#OFC24: 800ZR, 400ZR and OpenZR+ Optics Interoperability

Check out OFC Conference and Exposition 2024 videos here: https://ngi.fyi/ofc24yt

At #OFC24, OIF hosted its latest pluggable coherent optics demonstration, showcasing the latest advancements in 800ZR, 400ZR and ZR+ optics interoperability. The demo highlights include the first public 800ZR multivendor interop; high transmit power, OpenZR+ over a 1000km, multi-span network; OpenROADM/ITU-T over that same network; and 400ZR collocated on the single-span network with 800ZR. Karl Gass, Physical and Link Layer Working Group Optical Vice Chair from OIF, provides some highlights:

- The demonstration of a single span demo with eight channels at 400 ZR and four channels of 800 ZR, showcasing the actual optical spectrum of both the 400 and 800 ZR traffic.

- a multispan demo featuring Raman amplification over 1000 kilometers, with six more channels and one channel of open rodm application.

- The use of new Corning smf28 ultra low LOF fiber in one direction and standard smf28 in the other, with both terminal RMS and a set of equalizer RMS to balance the channels in the middle.

https://youtu.be/9IPF4LSb-tE

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#OFC24:Rethinking Optical Modules for Liquid Immersion in AI Clusters

Check out OFC Conference and Exposition 2024 videos here: https://ngi.fyi/ofc24yt

Many optical components used in data centers, such as transceivers, incorporate free-space gaps in their designs. These gaps enable effective coupling from the laser to the Photonic Integrated Circuit (PIC) and from the PIC to the optical fiber, however, because liquids (including immersion liquids) have a different index of refraction than air, when a traditional optical component is immersed in fluid, the light path is significantly altered, rendering these devices effectively unusable for liquid cooling.

DustPhotonics’ transmit Carmel-8-IMC chip supports an optical assembly with no free-space optics. Inside the chip, lasers are butt-coupled to the PIC and the fiber is also attached directly to the PIC, thus enabling transceiver designs that can be used for both immersion and air cooling.

Ronnen Lovinger, CEO from Dust Photonics, explains:

- The application of immersion cooling for power management in next-generation data centers.

- Dust Photonics' PICs are ready for integration into cutting-edge transceivers for this immersion cooling application

- A live demonstration of their product in collaboration with Amphenol

https://youtu.be/oWQDgSfbGUA

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Dust Photonics raises US$24 million in Series B

Wednesday, February 21, 2024    

DustPhotonics, a start-up based in Modi'in, Israel, raised US$24 million in Series B funding for its silicon photonics technology for data center and AI applications, The oversubscribed funding round was funded by a combination of prominent investors, including new and existing investors such as Sienna Venture Capital, Greenfield Partners, Atreides Management, and Exor Ventures.DustPhotonics said it plans to use the funding to scale production...

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#OFC24: Materials Science, Lasers, All-Optical Switching

#OFC24 was a huge event for Coherent Corp., which made big announcements in material sciences, including new Indium Phosphide capabilities, pushing VCSELs to 200 Gbps per lane and thereby enabling optical transceivers with 1.6 Tbps capacity, and previewing an all-optical switching platform.  Sanjai Parthasarathi, CMO from Coherent, explains:

- The world’s first capability for 6-inch indium phosphide (InP) wafer fabrication, in the company’s Sherman, Texas, and Järfälla, Sweden, wafer fabs.

- The use of advanced materials, including diamond, for cooling applications in AI server pods, which is generating excitement among their customer base.

- The unveiling of their Optical circuit switch, which offers significant cost savings, latency reduction, and power savings, particularly for emerging applications in AI connectivity within the data center.

https://youtu.be/x4MacdEFTKM

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#OFC24: Advanced DFB Laser Arrays for I/O in AI Clusters

 Sivers Photonics is supplying its DFB laser arrays for Ayar Labs’ SuperNova optical interconnect for AI/ML clusters, disaggregated data centers, 6G networks, phased array sensor systems and etc. Anders Storm, CEO from Sivers Semiconductors explains:

- The current lack of communication and insufficient bandwidth between GPUs can be addressed by scaling the number of GPUs and using photons instead of electrons. This approach not only increases the bandwidth by 10x but also reduces electricity usage by the same factor.

- Sivers Semiconductors is partnering with Ayar Labs to demonstrate an eight-array optical interconnects capable of 4 Tbps, scaling to much higher rates

- The company is a promoter member of CW WDM, a forum that has created a standard for how laser sources will work within these systems. The technology is maturing, with new members joining the forum and the use of Indian phosphide lasers proving to be a very effective material for these applications.

https://youtu.be/6dGPDmynlpE

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#OFC24: Big Strides in Optical Transmission with Pluggables

Major strides are achieved this year in optical transmission thanks to new modules operating at high data rates and over greater distances. Coherent is introducing two such products.  Sanjai Parthasarathi, CMO from Coherent, explains:

- The introduction of the 100G ZR QSFP28 digital coherent optics (DCO) transceiver, an industrial temperature unit capable of functioning in outdoor environments, and the 800 GCR qsfp DD dco, boasting one of the highest optical power outputs in the industry.The DSP is paired with an efficient silicon photonics optical front-end and a power-optimized tunable laser, now enhanced to support a wider operating temperature range, resulting in module power consumption of less than 6 W at a case temperature of 85°C

- The introduction of an 800 Gbps coherent transceiver module in QSFP-DD form factor and capable of transmitting over 9000 ps/nm of dispersion, equivalent to approximately 450 km of fiber. This new 800G transceiver uses Coherent’s 140 Gbaud IC-TROSA optical subassembly, which features a high-efficiency indium phosphide modulator and receiver combined with a proprietary embedded wavelength-tunable laser. The Coherent 800G QSFP-DD transceiver has several operating modes that enable it to deliver up to 1000 km of reach at 800 Gbps and up to 2000 km at 400 Gbps in well-designed networks.

https://youtu.be/qGJJuxbHMOo

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Nokia and Vodafone test L4S over an end-to-end PON

Nokia and Vodafone are testing the viability of L4S technology over passive optical networks (PON).

L4S is an acronym for "Low Latency, Low Loss, and Scalable" throughput, a technology standardized by the Internet Engineering Task Force (IETF). It addresses a major cause of high peak latency on the Internet, namely, queuing delays. These delays occur as packets linger in network buffers, such as those in routers and modems, waiting to be sent on.

The L4S networking approach reliably maintains packet queuing delay at almost zero, regardless of the network's load.

The first demonstration of L4S running over PON occurred in Vodafone’s lab in Newbury, U.K. The demonstration was performed on an end-to-end fixed access network built with Nokia technology. It consisted of a broadband network gateway (BNG), a PON optical line terminal (OLT), multiple PON optical network terminals (ONTs) and WiFi access points. The tests showed extremely low and consistent end-to-end latencies when travelling across every element of the network.

In the lab tests, Vodafone and Nokia Bell Labs measured consistent1 latencies of 1.05ms at local Ethernet ports running over a fully congested access network (BNG to ONT), and just 12.1ms when including a fully congested WiFi link as the final connection.

While the Vodafone and Nokia Bell Labs tests were conducted using PON networks, L4S can be implemented over any access technology, wireless or wireline, and applied to any latency-dependent application. In November, Nokia Bell Labs and Hololight, a leading innovator in enterprise XR solutions, created a proof of concept demonstrating how L4S could support multiple simultaneous XR users over the same wireless connection without sacrificing performance.

Azimeh Sefidcon, Head of Network Systems and Security Research, Bell Labs at Nokia, said: “These highly encouraging results show L4S will unshackle any real-time application that would normally be constrained by high latency. Videoconferencing, cloud-gaming, augmented reality and even the remote operations of drones would run flawlessly across the internet, without experiencing any significant queuing delays.”

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Cloudflare acquires Baselime for its cloud-native observability platform

Cloudflare announced its acquisition of Baselime, a start-up specializing in cloud-native observability platforms. Financial terms were not disclosed.

The Baselime platform offers a suite of tools designed to provide deep insights into application performance, errors, and usage patterns, making it an essential resource for developers working in cloud-native environments.

Key Highlights of the Acquisition:

• Enhanced Observability for Serverless Apps: By integrating Baselime's observability technology, Cloudflare is poised to offer visibility into serverless applications, addressing one of the significant challenges in serverless computing.
• Developer-Centric Innovations: The union aims to empower developers with advanced tools for analyzing observability data, adopting OpenTelemetry standards, and extracting actionable insights, facilitated by AI debugging and real-time tracking.
• Commitment to Developer Experience: Cloudflare and Baselime share a vision for simplifying the development process. This acquisition underscores Cloudflare's commitment to providing developers with the necessary tools to build, ship, and troubleshoot applications efficiently.

Cloudflare's CEO, Matthew Prince, emphasized the importance of observability tools in becoming the leading developer platform, stating, "We believe that to be the leading developer platform, having the best observability tools built in is going to be table stakes."

Boris Tane, founder and CEO of Baselime, expressed excitement about the acquisition, highlighting the synergy between Baselime's mission and Cloudflare's ecosystem, "With Cloudflare, we're positioned to deeply integrate into a platform that two million developers trust, enabling them to build, ship, and troubleshoot applications fast."

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#OFC24: Transforming Cloud Interconnects with 800ZR/ZR+

At #OFC24, Lumentum announced significant performance enhancements to its 800ZR+ transceivers, enabling 800ZR+ modules to serve a wider range of applications, including expanded use in metro and regional networks through the ability to interface directly into routers. Additionally, the enhanced performance modes now make 400ZR+ and 600ZR+ operation suitable for true long-haul applications, with OSNR and dispersion tolerance enabling reaches exceeding 2000 km at 400 Gbps.  Marc Stiller, VP of Product Line Management from Lumentum, provides an in-depth explanation:

- Lumentum's newest modules, the 800G ZR+ and 400G high-power ZR+ modules, capable of running over a 400 km optical line system. These modules can plug into various routers and transmit over 2,000 km.

- He demonstrates a live traffic run at 800G, showcasing the simultaneous operation of two 800G channels and three 400G channels through an amplified 400 km length.

- Impressive results of the modules' performance, highlighting their ability to operate over 6,800 Pico seconds per nanometer of dispersion in the fiber 400 km, and their low error rates, indicating the potential for further extension of the links.

https://youtu.be/6KlQiyXlvgE

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#OFC24: Scaling Silicon Photonics to Meet the AI Challenge

Check out OFC Conference and Exposition 2024 videos here: https://ngi.fyi/ofc24yt

Are we underestimating the market size and manufacturing requirements of optical modules needed to AI? Adam Carter, CEO from OpenLight, discusses:

- The increasing demand for high-speed modules in AI will surpass previous industry standards set by data centers, presenting unique challenges for manufacturers.

- To meet this demand, manufacturers will need to scale up and adopt production volumes similar to those seen in the Silicon industry for electronics today.

- OpenLight's strategic partnership with Jabil, a high-volume manufacturer, is a key step towards meeting these new demands. As part of this partnership, OpenLight will provide Jabil with taste test capability and on-wafer burning for their heterogeneous integrated silicon wafers.

https://youtu.be/94MvMnYT4Pw

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##OFC24: Intelligent Re-timers for Linear Pluggable Optics

TeraSignal, a start-up based in Irvine, California, introduced an  intelligent 400G (4x100G) PAM4 modulator driver with digital link training and link monitoring for 800G linear pluggable optical (LPO) modules. The novel modulator driver addresses the limitations of LPO modules, which unlike DSP-based re-timers, have lacked the capabilities for automatic adaptation, digital link monitoring and link training, making them challenging to integrate, interoperate, and deploy efficiently. 

Armond Hairapetian, Founder and CTO from Terasignal, explains:

- The introduction of an intelligent retiree for LPO applications, which eliminates the need for a DSP inside the module

- The transition from Silicon germanium design to CMOS, which not only reduces power but also introduces diagnostic features in the chip, allowing end users to assess link quality and extract vital diagnostic information.

- The implementation of a digital subsampling scope on chip, which enables the capture of the Eye diagram, SNR, and BR of the link, providing end users with precise information about the link's performance and the ability to adjust the transmitter as needed.

https://youtu.be/_MZvbPu_TCI

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#OFC24: Interoperability with LPO & LRO at 800G and 1.6T

Linear receive optics (LRO) and linear drive pluggable optics (LPO) were hot topics at #OFC24.  However, how to overcome the interoperability issue in LPO and LRO systems? New Photonics is introducing a second generation photonic integrated circuit (PIC) with integrated optical equalizer capable of supporting 800G and 1.6T modules. 

Professor Yosef Ben Ezra, CTO & Founder from New Photonics explains:

- The novel solution based on Optical Equalization of channels, which allows for interoperability between different vendors.

- The programmable nature of the Optical equalizer, which can be adjusted to the real Channel, ensuring no latency is introduced into the system.

- The integration of lasers, modulators, and Optical equalizers on the photonic integrated circuit, which dramatically improves the performance of LPO and LRO systems.

https://youtu.be/nagkfk-O4iE

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Lambda secures $500M for its GPU cloud

Lambda, which offers a cloud GPU service powered by NVIDIA, secured a special purpose financing vehicle of up to $500 million to fund the expansion of its on-demand cloud offering.

The special asset-based loan is secured by the GPUs and supported by their cash flow generation. 

The financing was led by Macquarie Group  with participation from Industrial Development Funding, and follows Lambda’s $320 million Series C funding round in February 2024.

“This first-of-its-kind financing vehicle unlocks a new way to fund the deployment of tens of thousands of NVIDIA GPUs,” said Mitesh Agrawal, Lambda COO. “Lambda’s mission is to continue to build the best AI compute platform in the world, and this structure lets our AI startup customers build the next generation of iconic companies on top of our cloud without the barrier of expensive multi-year contracts.”

The company cites explosive demand for its Lambda Cloud, which has more than 100,000 customer sign-ups. This financing supports NVIDIA GPU deployments for AI developers training, fine-tuning, and inferencing generative AI models in Lambda Cloud. Lambda also supports NVIDIA AI Enterprise to deliver a complete stack for generative AI developers.

“As demand for computing picks up pace alongside the widespread integration of LLMs and generative AI, we’re happy to support Lambda as they deliver what AI engineers need,” said Don Trent, Senior Managing Director in Macquarie Group’s Commodities and Global Markets business. “We’re proud to partner with Lambda on such a pioneering effort and support the buildout of GPU cloud infrastructure that will transform industries and businesses alike.”

https://lambdalabs.com/

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Vertiv launches 360AI suite of power and cooling systems for data centers

Vertiv announced a new 360AI portfolio of high-density data center infrastructure solutions to support the higher cooling and power requirements of the accelerated computing IT stack. 

The new Vertiv 360AI suite is supports the power and cooling needs of artificial intelligence (AI) workloads of varying scales. This suite encompasses a range of products and services including power supplies, cooling systems, enclosures, lifecycle services, and digital management tools. 

The company says its suite is versatile, catering to a wide range of applications from AI test pilots and edge inferencing to large-scale AI data centers. The initial offerings are capable of handling up to 100kW per rack. Vertiv 360AI employs a variety of cooling strategies such as air-to-liquid, liquid-to-air, liquid-to-liquid, and liquid-to-refrigerant cooling to ensure optimal performance across different scenarios.

An important feature of Vertiv 360AI is its modular approach, which includes prefabricated IT, cooling, and power modules. These can be integrated and scaled according to specific needs, providing a flexible foundation for both current and future infrastructure demands. For environments lacking chilled water facilities, Vertiv 360AI solutions can incorporate indoor split chillers, offering a refrigerant-based liquid cooling option.

In addition to AI-specific solutions, Vertiv also presents an extensive selection of cooling and power technologies suited for high-performance computing (HPC) environments. This includes rear door heat exchangers, direct-to-chip liquid cooling, coolant distribution units (CDUs), free-cooling chillers, and modular data center solutions based on chilled water systems. Power infrastructure components such as uninterruptible power supplies (UPS) with lithium-ion batteries, busbar systems, switchgear, and battery energy storage systems (BESS) are also available to support microgrid applications, ensuring a comprehensive ecosystem for AI and HPC workloads.

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Airspan enters Chapter 11, raises new funding, and delists

Airspan Networks confirmed that its stock has been delisted (NYSE American: MIMO). The company does not intend to  appeal NYSE Regulation’s determination.

Last week, Airspan and its U.S. subsidiaries  filed voluntary prepackaged Chapter 11 proceedings in the United States Bankruptcy Court for the District of Delaware. The company has entered into a Restructuring Support Agreement with certain funds managed by Fortress Investment Group and several of its other key financial stakeholders that will provide up to $95 million of new equity financing and the elimination of all the company’s existing funded debt.

“This support agreement is the culmination of a strategic review process, and we believe it is the best path forward for Airspan to continue providing exceptional services and products to our customers worldwide,” said Glenn Laxdal, President and Chief Executive Officer at Airspan. “By strengthening the Company financially with new capital and a debt-free balance sheet, we will be better positioned to execute our plan to capitalize on the significant growth opportunities across our public and private network markets. We appreciate the support and engagement of all of our stakeholders as we build Airspan for the future.”

https://airspan.com/

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#OFC24: Moving Data at the Speed of AI

 Check out OFC Conference and Exposition 2024 videos here: https://ngi.fyi/ofc24yt

Ayar Labs is unveiling the second generation of SuperNova, which powers the company’s TeraPHY optical I/O chiplet and enables huge leaps in bi-directional bandwidth. Mark Wade, CEO and Co-founder from Ayar Labs, discusses:

- The unveiling of Ayar Labs' latest hardware, achieving full bandwidth between two chips of 4 terabits per second.

- The power of this technology to transmit massive amounts of bandwidth with low latency, high bandwidth densities, and excellent power efficiency, all while maintaining signal integrity.

- The ongoing ecosystem work, including optically connected FPGAs with Intel, high-density optical connector work with Teramount, and the management of optical connections with Corning around glass interposers and optical interposers with glass shuffles.

https://youtu.be/AEP2_pZQDrY

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Intel and Ayar Labs demo 4 Tbps optically-connected FPGA

Monday, August 28, 2023    

Intel and Ayar Labs are showcasing a 4 Tbps optical FPGA with Ayar Labs’ in-package optical I/O at this week’s HOT CHIPS 2023 event at Stanford Univertsity.The demo shows a 4 Tbps bidirectional communication between two optically enabled Intel FPGAs using Ayar Labs TeraPHY optical I/O chiplets. Data generated from each FPGA is optically transmitted from one board and received and verified on the other board.https://ayarlabs.com/hot-chi...

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#OFC24: Big Power Savings with 800G Linear Receive Optics

Energy consumption is one of the biggest challenges with GenAI, so reducing the power consumed by optical modules, while increasing data rates, is a top priority. Bill Brennan, President and CEO from Credo, shares some insights:

- He discusses the importance of connectivity and the shift towards faster lane rates and denser connections in the face of AI advancements.

- Brennan introduces the innovative solution of Linear Receive Optics, which effectively halves the power of the DSP function in optical modules while maintaining industry standards.

- He highlights the significant energy savings achieved with this approach, allowing for more energy to be redirected towards compute, thereby enhancing the value of the cluster.

https://youtu.be/GhIq9Qv08bY

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SK hynix to build $3.8B advanced packaging fab in Indiana

SK hynix plans to invest an estimated $3.87 billion to build a state-of-the-art advanced packaging fabrication and R&D facility for AI products in West Lafayette, Indiana.

SK hynix is the world's leading producer of High-Bandwidth Memory (HBM) chips. The new facility will be home to an advanced semiconductor production line that will mass-produce next-generation HBM, the highest-performing Dynamic Random Access Memory (DRAM) chips, which are the critical components of graphic processing units that train AI systems such as ChatGPT. The company plans to begin mass production in the second half of 2028, while the new facility will also develop future generations of chips and house an advanced packaging R&D line.

At the event, officials from each party including Governor of Indiana Eric Holcomb, Senator Todd Young, Director of the White House Office of Science and Technology Policy Arati Prabhakar, Assistant Secretary of Commerce Arun Venkataraman, Secretary of Commerce State of Indiana David Rosenberg, Purdue University President Mung Chiang, Chairman of Purdue Research Foundation Mitch Daniels, Mayor of city of West Lafayette Erin Easter, Ambassador of the Republic of Korea to the United States Hyundong Cho, Consul General of the Republic of Korea in Chicago Junghan Kim, SK vice chairman Jeong Joon Yu, SK hynix CEO Kwak Noh-Jung and SK hynix Head of Package & Test Choi Woojin, participated.

"SK hynix is the global pioneer and dominant market leader in memory chips for AI," Purdue University President Mung Chiang said. "This transformational investment reflects our state and university's tremendous strength in semiconductors, hardware AI, and hard tech corridor. It is also a monumental moment for completing the supply chain of digital economy in our country through chips advanced packaging. Located at Purdue Research Park, the largest facility of its kind at a U.S. university will grow and succeed through innovation."

"We are excited to become the first in the industry to build a state-of-the-art advanced packaging facility for AI products in the United States that will help strengthen supply-chain resilience and develop a local semiconductor ecosystem," said SK hynix CEO Kwak Noh-Jung. "With this new facility, we hope to advance our goal of providing AI memory chips with unmatched capabilities, serving the needs of our customers."

SK hynix is collaborating with Purdue University, one of the leading research institutions in the U.S., on plans for future R&D projects. These projects include work on advanced packaging and heterogeneous integration with Purdue's Birck Nanotechnology Center and other research institutes and industry partners. They also hope to collaborate on a project related to memory-centric solutions and architecture for the generative AI era, specifically system-level memory design and in/near-memory computing.

The company also plans to collaborate with Purdue University and Ivy Tech Community College to develop training programs and interdisciplinary degree curricula that will cultivate a high-tech workforce and build a reliable pipeline of new talent.

Separately, SK hynix will also proceed with Korean domestic investments as planned. The company has been working to prepare the site for the Yongin Semiconductor Cluster where it will invest 120 trillion won to build production facilities. The company plans to break ground on the first fab in March of 2025, with plans for completion in early 2027. It will also build a mini fab, a facility with equipment for 300mm wafer processing, to test semiconductor materials, components and equipment.

https://news.skhynix.com/sk-hynix-signs-investment-agreement-of-advanced-chip-packaging-with-indiana/

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Zayo expands its nationwide 400G backbone

Zayo announced its latest round of critical infrastructure upgrades, including its newest long-haul dark fiber route connecting Columbus to Pittsburgh and a highly sought-after 400G-enabled wavelength route connecting Washington, D.C. and Atlanta. The new long-haul dark fiber route connecting Columbus to Pittsburgh is carrier-diverse, 100% underground, and built with a high fiber count for maximum scalability and uptime availability.

Zayo has also added four additional routes to its 400G network—currently the largest 400G network in North America—in key markets including:

• Indianapolis to Columbus
• Cut Bank, Mont. to Calgary
• New Orleans to Ponchatoula, La.
• Grand Rapids, Mich. to Lansing, Mich.

Zayo is also expanding its leading IP network with the addition of 27 critical IP points of presence (PoPs) and 400G peering locations across North America. The addition of new IP PoPs and peering locations to Zayo’s tier-1 IP network guarantees scalable and dependable capacity availability. Built on Zayo’s wholly-owned fiber backbone, Zayo’s IP network also ensures enhanced reliability and performance with reduced latency to support the high-speed connectivity these applications require.

“While technology innovations like AI and next-gen cloud surge ahead, continued investment in network infrastructure to support this demand is critical. As the largest independent network, Zayo is in a prime position to bring network infrastructure up to par with today’s innovation, and ensure we and our customers are ready for what’s next,” said Bill Long, Chief Product & Strategy Officer at Zayo. “Our latest infrastructure expansions demonstrate our continuous efforts to provide our customers with unique, diverse, low-latency routes — where they need it today and where we know they'll need it tomorrow.”

https://www.zayo.com

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Casa Systems disbands under Chapter 11

Citing "a significant decline in revenue and profits due in large part to industry-wide downward capital investment and procurement trends in the cable and telco markets," Casa Systems filed  voluntary petitions for debt relief under Chapter 11 of the Bankruptcy Code in the U.S. Bankruptcy Court for the District of Delaware. 

As part of this process, the company agreed to sell its 5G Mobile Core and RAN businesses to Lumine Group and have asked the court for approval to complete the transaction by the end of April.

Additionally, Casa Systems secured a stalking horse bid from an affiliate of Vecima for our Cable and Virtual Broadband Network Gateway (vBNG) business, and anticipate that an auction process will follow, in which other parties will have the opportunity to submit bids for the business.

Casa Systems belives this sale process is the best and most viable path forward to maximize value, preserve jobs and minimize disruption for its customers.

https://www.casasaleprocess.com

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AT&T commits $3 billion to closing Digital Divide

AT&T is committing an additional $3 billion by 2030 to help close the digital divide, bringing the company's total commitment to $5 billion since 2021. 

This cumulative commitment includes an ambitious goal to help 25 million people get and stay connected to affordable, high-speed internet access throughout this decade. Working to close the digital divide is the linchpin of AT&T's mission to leave no one behind when it comes to online opportunity. This commitment is a pillar of the work the company does to help build this country's digital infrastructure.

"Connectivity is critical for success and prosperity in America today. Whether it's a first-generation high school graduate applying for college, a veteran accessing telehealth services, or a grandparent connecting with their family thousands of miles away — we want to help unlock greater possibility for the millions of people who remain unconnected," said AT&T CEO John Stankey. "The pace of innovation and the global economy aren't waiting on anyone, and we're committed to bringing connectivity and digital literacy in reach for all Americans." 

Since 2021, nearly 5 million Americans have benefited from our discounted internet service and digital literacy programs.

AT&T continues to expand its network of Connected Learning Centers (CLC) in communities across the country that are equipped with high-speed internet connections and computers supplied by Dell.

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