgrades. Additionally, Three UK has implemented software features that reduce power consumption during low traffic hours, leveraging advanced machine learning, passive cooling, and power-saving functionalities. These radios autonomously switch off components when inactive and reactivate them in microseconds for service requests.

Key Points:

• Three UK deploys Ericsson’s energy-efficient dual-band Radio 4490, reducing power consumption and site weight.
• Software features implemented to lower power use during low traffic hours with AI and machine learning.
• Advanced radios autonomously manage 4G and 5G networks, enhancing efficiency.
• Partnership with Ericsson improves network energy efficiency by up to 70% at selected sites, while reducing CO2 emissions.

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