OIF advances CEI-224G-Linear project

OIF has launched a new CEI-224G-Linear project built on the approach of CEI-112G-Linear in terms of specification methodology. It will support 224G full linear optical modules for next-gen applications (e.g., Ethernet, Ultra Ethernet Consortium (UEC), Artificial Intelligence/Machine Learning [AI/ML]) with low power, cost/complexity and latency. The TP1/TP1a and TP4/TP4a electrical specifications will enable up to 224G full linear optical modules for Linear Pluggable Optics (LPO), co-packaged optics (CPO) and Near Package Optics (NPO), supporting next-generation application requirements.

“The CEI-224G-Linear project will represent significant progress in our technological capabilities, weaving the precision of CEI-112G-Linear with groundbreaking innovations,” said Mike Li, OIF Board Member and Intel. “By enabling 224G full linear optical modules and leveraging the advanced 224G DSP SERDES architecture and technology, this initiative is poised to redefine the landscapes of Ethernet, UEC and AI/ML applications. As we embrace lower power, cost and latency, this project is a giant step forward in next-generation computing and connectivity driven by AI/ML.”

 

At its Q2 Technical and Market Awareness & Education (MA&E) Committees meeting, held May 7-9 in Athens, Greece, the OIF also launched a Common Electrical I/O (CEI) CEI-224G-Linear project and the publication of two Common Management Interface Specification (CMIS) white papers.

Additionally, the Physical Layer User Group (PLUG) Working Group released a new system vendor requirements document for Energy Efficient Interfaces (EEI).

Common Management Interface Specification (CMIS) White Paper on Management of Smart Optical Modules

• This white paper explores how the DWDM functions, parameters and operational aspects of “smart” optical pluggable modules can be handled more efficiently to address various challenges. It introduces an alternative control paradigm for optical modules that decouples optical layer control from packet layer control and from host software and packet controller software development and outlines the pros and cons of this approach. This paradigm is called “host independent management,” enabling advanced capabilities of smart optical modules via additional management methods. The white paper is available for download here.

CMIS-Based Out-of-Band Messaging for Link Training

• This white paper provides background on link training and a proposed message catalog by which any transmit SerDes can be trained initially (or tuned adaptively while in service) based on the needs of the corresponding receive SerDes, with the help of message exchange.It promotes out-of-band (OOB) messaging via the ubiquitous CMIS management link as a flexible solution for exchanging link training messages. The technical specifications of the messaging facility and the representation of the messages will be defined in a CMIS-LT supplement. Potential CMIS-LT applications could include CEI-112G Very Short Reach (VSR), Extra Short Reach (XSR), XSR+, and Medium Reach (MR), IEEE 802.3 AUI C2M links, Fibre Channel, InfiniBand, Optical Transport Network (OTN), etc. Download the white paper here.

System Vendor Requirements Document for Energy Efficient Interfaces

• In today’s fast-paced technological landscape, where data processing and communication demands for AI continue to soar, pursuing energy-efficient solutions is critical. This requirements document for EEI is a direct result of engaging with end users to understand their needs and expectations. It seeks to prioritize applications and establish fundamental criteria for the next generation of energy-efficient electrical and optical link projects and specifications.

“OIF’s commitment to interoperability standards and tackling technological challenges was evident at the Q2 meeting,” said Nathan Tracy, OIF President, and TE Connectivity. “The high attendance, start of the CEI-224G-Linear project, CMIS white papers, and the vendor requirements document for EEI, alongside David Moor’s insightful presentation on advanced transceiver design, underscore our leadership in promoting industry-wide collaboration and innovation.”

The event was further highlighted by guest speaker David Moor, a representative from ETH Zürich and the FLEX-SCALE consortium. Moor discussed the development of an optical digital-to-analog converter (oDAC) supporting Tbps+ data rates with lower power per bit than conventional modulation methods. According to Moor, this design utilizes currently available electronics and photonic devices and is well suited to support high-capacity transport with improved power efficiency.

https://www.oiforum.com/

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Cignal AI: 400 and 800GbE module shipments jump more than 25% QoQ

Hyperscale network operator demand drove purchases of 400GbE and 800GbE datacom and 400ZR telecom optical modules to record levels, according to the latest Optical Components Report from research firm Cignal AI. Well over 3 million high-speed datacom modules were shipped this quarter in support of AI cluster interconnect and traditional computing applications.

“800GbE vendor shipments have yet to match demand, though nearly as many 800GbE modules shipped in 1Q24 as in all of 2023,” said Scott Wilkinson, Lead Analyst at Cignal AI. “While some vendors have reported that lead times are coming down, the demand for 400GbE and 800GbE modules remains exceptionally strong and we anticipate that datacom segment revenue will double in 2024.”

Additional 1Q24 Optical Component Report Findings:

Spending on Datacom optical components was up more than 90% YoY as AI applications of 400GbE and 800GbE optical modules for AI applications drove demand to record levels.

Combined unit shipments of 400GbE and 800GbE Datacom modules across all SR/DR/FR/LR specifications jumped over 25% QoQ. Innolight led all vendors in shipments of Datacom modules.

Telecom optical module shipment growth was concentrated in 400G coherent pluggables, which were up more than 35% YoY. Marvell and Acacia experienced strong shipment growth.

Outside of pluggable coherent, shipments of Telecom components declined YoY, with segment revenue dropping -26% YoY.

The coherent module market size declined to under $5 billion in 2023 but it will grow in 2024 and is expected to approach $10 billion in 2028.

https://cignal.ai/

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Alphawave Semi tapes out multi-protocol I/O connectivity chiplet

Alphawave Semi has announced the successful tape-out of the industry’s first off-the-shelf multi-protocol I/O connectivity chiplet, utilizing TSMC’s 7nm process. The chiplet combines Alphawave Semi’s customizable connectivity IP, custom silicon, and advanced packaging capabilities. The 7nm multi-standard I/O chiplet boasts a comprehensive IP portfolio compliant with Ethernet, PCIe, CXL, and UCIe (Universal Chiplet Interconnect Express) Revision 1.1 standards.

The new chiplet delivers total bandwidth of up to 1.6 Tbps, supporting up to 16 lanes of multi-standard PHY with silicon-proven PCIe 6.0, CXL 3.x, and 800G Ethernet in various mixed operating modes. This development also lays the groundwork for a robust and open chiplet ecosystem, crucial for accelerating connectivity in high-performance AI systems through UCIe as a die-to-die connectivity subsystem. Alphawave Semi recently showcased an industry-first live demo of its 24 Gbps UCIe silicon platform at the Chiplet Summit 2024 in Santa Clara, CA.

Key Points:

Industry First: Successful tape-out of the first off-the-shelf multi-protocol I/O connectivity chiplet on TSMC's 7nm process.

Advanced Capabilities: Integrates flexible and customizable connectivity IP, custom silicon, and advanced packaging.

High Bandwidth: Delivers up to 1.6 Tbps total bandwidth, supporting 16 lanes of multi-standard PHY.

Standards Compliance: Compliant with Ethernet, PCIe, CXL, and UCIe Revision 1.1 standards.

AI System Connectivity: Enhances connectivity for high-performance AI systems using UCIe as a die-to-die connectivity subsystem.

Live Demo: Showcased a 24 Gbps UCIe silicon platform at Chiplet Summit 2024.

Customer Benefits: Offers flexibility and scalability for hyperscalers and datacenter infrastructure through mix-and-match high-performance custom SoCs.

Collaboration with TSMC: Demonstrates the use of TSMC’s 3DFabric™ ecosystem to integrate advanced interfaces.

https://awavesemi.com/press-release/alphawave-semi-tapes-out-industry-first-multi-protocol-i-o-connectivity-chiplet-for-high-performance-compute-and-ai-infrastructure/

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O-RAN ALLIANCE Global PlugFest Spring 2024

 The O-RAN ALLIANCE (O-RAN) hosted its eighth PlugFest highlighting achievements in five themes:

O-RAN Energy Consumption, Efficiency and Savings Testing:

• Participating labs successfully tested O-RAN energy saving use cases in different network conditions, helping to optimize RAN Total Cost of Ownership (TCO) and overall sustainability of mobile network operations.

Demonstrate consistent and repeatable open fronthaul testing in multiple labs:

• Several PlugFest hosts partnered to prove the ability to achieve consistent testing results in independent labs, ensuring testing reliability across labs and regions and supporting certification of O-RAN based products.

Open Fronthaul Transport Testing with multiple O-RUs:

• Building on previous O-RAN PlugFests, hosts and participants of the Spring 2024 PlugFest successfully extended the number of multi-vendor interoperable configurations in different setups and conditions, broadening the offer of O-RAN solutions for mobile operators.

O-RAN System Testing with Layer 1 Acceleration:

• The PlugFest verified readiness to automatically deploy and configure Layer 1 accelerators to allow their efficient testing in different network configurations.

O-RAN E2E Deployment Templates, DevOps, and Test Automation:

• Focusing on increasing efficiency of O-RAN network deployments, PlugFest participants demonstrated automation of testing in different areas including testbed setup, security testing, rApps/xApps and RIC testing, utilizing CI/CD processes, and application of the same automation in different labs.

O-RAN Global PlugFest Spring 2024, co-hosted by 20 operators, OTICs, and academic and research institutions, was conducted from February to May 2024 in 18 labs across Asia, Europe, and North America. The PlugFest had 86 participating companies or institutions, some of which participated in more than one venue.

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Deutsche Telekom offers 5G mmWave for industrial customers

Following successful trials, Deutsche Telekom has now commercially launched private 5G using the  26 gigahertz (GHz) band. In a landmark trial at Berlin's Werner-von-Siemens Centre for Industry and Science, autonomous machines and robots at Ger4tech Mechatronik Center were networked using a 5G router supporting both the 3.7 GHz industrial spectrum and mmWave spectrum. The trial showcased mmWave’s low latency of three to four milliseconds RTT and impressive data rates exceeding 4 Gbps download and 2 Gbps upload, underlining its potential for data-intensive manufacturing applications. This advancement is powered by Telit Cinterion, a global IoT solutions provider.

DT says the commercial rollout of 5G mmWave allows industries to leverage this technology for various applications, especially in AI-driven data analysis. Machines can upload vast amounts of data to the cloud, enhancing operations within 5G campus networks. Characterized by short-range coverage but high bandwidth and speeds, 5G mmWave is poised to revolutionize wireless communication and imaging, particularly in autonomous vehicles and the manufacturing sector. The 26 GHz spectrum, allocated exclusively by Germany's Federal Network Agency, is currently designated for local applications, highlighting its specialized use.

Key Points:

• First Trial and Commercial Offering: Deutsche Telekom successfully trialed and launched 5G mmWave at 26 GHz for industrial customers.
• High Performance: Achieved low latency (3-4 ms RTT) and high data rates (4 Gbps download, 2 Gbps upload) in trials.
• Enabled by the global IoT solutions provider, Telit Cinterion.
• Industrial Applications: Ideal for AI data analysis, autonomous vehicles, and data-intensive manufacturing applications.

https://www.telekom.com/en/media/media-information/archive/5g-mmwave-for-industrial-customers-in-germany-1068180

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T-Mobile wins 10-Year, $2.67 billion contract with U.S. Navy

The U.S. Department of the Navy selected T-Mobile as part of the $2.67 billion Spiral 4 contract. This new contract will give all Department of Defense agencies the ability to place orders for wireless services and equipment from T-Mobile for the next ten years.

The multiple-award contract includes voice, data, fixed wireless solutions, Internet of Things and mobility management solutions. It will help ensure robust and reliable connectivity for government activities — from mission critical communications to network solutions that serve military personnel and federal civilian agencies.

T-Mobile also introduced Government Internet, a 5G fixed wireless solution that can function as the main internet connection or as unlimited backup, enhancing reliability and support for critical communications. T-Mobile and 3rd Eye Technologies are making it easier for government agencies to stay compliant with federal message archiving laws with a ready-to-use solution that securely captures and stores SMS and MMS message logs. And in the future, government agencies could leverage T-Mobile’s partnership with SpaceX, which aims to merge T-Mobile's network with Starlink’s satellite capabilities with the goal to provide groundbreaking, near-universal connectivity.

"The Spiral 4 contract award is a testament to T-Mobile’s leading 5G network and to our focus on building solutions that meet the critical needs of our government customers,” said David Bezzant, Vice President of Sales, T-Mobile for Government. “With a cutting-edge product portfolio, a proven track record and a clear vision for the future, we’re ready to take government innovation to the next level. It's an honor to serve those who serve this Nation.”

https://www.t-mobile.com/business/government

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RENATER picks Nokia for data center deployments in Paris

RENATER, the National Research and Education Network in France responsible for deploying and managing national, as well as some regional, network infrastructure for research and education, selected the full Nokia Data Center Fabric solution for its two data centers in Paris. IMS Networks, a leading French network and cybersecurity managed services provider, is supporting the deployment. 

The deployment in in RENATER’s two data centers will include 7220 IXRs for leaf, spine and border leaf routers powered by Nokia that run on an open, extensible and resilient SR Linux Network Operating System (NOS).

Boris Dintrans, Managing Director at RENATER, said: "We are excited to embark on this journey with Nokia, a company whose name is synonymous with innovation, reliability, and what is increasingly important for our long-term strategy, European digital sovereignty. This new Nokia Data Center Fabric infrastructure will not only support RENATER’s capacity growth but will also allow for the development of new services for our members and users, particularly those operating in AI that require state-of-the-art networks, both inside and outside of data centers for data feeding.”

Sacha Hilic, Chief Executing Officer at IMS Networks, said: “With this new Data Center Fabric project, we are bringing all our technical network expertise to the challenges of resilience and performance of RENATER's critical infrastructures. This underlines our commitment to excellence and our vision of a more connected, secure and innovative digital future.”

Matthieu Bourguignon, Senior Vice President and head of Europe for Network Infrastructure business at Nokia, said: “We are honored to help support RENATER’s transition towards the burgeoning field of AI and the promise it holds for educators and students, across France. Nokia is delighted to partner with IMS Networks with our Data Center Fabric solution, which is a key pillar of the evolution of Network Infrastructure and Data Center markets, dedicated to research, education, and connected territories.”

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Nokia announces 2 management changes

 Nokia appointed Lorna Gibb as Chief People Officer and member of the Group Leadership Team. Prior to this role she served as Vice President, Labor and Employment, being a member of Nokia’s People and Legal & Compliance Leadership Teams. Lorna has over 20 years of experience working in people leadership roles for large scale global businesses in various industries and geographies. Before joining Nokia, she held roles as Global People Director for Skyscanner and People Partner/Director for EasyJet, where she spearheaded cross border organizational and cultural transformation. Lorna will be based in Finland and reports to Nokia’s President and Chief Executive Officer, Pekka Lundmark.

In addition, Ricky Corker, who has served as Nokia’s Chief Customer Experience Officer since 2021, will step down and leave the company on June 28, 2024. Ricky’s departure follows Nokia’s decision to empower its business groups with increased operational autonomy and move into a streamlined operating model, where the Customer Experience organization has been embedded into the business groups from the start of 2024. This change will enable the business groups to better seize growth opportunities with existing and new customers, and diversify faster into enterprise, webscale and government sectors.

“Ricky has been a valued member of Nokia’s leadership team and the Nokia community. He has been with Nokia for over 30 years and held several management positions within the company. I want to thank Ricky for all his contributions to Nokia, not least for helping to drive Nokia’s transformation and building trust with our customers throughout the years. I wish him all the best with his future endeavors,” said Pekka Lundmark.

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Samsung Foundry targets CPO-integrated AI silicon by 2027

Samsung introduced two new advanced semiconductor nodes, SF2Z and SF4U, and unveiled its integrated Samsung AI Solutions platform, leveraging the strengths of its Foundry, Memory, and Advanced Package (AVP) businesses. At its annual Samsung Foundry event in San Jose, California, Samsung executives emphasized the company’s unique ability to company the latest process node, advanced packaging, and high-bandwidth memory (HBM) for customers targeting the latest AI silicon designs.

• The SF2Z, Samsung’s latest 2nm process, features an optimized backside power delivery network (BSPDN) technology. This innovation places power rails on the wafer’s backside to reduce bottlenecks between power and signal lines, enhancing power, performance, and area (PPA) compared to the first-generation SF2 node. The SF2Z process is scheduled for mass production in 2027. Meanwhile, the SF4U is a high-value 4nm variant offering PPA improvements through optical shrinkage, with mass production set for 2025.
• Samsung also confirmed that its preparations for the SF1.4 (1.4nm) process are on track, aiming for mass production in 2027. The company is focusing on material and structural innovations to develop future technologies below 1.4nm.

Additionally, Samsung plans to launch an all-in-one, co-packaged optics (CPO) integrated AI solution in 2027, designed to offer high-performance, low-power semiconductors optimized for AI applications. This initiative is part of Samsung’s broader strategy to provide comprehensive AI solutions.

"At a time when numerous technologies are evolving around AI, the key to its implementation lies in high-performance, low-power semiconductors," said Dr. Siyoung Choi, President and Head of Foundry Business at Samsung Electronics. "Alongside our proven GAA process optimized for AI chips, we plan to introduce integrated, co-packaged optics (CPO) technology for high-speed, low-power data processing, providing our customers with the one-stop AI solutions they need to thrive in this transformative era."

Around 30 partner companies exhibited at booths, further highlighting the dynamic collaboration across the Samsung Foundry ecosystem. 

• Cadence Design Systems has announced a collaboration with Samsung Foundry to advance technology for AI and 3D-IC semiconductor design on Samsung's gate-all-around (GAA) nodes. This partnership aims to enhance development for applications such as AI, automotive, aerospace, hyperscale computing, and mobile. Key achievements include the use of Cadence.AI to reduce leakage power by over 10% on the SF2 GAA platform and the certification of a complete Cadence backside implementation flow for Samsung's SF2 node. This collaboration has led to successful development and validation of a test chip, demonstrating readiness for advanced design implementations.
• Synopsys announced that its AI-driven digital and analog design flows have been certified on Samsung Foundry's SF2 process, with multiple test chip tapeouts. Utilizing the Synopsys.ai™ full-stack EDA suite, these reference flows improve performance, power, and area (PPA), enhance productivity, and speed up analog design migration for Samsung's Gate-All-Around (GAA) process technologies. The certification was achieved through Synopsys' AI-driven design technology co-optimization (DTCO) solution, which provided superior PPA outcomes. These techniques will also be applied to Samsung's upcoming SF1.4 process.
• Samsung Electronics is investing $17 billion in a new semiconductor fabrication facility in Taylor, Texas. The 1.1 million square foot fab will use advanced 3-nanometer process technology and is expected to start production in the second half of 2024. The facility will have a capacity of around 170,000 wafers per month, making it one of the largest and most advanced semiconductor manufacturing facilities in the world. The project is expected to create around 1,800 new jobs in the region.

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NVIDIA Triples LLM Performance with H100 GPUs + Quantum-2 InfiniBand

 NVIDIA has achieved a remarkable milestone by more than tripling the performance on the large language model (LLM) benchmark, based on GPT-3 175B, compared to its record-setting submission from last year. This feat was accomplished using an AI supercomputer featuring 11,616 NVIDIA H100 Tensor Core GPUs, interconnected with NVIDIA Quantum-2 InfiniBand networking. The enhanced performance is attributed to the larger scale—more than triple the 3,584 H100 GPUs used previously—and extensive full-stack engineering improvements.

The scalability of the NVIDIA AI platform with InfiniBand networking, allows for significantly faster training of massive AI models like GPT-3 175B. This advancement translates into substantial business opportunities. For instance, NVIDIA’s recent earnings call highlighted how LLM service providers can achieve a sevenfold return on investment over four years by running the Llama 3 70B model on NVIDIA HGX H200 servers. This assumes a service charge of $0.60 per million tokens, with an HGX H200 server capable of processing 24,000 tokens per second.

The NVIDIA H200 Tensor Core GPU, building on the Hopper architecture, includes 141GB of HBM3 memory and over 40% more memory bandwidth than its predecessor, the H100. In its MLPerf Training debut, the H200 demonstrated up to a 47% performance increase compared to the H100. Additionally, software optimizations have made NVIDIA’s 512 H100 GPU configurations up to 27% faster than last year. This showcases the power of continuous software enhancements in boosting performance, even with the same hardware.

Some highlights:

• AI Supercomputer: 11,616 NVIDIA H100 Tensor Core GPUs connected with NVIDIA Quantum-2 InfiniBand.
• Performance Gains: Tripled LLM benchmark performance over last year’s submission.
• H200 GPU: Features 141GB HBM3 memory and 40% more memory bandwidth than H100.
• Software Optimizations: 512 H100 GPU configurations now 27% faster than a year ago.
• Scalability: GPU count increased from 3,584 to 11,616.
• LLM Service ROI: Potential sevenfold return on investment with Llama 3 70B on HGX H200 servers.
• Stable Diffusion and GNN Training: Up to 80% performance boost for Stable Diffusion v2 and significant gains in GNN training.
• Broad Support: Participation from industry leaders like ASUS, Dell, HPE, Lenovo, and others in NVIDIA’s AI ecosystem.

https://blogs.nvidia.com/blog/mlperf-training-benchmarks/

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Oracle Cloud Infrastructure to provide capacity for OpenAI

OpenAl will extend its Microsoft Azure Al platform using Oracle Cloud Infrastructure (OCI). The agreement will provide additional capacity for OpenAl.

“We are delighted to be working with Microsoft and Oracle. OCI will extend Azure’s platform and enable OpenAI to continue to scale,” said Sam Altman, Chief Executive Officer, OpenAI.

“The race to build the world’s greatest large language model is on, and it is fueling unlimited demand for Oracle’s Gen2 AI infrastructure,” said Larry Ellison, Oracle Chairman and CTO. “Leaders like OpenAI are choosing OCI because it is the world’s fastest and most cost-effective AI infrastructure.”

Oracles notes that its OCI Supercluster can scale up to 64k NVIDIA Blackwell GPUs or GB200 Grace Blackwell Superchips connected by ultra-low-latency RDMA cluster networking and a choice of HPC storage. OCI Compute virtual machines and OCI’s bare metal NVIDIA GPU instances can power applications for generative AI, computer vision, natural language processing, recommendation systems, etc.

https://www.oracle.com/news/

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Google Cloud and Oracle Cloud Infrastructure announce partnership

 Oracle and Google Cloud have announced a partnership to integrate Oracle Cloud Infrastructure (OCI) and Google Cloud technologies. This collaboration will initially allow customers to deploy general-purpose workloads with no cross-cloud data transfer charges in 11 global regions through Google Cloud’s Cross-Cloud Interconnect. Later this year, the partnership will introduce Oracle Database@Google Cloud, offering the highest level of Oracle database and network performance with feature and pricing parity with OCI.

Oracle will manage Oracle database services within Google Cloud data centers globally, starting with North America and Europe. Services like Oracle Exadata Database Service, Oracle Autonomous Database Service, and Oracle Real Application Clusters (RAC) will launch later this year in four regions: US East (Ashburn), US West (Salt Lake City), UK South (London), and Germany Central (Frankfurt). These services will rapidly expand to additional regions worldwide, providing enterprises with robust database solutions directly within Google Cloud.

This partnership will allow customers to deploy workloads across both OCI and Google Cloud regions without incurring cross-cloud data transfer charges. Initially available in 11 regions, including Australia East (Sydney), Australia South East (Melbourne), Brazil East (São Paulo), Canada South East (Montreal), Germany Central (Frankfurt), India West (Mumbai), Japan East (Tokyo), Singapore, Spain Central (Madrid), UK South (London), and US East (Ashburn), the service will expand to more regions over time. This integration provides a low-latency, high-throughput, private connection between the two leading cloud providers, ensuring seamless interoperability and enhanced performance.

Key Points:

• Oracle and Google Cloud are partnering to integrate OCI and Google Cloud technologies.
• The collaboration will initially allow general-purpose workloads with no cross-cloud data transfer charges in 11 global regions.
• Oracle Database@Google Cloud will be introduced later this year, offering high performance and feature parity with OCI.
• Oracle will manage its database services within Google Cloud data centers globally, starting in North America and Europe.
• Oracle Exadata, Autonomous Database, and RAC services will launch in US East, US West, UK South, and Germany Central regions.
• The services will rapidly expand to additional regions worldwide.
• Customers can deploy workloads across both OCI and Google Cloud regions with no cross-cloud data transfer charges.
• The initial 11 regions include locations in Australia, Brazil, Canada, Germany, India, Japan, Singapore, Spain, the UK, and the US.

https://www.oracle.com/news/announcement/oracle-and-google-cloud-announce-groundbreaking-multicloud-partnership-2024-06-11/?source=:so:li:or:awr:ocorp:::&SC=:so:li:or:awr:ocorp:::&pcode=

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MEF and TM Forum to align APIs and service models

MEF and TM Forum announced a joint initiative to align their respective API and product and service models. This collaboration aims to streamline automation for MEF Network-as-a-Service (NaaS) implementations across a global partner ecosystem. The initiative will integrate MEF’s Lifecycle Service Orchestration (LSO) APIs with TM Forum’s Gen5 Open API standards, using Domain Context Specialization (DCS) to support standardized MEF-defined models. The goal is to create a unified, standardized approach that enhances automation within MEF’s NaaS domain by the end of 2025.

MEF NaaS services include a range of on-demand connectivity options such as Carrier Ethernet and IP, application assurance through SD-WAN and E2E network slicing, and cybersecurity capabilities including SASE, SSE, and ZTNA. Additionally, these services extend to multi-cloud environments for multi-access edge computing (MEC) and cloud connectivity. MEF will design its product and service models to conform to TM Forum’s Gen5 API DCS design patterns and governance, ensuring compatibility and streamlined automation.

TM Forum will contribute its suite of automation assets, including the Open Digital Architecture, Gen5 Domain Context Specialization APIs, and the NaaS TMF909 API suite. These assets will provide an abstraction layer that maps NaaS services to network resources regardless of vendor implementation. This collaboration addresses the digital infrastructure sector’s current challenge of proprietary and non-standard API implementations, which hinder scalability and automation.

By standardizing APIs, the initiative aims to reduce market confusion, cut capex and opex costs, and accelerate time to revenue. MEF’s LSO APIs currently facilitate extensive interoperability and automation of business and operational functions among ecosystem partners. With more than 160 service providers adopting MEF APIs and TM Forum’s portfolio of over 80 Open APIs achieving widespread industry adoption, this collaboration is set to advance digital services for enterprises through industry-wide standardization.

Key Points:

• MEF and TM Forum are collaborating to align their API and service models.
• The initiative targets automation for MEF NaaS implementations across a global partner ecosystem.
• MEF will conform its LSO APIs to TM Forum’s Gen5 Open API standards using Domain Context Specialization (DCS).
• TM Forum will provide its Open Digital Architecture, Gen5 Domain Context Specialization APIs, and NaaS TMF909 API suite.
• Standardized APIs will address the issue of non-scalable proprietary implementations.
• MEF and TM Forum’s collaboration will deliver a full API suite for automation by the end of 2025, benefiting over 160 service providers and leveraging TM Forum’s widely adopted Open APIs.

“Enterprises expect the same agility in network services from NaaS that they experience with cloud. MEF’s widely adopted LSO API product and service schemas are crucial to meeting these expectations,” said Pascal Menezes, CTO, MEF. “Our expanded collaboration with TM Forum to align on common APIs and data models empowers service providers to automate the full lifecycle delivery of complex multi-provider NaaS services with the ease, agility and responsiveness businesses expect in the cloud era.”

“True end-to-end automation requires industry-wide collaboration on common specifications to enable automated service delivery across the broader telecommunications ecosystem,” said George Glass, CTO, TM Forum. “Our work with MEF serves as a blueprint for other domains facing similar multi-partner integration challenges as we continue collaborating to drive industry-wide standardization.”

https://www.mef.net/news/mef-and-tm-forum-unify-apis-and-service-models-to-automate-ecosystem-for-mef-naas-services/?utm_campaign=Press%20Releases&utm_content=296653956&utm_medium=social&utm_source=twitter&hss_channel=tw-244834042

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Broadcom posts revenue of $12.5B, up 12% yoy excluding VMware

Broadcom reported revenue of $12,487 million for its second quarter of fiscal year 2024, ended May 5, 2024, provided guidance for its fiscal year 2024 and announced its quarterly dividend.

GAAP net income was $2,121 million for the second quarter, and Non-GAAP diluted EPS was $10.96. Quarterly common stock dividend was $5.25 per share.

Consolidated revenue grew 43% year-over-year to $12.5 billion, including the contribution from VMware, and was up 12% year-over-year, excluding VMware. Adjusted EBITDA increased 31% year-over-year to $7.4 billion," said Kirsten Spears, CFO of Broadcom Inc. "Free cash flow, excluding restructuring and integration in the quarter, was $5.3 billion, up 18% year-over-year. Today we are announcing a ten-for-one forward stock split of Broadcom's common stock, to make ownership of Broadcom stock more accessible to investors and employees."

Broadcom also announced a ten-for-one forward stock split.

https:/www.broadcom.com

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Fortinet to acquire Lacework for Cloud Native Application Protection Platform

Fortinet agreed to acquire Lacework, a start-up based in Mountain View, California specializing in security solutions that offer visibility, threat detection, and compliance across multi-cloud environments. Financial terms were not disclosed.

Lacework offers an AI-powered, Cloud Native Application Protection Platform (CNAPP). It features an agent and agentless architecture for data collection, a homegrown data lake, and a code security offering. The company claims nearly 1,000 customers.

Lacework was founded in 2015 and has attracted over $1.9 billion over 6 rounds of funding from various venture capital firms and investors, including Sutter Hill Ventures, Altimeter Capital, D1 Capital Partners, Google Ventures,Tiger Global Management, Coatue Management, and Dragoneer Investment Group.

Lacework was founded by Vikram Kapoor and Sanjay Kalra. Before co-founding Lacework,  Kapoor was the Chief Architect and Principal Engineer at Bromium, a company specializing in endpoint security solutions. Before Lacework, Kalra was the CEO and Co-founder of Vhayu Technologies, a company that provided financial market data analytics solutions. Vhayu Technologies was later acquired by Thomson Reuters.  T

he CEO of Lacework is Jay Parikh, who before joining Lacework in 2021, he was the Vice President of Engineering and Infrastructure at Facebook, where he oversaw the company’s global engineering and infrastructure teams.

Fortinet said it intends to integrate Lacework’s CNAPP solution into its existing portfolio, forming one of the most comprehensive, full stack AI-driven cloud security platforms available from a single vendor. 

https://www.lacework.com/

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Nokia debuts API Network Exposure Platform

Nokia introduced a new Network Exposure Platform designed to expand and simplify the number of APIs available to operators, their partners, and customer channels to enable the creation of network powered applications for consumer, enterprise, and industrial customers. It will support Linux Foundation CAMARA APIs, TM Forum Open APIs, edge-based APIs, and other APIs for connecting networks securely to a broader B2B digitalization ecosystem.

Nokia Network Exposure Platform (NEP) is the first implementation of the GSMA Operator Platform, a standard that operators look to for operational guidance and reflects the telco industry’s need for solutions that satisfy the requirements of an array of API models.

Nokia NEP complements and seamlessly integrates with Nokia's Network as Code platform with developer portal, which aligns to the GSMA Open Gateway aggregator concept and provides a cloud-based platform to connect and monetize service provider networks with application developers around the world.

Nokia said its NEP expands on and is designed to work closely with Nokia Network Exposure Function (NEF), another API-exposure related solution, which is based on 3GPP specifications. Nokia NEF provides a process for interfacing with well-defined functions in the core network. It also enables API mashups to combine multiple APIs from different core functions into new simplified APIs, which are easier to integrate with partner and customer channels.

For existing Nokia NEF customers, it is possible to upgrade to a combined NEF and NEP solution to simplify their API ecosystem.

Shkumbin Hamiti, Head of Network Monetization Platform, Cloud and Network Services at Nokia, said: “Exposing and simplifying access to 5G and 4G network capabilities for channels connecting developers requires a sustained and collaborative effort by all industry players on a variety of technical fronts. Nokia NEP is another meaningful part in that work of enabling operators to organize, control, and secure the way their networks integrate into developer ecosystems and platforms; and driving choice and flexibility for creating new use cases and value for the end customers.”

https://www.nokia.com/about-us/news/releases/2024/06/11/nokia-introduces-network-exposure-platform-to-expand-and-simplify-network-api-exposure-for-service-providers/

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Vonage and Telstra partner on advanced network APIs

Vonage, a division of Ericsson, and Telstra have signed a memorandum of understanding (MoU) to promote the digitalization of network Application Programming Interfaces (APIs) within Australia’s enterprise sector.

This non-exclusive agreement will integrate Telstra’s network APIs into the Vonage platform, enabling enterprises and developers to harness these network capabilities for creating innovative, advanced applications and improving the customer experience.

The partnership not only supports Telstra’s T25 API leadership goals but also paves the way for new opportunities for Vonage throughout the broader Asia Pacific region.

Vonage and Telstra will collaborate on, and continue investing in, enhancing existing APIs, such as Silent Authentication - a new verification method that provides secure authentication without requiring users to input passwords or verification information.

Telstra and Vonage will also work together to identify new open APIs to bring to market such as slicing, edge computing, fraud and spam protections, and network analytical insights, while exploring the integration of Telstra’s APIs with Vonage’s API platform.

Niklas Heuveldop, Vonage CEO and Head of Business Area Global Communications Platform, Ericsson, says: "By combining Vonage’s API platform, Ericsson’s 5G network capabilities and Telstra’s network APIs, we are providing developers and enterprises with the tools they need to create new, secure, reliable and engaging solutions,”

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Mavenir builds Generative AI Co-Pilot for CSPs

Mavenir introduced an Operations Co-Pilot that uses generative AI (GenAI) to improve service-level agreements (SLAs) and optimize operational efficiency for communications service providers (CSPs). 

Mavenir’s Operations Co-Pilot for RAN Service Assurance (RSA), which was developed in collaboration with NVIDIA and AWS, automates network troubleshooting, enabling mobile network operators to rapidly and accurately anticipate network issues and address detected network impairments before they become critical. The Operations Co-Pilot significantly reduces manual debugging effort, development and maintenance lead times to enhance IT operations, service availability and delivery for increasingly complex mobile networks.

Utilizing the power of GenAI with large language models (LLMs) trained on detailed key performance indicators (KPIs), counters, logs and traces from network infrastructure, Mavenir, together with NVIDIA and AWS, is creating a suite of Operations Co-Pilot solutions that will transform the operations management of telecom networks through intelligent automation. This new framework – built on NVIDIA Tensor Core GPUs and the NVIDIA AI Enterprise software platform for generative AI running on AWS – leverages Mavenir’s Open RAN architecture to provide accessibility into multiple open interfaces that can deliver the data needed to train and optimize domain-specific telecom LLMs.

Mavenir’s Chief Technology and Strategy Officer Bejoy Pankajakshan commented: “Our new Operations Co-Pilot framework has the potential to be a game-changer for operators, delivering a wealth of fault prediction and root cause analysis capabilities with AI-powered accuracy and speed. This industry-first solution is built on the transformative foundation of NVIDIA GPUs operating on AWS and enabled by Mavenir data, which can be accessed via numerous interfaces in the Open RAN and in the Packet Core for complete end-to-end visibility.”

He added: “The three key use cases of Core Dump Analysis, Log Similarity Search feature and Log Anomaly Detection can be used together to maximize the automated efficiency gains. Combining information from these trained LLMs will provide broader and deeper coverage of all fault and anomaly scenarios, enabling very early prediction of potential problems in the network. Moreover, as these solutions evolve, the models have the ability to continuously learn and optimize based on user feedback and iterative training with further logs, KPIs and traces, promising even greater gains.”

https://www.mavenir.com/resources/mavenir-automated-ran-service-assurance-platform-enabled-by-generative-ai/

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JUNO cable linking Japan-US deploys Ciena’s WaveLogic 6

The NTT DATA-led JUNO submarine cable system, which will link Japan and the United States, will deploy Ciena’s GeoMesh Extreme, powered by WaveLogic 6 Extreme (WL6e).

 The 10,000km JUNO cable, which is slated to launch at the end of 2024, will be the highest capacity trans-Pacific cable.

Ciena said the state-of-the-art cable will benefit from its performance-optimized WL6e, enabling 800Gb, 400Gb, and 100Gb services. JUNO will also benefit from Ciena’s Navigator Network Control Suite, which provides operational efficiencies for the cable, simplifying and accelerating planning, provisioning, and assurance workflows. Additionally, Ciena Services will provide submarine-specific automation for installation, spectrum activation, and testing for time savings and improved spectrum optimization. Submarine Line Terminal Equipment technical support will also be provided to maintain the highest network reliability.

“NTT DATA is dedicated to providing reliable global internet infrastructure and Ciena’s industry-leading WaveLogic 6 coherent optical technology will enable JUNO to start strong. We continue to see demands to build our global digital economy, and capacity and network performance are critical pillars to support this rapid growth,” said Yoshio Sato, CEO, Seren.

“Existing Japan-U.S. cables are nearing capacity limits and there is a need to meet the growth of bandwidth-intensive applications associated with AI, cloud-based services, and streaming videos. Powered by WL6e, the JUNO cable, which is the largest trans-Pacific submarine cable system, will be ready to hit new service delivery targets as soon as it launches,” said Thomas Soerenson, Vice President, Global Submarine Solutions, Ciena. 

•  In July 2022, NEC announced a contract to build the JUNO Cable System, which is slated to be the highest capacity transpacific cable when it comes online by the end of 2024. The project is led by Seren Juno Network Co., Ltd., a company established by NTT Ltd Japan Corporation, PC Landing Corp. Mitsui & Co. and JA Mitsui Leasing.
• The JUNO cable will span 10,000 km between Chiba prefecture and Mie prefecture in Japan to California.NEC plans to deploy its newly developed energy efficient repeaters and leading-edge SDM (Space Division Multiplexing) technology. This system will be able to adapt as many as 20 fiber pairs for the first time in a trans-Pacific subsea fiber-optic cable. The cable is expected to provide a maximum capacity of 350 Tbps.

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AWS to launch Taipei Infrastructure Region

Amazon will launch an AWS infrastructure Region in Taiwan by early 2025. 

The new Asia Pacific (Taipei) AWS Region will consist of three Availability Zones at launch, adding to AWS’s existing 105 Availability Zones across 33 geographic regions globally. With today’s announcement, AWS has plans to launch 21 more Availability Zones and seven more AWS Regions in Malaysia, Mexico, New Zealand, the Kingdom of Saudi Arabia, Taiwan, Thailand, and the AWS European Sovereign Cloud. AWS Regions consist of Availability Zones that place infrastructure in separate and distinct geographic locations. Availability Zones are located far enough from each other to support customers’ business continuity, but near enough to provide low latency for high availability applications that use multiple Availability Zones. Each Availability Zone has independent power, cooling, and physical security and is connected through redundant, ultra-low-latency networks. AWS customers focused on high availability can design their applications to run in multiple Availability Zones to achieve even greater fault tolerance.

“AWS is committed to helping customers of all sizes and across all industries accelerate their digital transformation with the highest levels of security and resilience available,” said Prasad Kalyanaraman, vice president of Infrastructure Services at AWS. “The new AWS Region in Taiwan will enable organizations to unlock the full potential of the cloud and build with AWS technologies like compute, storage, databases, analytics, machine learning and artificial intelligence to drive innovation and transform the way businesses and institutions serve their customers. We look forward to helping customers and AWS Partners in Taiwan deliver cloud-enabled applications to accelerate growth, productivity, and innovation with lower latency from data centers located in Taiwan.”

https://aws.amazon.com/about-aws/global-infrastructure

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